ASMT-FJ30-AB000

ASMT-FJ30 Mini Surface Mount AF LED Data Sheet Description Features Avago Technologies’ ASMT-FJ30-AB000 is a miniature SMT (Surface Mount Technology) dome lamp uses an untinted, non-diffused lens to provide a high luminous intensity within a narrow radiation pattern. The device environmental friendly green product of unique PCB based, namely Miniature Surface Mount AF LED. • Smooth, Consistent Narrow Radiation Pattern This lamp type LED utilizes Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The color available for this SMT Lamp package is 612nm Orange. • Clear, Non-diffused Epoxy This narrow angle SMT lamp package is designed for applications that require long distance illumination and narrow beam pattern such as auxiliary flash for auto-focus function in digital still camera etc. This miniature package is suitable for applications that have constraint in design area. In order to facilitate pick and place operation, this SMT Lamp is shipped in tape and reel, with 1500 units per reel. Eye Safety This package is compatible with Pb-free reflow soldering process. • 18° View Angle • 3.2 L x 2.4 X 2.4H mm Package Dimension • Good Intensity Output • Compatible with 2x Solder Reflow Applications • Camera These orange Miniature Surface Mount AF Lamps are use for camera application. The LEDs have lenses, which focus the beam at about 10mm from the front of the lens, from where the beam diverges relatively slowly. If the LEDs were placed in a product, they would create a Class 1 LED to IEC/EN 60825-1 (2001) at the recommended input current. As long as no collimating optics are added to the optical path. CAUTION: ASMT-FJ30 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions 1.80 P.C. BOARD MOLDING BODY (LENS) 2.40 Ø1.80 0.55 POLARITY LED DICE SOLDERING TERMINAL Anode MASK 3.20 2.20 0.55 0.50 2.40 1.00 0.55 Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1mm unless otherwise specified. Device Selection Guide Color Part Number Min. Iv (cd) Test Current (mA) Dice Technology Orange ASMT-FJ30 5.5 20 AlInGaP Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. Iv Tolerance = ±15% Absolute Maximum Ratings at TA = 25°C Parameter ASMT-FJ30 Units DC Forward Current 50 mA Power Dissipation 125 mW LED Junction Temperature 95 °C Operating Temperature Range -40 to 85 °C Storage Temperature Range -40 to 85 °C Soldering Temperature refer reflow soldering profile (Figure 6) Optical Characteristics at TA = 25°C Peak Wavelength λpeak (nm) Dominant Wavelength λd [2] (nm) Viewing Angle 2 θ1/2­[4] (Degrees) Part Number Color Typ. Typ. Typ. ASMT-FJ30 Orange 612 605 18 Notes: 1. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) [1] Color Orange Typ. Max. Min. Typ. 20mA 2.1 2.4 5 300 2.5 RELATIVE LUMINOUS INTENSITY NORMALIZED AT 20MA RELATIVE INTENSITY 1 0.8 0.6 0.4 0.2 0 380 430 480 530 580 630 WAVELENGTH-nm 680 730 RELATIVE INTENSITY 40 30 20 10 1 1.5 FORWARD VOLTAGE-V Figure 3. Forward Current vs Forward Voltage RRENT - mA 2 2.5 1 0.5 0 10 20 30 40 DC FORWARD CURRENT-mA 50 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -75 -60 -45 -30 -15 0 15 30 OFF AXIS ANGLE (°) 45 60 Figure 4. Vertical Radiation Pattern 60 10 to 30 SEC. 50 40 255 - 260 °C E FORWARD CURRENT-mA 50 0.5 1.5 60 Figure 2. Luminous Intensity vs Forward Current 60 0 2 0 780 Figure 1. Relative Intensity Vs Wavelength  Thermal Resistance RθJ-PIN (°C/W) Test Current 1.2 0 Reverse Breakdown, VR (Volts) @ IR = 100μA 75 90 0 0.5 1 1.5 FORWARD VOLTAGE-V 2 -90 -75 -60 -45 -30 -15 0 15 30 OFF AXIS ANGLE (°) 2.5 45 60 75 90 10 to 30 SEC. 50 40 TEMPERATURE MAXIMUM FORWARD CURRENT - mA 60 30 20 217 °C 200 °C 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 10 0 255 - 260 °C 3 °C/SEC. MAX. 0 20 40 60 AMBIENT TEMPERATURE - °C TIME 80 (Acc. to J-STD-020C) Figure 6. Recommended reflow soldering Figure 5. Forward Current vs Forward Voltage USER FEED DIRECTION 2.8 0.11 CATHODE SIDE 4.2 0.615 1.1 0.043 PRINTED LABEL Figure 7. Recommended soldering land pattern  Figure 8. Reeling Orientations Figure 9. Reel Dimensions 2.00±0.05 (.079±.002) 2.00±0.05 (.079±.002) 4.00 (.157±.004) 3.50±0.05 (.138±.002) 8.00+0.30 -.10 0.315+0.12 -.004 0.23±0.03 (.009±.001) 4.00 (.157±.004) ANODE )Typ .039 0( Ø1.0 2.65±0.10 (.104±.004) User Feed Direction Figure 10. Tape Dimensions  1.55±0.05 (.061±.002) END START THERE SHALL BE A MINIMUM OF 600 mm (23.6 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. THERE SHALL BE A MINIMUM OF 600 mm (23.6 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.1 mm (±0.004 in.)unless otherwise specified. Figure 11. Tape leader and trailer dimensions. Color Bin Category Iv Bin Category Orange Bin ID Min (nm) Max (nm) Bin ID Min (cd) Max(cd) 1 597.0 600.0 B 5.5 7.0 2 600.0 603.0 C 7.0 9.0 3 603.0 606.0 D 9.0 11.5 4 606.0 609.0 E 11.5 15.0 5 609.0 612.0 Iv Tolerance = ±15% Tolerance = ±1nm For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0996EN - January 28, 2008