ASMT-Jx3x
3 W Mini Power LED Light Source
Data Sheet
Description
Features
The 3 W Mini Power LED Light Source is a high performance energy efficient device that can handle high
thermal and high driving current. Option with electrically
isolated metal slug is also available.
• Available in Deep Red, Red, Red Orange, Amber, Green,
Blue, and Royal Blue
• Small footprint and low profile
• Symmetrical outline
• Energy efficient
• Direct heat transfer from metal slug to motherboard
• Compatible with reflow soldering process
• High current operation
• Long operation life
• Wide viewing angle
• Silicone encapsulation
• Non-ESD sensitive (threshold > 16 kV)
• MSL 1 products
The low profile package design and ultra small footprint is
suitable for a wide variety of applications especially where
space and height is a constraint.
The package is compatible with reflow soldering process.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel.
Applications
• Sign backlight
• Safety, exit and emergency sign lightings
• Specialty lighting such as task lighting and reading
lights
• Retail display
• Commercial lighting
• Accent or marker lightings, strip or step lightings
• Portable lightings, bicycle head lamp, torch lights.
• Decorative lighting
• Architectural lighting
• Pathway lighting
• Street lighting
• Pedestrian street lighting
• Tunnel lighting
• Horticulture
CAUTION: Customer is advised to keep the LEDs in the MBB when not in use as prolonged exposure to
environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering.
Package Dimensions
5.0
4.0
Ø
3.7
4.0
0.7
1.0
0.8
Lens
Cathode Mark
0.3
1.85
Anode Lead NC
NC
NC
Metal Slug
0.65
Body
NC
Cathode Lead
0.60
Ø 1.70
Figure 1. ASMT-Jx3x package outline drawing
Notes:
1. All dimensions in millimeters.
2. Metal slug is connected to anode for electrically non-isolated option.
3. Tolerance is ± 0.1 mm, unless otherwise specified.
4. Terminal finish: Ag plating.
5. Corresponding NC (No Connection) leads adjacent to anode and cathode leads can be electrically short.
2
Part Numbering System
ASMT- J x1 3 x2 – x3 x4 x5 x6 x7
Packaging Option
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AlInGaP
Heat Sink
0 – Electrically Non-isolated
1 – Electrically Isolated
Color
D
R
H
A
G
B
L
– Deep Red
– Red
– Red Orange
– Amber
– Green
– Blue
– Royal Blue
Note:
1. For selection details, see page 10.
Device Selection Guide (TJ = 25 °C)
Luminous Flux (lm) /
Radiometric Power (mW), ΦV [1,2]
Dice
Technology
Electrically
Isolated
Metal Slug
Part Number
Color
Min.
Typ.
Max.
Test Current
(mA)
ASMT-JD30-ALN01
Deep Red
175 mW
240 mW
355 mW
350
AllnGaP
No
ASMT-JR30-AST01
Red
51.7
58.0
87.4
350
AllnGaP
No
ASMT-JH30-ARS01
Red Orange
39.8
48.0
67.2
350
AllnGaP
No
ASMT-JA30-ARS01
Amber
39.8
48.0
67.2
350
AllnGaP
No
ASMT-JG31-NUW01
Green
87.4
110.0
129.5
350
InGaN
Yes
ASMT-JB31-NNP01
Blue
18.1
25.0
30.6
350
InGaN
Yes
ASMT-JL31-NRS01
Royal Blue
515 mW
600 mW
685.0 mW
350
InGaN
Yes
Notes:
1. ΦV is the total luminous flux / radiometric power output as measured with an integrating sphere at 25 ms mono pulse condition.
2. Flux tolerance is ±10%.
3
Absolute Maximum Ratings
Parameter
AllnGaP
InGaN
Units
DC Forward Current [1]
700
700
mA
Peak Pulsing Current
1500
2400
mA
Power Dissipation
1820
2730
mW
LED Junction Temperature
125
135
°C
Operating Metal Slug Temperature Range at 350 mA
-40 to +115
-40 to +120
°C
Operating Metal Slug Temperature Range at 700 mA
-40 to +100
-40 to +105
°C
Storage Temperature Range
-40 to +120
-40 to + 120
°C
Soldering Temperature
See Figure 24
Reverse Voltage [2]
Not recommended
Notes:
1. Derate linearly based on Figure 10 for AlInGaP and Figure 20 for InGaN.
2. Not designed for reverse-bias operation.
Optical Characteristics at 350 mA (TJ = 25 °C)
Peak
Wavelength,
λPEAK (nm)
Dominant
Wavelength,
λD [1] (nm)
Viewing Angle,
2θ½ [2] (°)
Luminous Efficiency
(lm/W)
Part Number
Color
Typ.
Typ.
Typ.
Typ.
ASMT-JD30-ALN01
Deep Red
660
640
165
Not Applicable
ASMT-JR30-AST01
Red
635
625
165
79
ASMT-JH30-ARS01
Red Orange
625
615
165
65
ASMT-JA30-ARS01
Amber
598
590
165
65
ASMT-JG31-NUW01
Green
519
525
165
98
ASMT-JB31-NNP01
Blue
454
460
165
22
ASMT-JL31-NRS01
Royal Blue
450
455
165
Not Applicable
Electrical Characteristic at 350 mA (TJ = 25 °C)
Forward Voltage,
VF (V)
Thermal Resistance,
Rθj-ms(°C/W) [1]
Dice Type
Min.
Typ
Max.
Typ.
AllnGaP
1.7
2.1
2.3
9
InGaN
2.8
3.2
3.5
9
Note:
1. Rθj-ms is Thermal Resistance from LED junction to metal slug.
Optical and Electrical Characteristic at 700 mA (TJ = 25 °C)
Luminous Flux (lm) /
Radiometric Power (mW), φV
Forward Voltage,
VF (V)
Part Number
Color
Typ.
Typ.
ASMT-JD30-ALN01
Deep Red
480 mW
2.4
ASMT-JR30-AST01
Red
104.0
2.4
ASMT-JH30-ARS01
Red Orange
86.0
2.4
ASMT-JA30-ARS01
Amber
86.0
2.4
ASMT-JG31-NUW01
Green
176.0
3.6
ASMT-JB31-NNP01
Blue
43.0
3.6
ASMT-JL31-NRS01
Royal Blue
1020 mW
3.6
4
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
AMBER
RED ORANGE
RED
DEEP RED
RELATIVE LUMINOUS FLUX/
RADIOMETRIC POWER
(NORMALIZED AT 350 mA)
RELATIVE INTENSITY
AlInGaP
520 535 550 565 580 595 610 625 640 655 670 685 700
WAVELENGTH - nm
700
650
600
550
500
450
400
350
300
250
200
150
100
50
0
0
0.5
1
1.5
FORWARD VOLTAGE - V
2
2.5
Figure 4. Forward Current vs. Forward Voltage
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
1.60
D=
0.05
0.10
0.25
0.50
1.00
1.40
1.20
1.00
Ip - PULSE CURRENT - A
Ip - PULSE CURRENT - A
100
200
300
400
500
DC FORWARD CURRENT - mA
600
700
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
90
1.80
1.60
0.80
0.60
0.40
D=
0.20
0.001
0.01
tp
tp
T
0.1
1
Figure 6. Maximum pulse current vs. ambient temperature.
Derated based on TA = 25 °C, RθJ-A = 30 °C/W.
10
1.40
D=
tp
T
1.20
tp
IF
T
D=
0.05
0.10
0.25
0.50
1.00
1.00
0.80
0.60
0.40
IF
T
tp - PULSE DURATION - sec
5
0
Figure 5. Radiation Pattern Deep Red, Red, Red Orange and Amber
1.80
0.00
0.00001 0.0001
OTHERS
DEEP RED
Figure 3. Relative Luminous Flux/ Radiometric Power vs. Mono Pulse Current
NORMALIZED INTENSITY
FORWARD CURRENT - mA
Figure 2. Relative Intensity vs. Wavelength for Deep Red, Red, Red Orange
and Amber
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.20
100
0.00
0.00001 0.0001
0.001
0.01
0.1
1
tp - PULSE DURATION - sec
Figure 7. Maximum pulse current vs. ambient temperature.
Derated based on TA = 85 °C, RθJ-A = 30 °C/W.
10
100
120.0
110.0
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
25
0.05
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 25°C)
DEEP RED
RED
RED-ORANGE
AMBER
50
75
100
JUNCTION TEMPERATURE,TJ - °C
-0.20
-0.25
-0.30
-0.35
800
700
700
MAX ALLOWABLE DC CURRENT - mA
MAX ALLOWABLE DC CURRENT - mA
-0.15
800
600
500
400
RθJ-A = 20°C/W
RθJ-A = 25°C/W
RθJ-A = 30°C/W
300
200
100
0
20
40
60
80
100
AMBIENT TEMPERATURE, TA - °C
RED
25
50
75
100
JUNCTION TEMPERATURE,TJ - °C
125
Figure 9. Forward Voltage Shift vs. Junction Temperature
120
Figure 10. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RθJ-A = 20 °C/W, 25 °C/W and 30 °C/W.
6
-0.10
-0.40
125
Figure 8. Relative Light Output vs. Junction Temperature
0
DEEP RED
RED ORANGE
AMBER
0.00
-0.05
140
600
500
400
RθJ-MS = 9°C/W
300
200
100
0
0
20
40
60
80
100
METAL SLUG TEMPERATURE, TMS - °C
120
Figure 11. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125 °C, RθJ-MS = 9 °C/W.
140
1
0.9
GREEN
0.8
BLUE
ROYAL BLUE
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
380 405 430 455 480 505 530 555 580 605 630
WAVELENGTH - nm
700
650
600
550
500
450
400
350
300
250
200
150
100
50
0
0
0.5
1
1.5
2
2.5
FORWARD VOLTAGE - V
Figure 14. Forward Current vs. Forward Voltage
7
3
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
100
200
300
400
500
MONO PULSE CURRENT - mA
600
700
Figure 13. Relative Luminous Flux vs. Mono Pulse Current
NORMALIZED INTENSITY
FORWARD CURRENT - mA
Figure 12. Relative Intensity vs. Wavelength for Blue and Green
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
RELATIVE INTENSITY
InGaN
3.5
4
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
ROYAL BLUE
GREEN
BLUE
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
Figure 15. Radiation Pattern for Royal Blue, Blue and Green
60
90
D=
tp
tp
T
IF
T
IP - PULSE CURRENT - A
IP - PULSE CURRENT - A
3.00
2.80
2.60
2.40
2.20
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.00001 0.0001
D=
0.05
0.10
0.25
0.50
1.00
0.001
0.01
0.1
1
10
100
3.00
2.80
2.60
2.40
2.20
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.00001 0.0001
D=
0.001
1
10
100
0.05
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25 °C)
0.00
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 25 °C)
BLUE
GREEN
ROYAL BLUE
25
50
75
100
125
JUNCTION TEMPERATURE, TJ -°C
-0.05
-0.10
-0.15
-0.25
-0.30
800
700
700
600
500
RθJ-A = 20°C/W
RθJ-A = 25°C/W
RθJ-A = 30°C/W
300
200
100
0
20
40
60
80
100
AMBIENT TEMPERATURE, TA - °C
25
50
75
100
125
JUNCTION TEMPERATURE, TJ -°C
150
Figure 19. Forward Voltage Shift vs. Junction Temperature
800
400
BLUE
ROYAL BLUE
GREEN
-0.20
-0.35
150
MAX ALLOWABLE DC CURRENT - mA
MAX ALLOWABLE DC CURRENT - mA
0.1
Figure 17. Maximum pulse current vs. ambient temperature.
Derated based on TA = 85 °C, RθJ-A = 30 °C/W
Figure 18. Relative Light Output vs. Junction Temperature
120
Figure 20. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 135°C, RθJ-A = 20°C/W, 25°C/W and 30 °C/W
8
0.01
tp - PULSE DURATION - sec
Figure 16. Maximum pulse current vs. ambient temperature.
Derated based on TA = 25 °C, RθJ-A = 30 °C/W
0
IF
T
D=
0.05
0.10
0.25
0.50
1.00
tp - PULSE DURATION - sec
120.0
110.0
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
tp
tp
T
140
600
500
400
RθJ-MS = 9°C/W
300
200
100
0
0
20
40
60
80
100
METAL SLUG TEMPERATURE, TMS - °C
120
Figure 21. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 135 °C, RθJ-MS = 9 °C/W
140
0.80
0.85
Solder
Pad
ø1.90
1.75
3.50
5.20
Slug
Indepdent
∅3.2
1.30
Solder
Pad
Figure 22. Recommended soldering land pattern
Figure 23. Recommended pick and place
nozzle tip. Inner diameter = 3.2 mm
TEMPERATURE
10 - 30 SEC.
217 °C
200 °C
255 - 260 °C
3°C/SEC. MAX.
6°C/SEC. MAX.
150 °C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
(Acc. to J-STD-020C)
Figure 24. Recommended Reflow Soldering Profile
Note: For detailed information on reflow soldering of Avago surface
mount LEDs, refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components.
9
Option Selection Details
Flux Bin Limit [x4, x5]
Color
Bin ID
Luminous Flux (lm)/
Radiometric Power (mW)
at 350 mA
Min.
Max.
Blue
M
N
13.9
18.1
18.1
23.5
P
23.5
30.6
Q
30.6
39.8
R
S
39.8
51.7
51.7
67.2
T
67.2
87.4
U
87.4
99.6
V
99.6
113.6
W
113.6
129.5
L
175.0
225.0
M
225.0
275.0
N
275.0
355.0
355.0
435.0
ASMT-J x1 3 x2 – x3 x4 x5 x6 x7
x4 – Minimum Flux Bin Selection
x5 – Maximum Flux Bin Selection
x6 – Color Bin Selection
x7 – Packaging Option
Color Bin Selection (x6)
Individual reel will contain parts from one color bin
selection only.
Selection
Bin ID
0
Full Distribution
Z
A and B
Y
B and C
W
C and D
V
D and E
Q
A, B and C
Other Colors
Deep Red
and
Royal Blue
P
B, C and D
P
N
C, D and E
Q
435.0
515.0
M
D, E and F
R
515.0
595.0
S
595.0
685.0
Tolerance for each bin limit is ± 10%
Color Bin Limits
Dominant Wavelength (nm)
at 350 mA
Peak Wavelength (nm)
at 350 mA
Color
Bin ID
Min.
Max.
Color
Bin ID
Min.
Max.
Red
–
620.0
635.0
Deep Red
-
650.0
670.0
Red Orange
–
610.0
620.0
Royal Blue
C
440.0
445.0
Amber
B
587.0
589.5
D
445.0
450.0
C
589.5
592.0
E
450.0
455.0
D
592.0
594.5
F
455.0
460.0
E
594.5
597.0
A
455.0
460.0
B
460.0
465.0
C
465.0
470.0
D
470.0
475.0
A
515.0
520.0
B
520.0
525.0
C
525.0
530.0
Example
D
530.0
535.0
ASMT-JG31-NST01
Blue
Green
Tolerance: ±1 nm
Packaging Option [x7]
Selection
Option
1
Tape and Reel
10
Tolerance: ± 2 nm
ASMT-JG31-Nxxxx – Green, InGaN, Electrically isolated
Heat Sink
X4 = S
– Minimum Flux Bin S
X5 = T
– Maximum Flux Bin T
X6 = 0
– Full Distribution
X7 = 1
– Tape and Reel Option
Tape and Reel – Option 1
ø1.5 ±0.1
4.00 ±.10
0.25 ±0.02
2.00 ±.05
8.00 ±.10
ø1.5 ±0.25
8°
2.01 ±0.1
0.25 ±0.02
2.05 ±.10
4.15 ±.10
5.25 ±.10
12.00 +.30
.10
5.50 ±.05
5°
1.75 ±0.01
Figure 25. Carrier Tape Dimensions
13.2 ±.5
16.0 ±.5
3 ±0.5
ø21.0 ±0.5
ø13.1 ±0.5
ø10
178 ±1
ø60 ±0.5
4 ±0.5
5 ±0.5
Notes:
1. Empty component pockets sealed with top cover tape.
2. 250 or 500 pieces per reel.
3. Drawing not to scale.
4. All dimensions are in millimeters.
Figure 26. Reel dimensions
11
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 27. Reeling Orientation
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
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Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-1941EN - December 1, 2014