ASMT-JN33-NVW01

ASMT-Jx33 3W Mini Power LED Light Source Data Sheet Description Features The 3W Mini Power LED Light Source is a high performance energy efficient device which delivers high flux output and possesses high color rendering index. This device can handle high driving current. Option with electrically isolated metal slug is also available. • High Color Rendering Index (CRI) The White Mini Power LED is available in the range of color temperature from 2700K to 10000K. • Energy efficient The low profile package design and ultra small footprint is suitable for a wide variety of applications especially where space and height is a constraint. • Compatible with reflow soldering process The package is compatible with reflow soldering process. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. • Available in Cool White, Neutral White and Warm White • Small footprint and low profile • Symmetrical outline • Direct heat transfer from metal slug to mother board • High current operation • Long operation life • Wide viewing angle • Silicone encapsulation • Non-ESD sensitive (threshold > 16kV) • MSL 1 products Applications • Retail lighting • Display case lighting • Security lighting • Commercial lighting such as window decorative lighting in shopping malls • Architectural lighting CAUTION: Customer is advised to keep the LEDs in the MBB when not in use as prolonged exposure to environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering. Package Dimensions 5.0 4.0 .7 4.0 0.7 1.0 0.8 Ø3 Lens Cathode Mark 0.3 1.85 Anode Lead NC NC NC Body Metal Slug NC Cathode Lead 0.65 0.60 Ø 1.70 Figure 1. ASMT-Jx33 package outline drawing 2 Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1 mm unless otherwise specified. 3. Terminal finish: Ag plating. 4. Corresponding NC (No Connection) leads adjacent to anode and cathode leads can be electrically short. Part Numbering System ASMT- J x1 33 – N x2 x3 x4 x5 Packaging Option Color Bin Selection Maximum Flux Bin Selection Minimum Flux Bin Selection Color W – Cool White N – Neutral White Y – Warm White Note: 1. Please refer to Page 7 for selection details. Device Selection Guide (TJ = 25°C) Luminous Flux (Im), ΦV[1,2] Max. Test Current (mA) Dice Technology Electrically Isolated Metal Slug 100.0 113.6 350 InGaN Yes 99.6 110.0 129.5 350 InGaN Yes 87.4 100.0 113.6 350 InGaN Yes 99.6 110.0 129.5 350 InGaN Yes   Part Number   Color Min. Typ. ASMT-JW33-NUV01 Cool White 87.4 ASMT-JW33-NVW01 ASMT-JN33-NUV01 Neutral White ASMT-JN33-NVW01 ASMT-JY33-NRS01 39.8 60.0 67.2 350 InGaN Yes ASMT-JY33-NSTJ1 Warm White 51.7 70.0 87.4 350 InGaN Yes ASMT-JY33-NTU01 67.2 90.0 99.6 350 InGaN Yes Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is ±10% Absolute Maximum Ratings Parameter InGaN Units DC Forward Current [1] 700 mA Peak Pulsing Current 2400 mA Power Dissipation 2730 mW LED Junction Temperature 135 °C Operating Metal Slug Temperature Range at 350 mA -40 to +120 °C Operating Metal Slug Temperature Range at 700 mA -40 to +105 °C Storage Temperature Range -40 to + 120 °C Soldering Temperature Refer to Figure 14 Reverse Voltage [2] Not recommended Notes: 1. Derate linearly based on Figure 10. 2. Not designed for reverse bias operation. 3 Optical Characteristics at 350 mA (TJ = 25°C) Correlated Color Temperature, CCT (Kelvin) Part Number Viewing Angle, 2θ½ [1] (°) Luminous Efficiency (lm/W) Color Rendering Index, CRI Color Min. Max. Typ. Typ. Typ. Cool White 4500 10000 140 89 80 4500 10000 140 98 80 3500 4500 140 89 80 3500 4500 140 98 80 2700 3500 140 54 90 ASMT-JY33-NSTJ1 2850 3250 140 63 85 ASMT-JY33-NTU01 2700 3500 140 80 85 ASMT-JW33-NUV01 ASMT-JW33-NVW01 ASMT-JN33-NUV01 Neutral White ASMT-JN33-NVW01 ASMT-JY33-NRS01 Warm White Note: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristic at 350 mA (TJ = 25°C) Forward Voltage, VF (Volts) Thermal Resistance, RθJ-MS(°C/W) [1] Dice Type Min. Typ Max. Typ. InGaN 2.8 3.2 3.5 9 Note: 1. RθJ-MS is Thermal Resistance from LED junction to metal slug. Optical and Electrical Characteristic at 700 mA (TJ = 25°C) Luminous Flux (lm), φV Forward Voltage, VF (Volts) Color Typ. Typ. Cool White 178.0 3.6 196.0 3.6 178.0 3.6 196.0 3.6 107.0 3.6 ASMT-JY33-NSTJ1 125.0 3.6 ASMT-JY33-NTU01 160.0 3.6 Part Number ASMT-JW33-NUV01 ASMT-JW33-NVW01 ASMT-JN33-NUV01 Neutral White ASMT-JN33-NVW01 ASMT-JY33-NRS01 4 Warm White RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 WARM WHITE NEUTRAL WHITE COOL WHITE IP - PULSE CURRENT - A 1.5 2 2.5 FORWARD VOLTAGE - V Figure 4. Forward Current vs. Forward Voltage 0 0.5 1 3 3.5 3.00 2.80 tp t 2.60 D= p 2.40 T T 2.20 2.00 1.80 D= 0.05 1.60 0.10 1.40 0.25 1.20 0.50 1.00 1.00 0.80 0.60 0.40 0.20 0.00 0.00001 0.0001 0.001 0.01 0.1 1 10 tp - PULSE DURATION - sec 4 100 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 0 100 600 700 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern for Cool White, Warm White and Neutral White IF Figure 6. Maximum pulse current vs. pulse duration. Derated based on TA = 25°C, RθJ-A = 30°C/W. 5 200 300 400 500 MONO PULSE CURRENT - mA Figure 3. Relative Luminous Flux vs. Mono Pulse Current NORMALIZED INTENSITY 480 IP - PULSE CURRENT - A FORWARD CURRENT - mA 530 580 630 680 730 780 WAVELENGTH - nm Figure 2. Relative Intensity vs. Wavelength for Cool White and Warm White 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 430 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -60 3.00 2.80 tp t 2.60 D= p 2.40 T T 2.20 2.00 D= 1.80 0.05 1.60 0.10 0.25 1.40 0.50 1.20 1.00 1.00 0.80 0.60 0.40 0.20 0.00 0.00001 0.0001 0.001 0.01 0.1 1 10 tp - PULSE DURATION - sec IF Figure 7. Maximum pulse current vs. pulse duration. Derated based on TA = 85°C, RθJ-A = 30°C/W. 100 0.05 RELATIVE LIGHT OUTPUT - % FORWARD VOLTAGE SHIFT - V 0.10 0.00 - 0.05 - 0.10 - 0.15 - 0.20 - 0.25 25 50 75 100 125 JUNCTION TEMPERATURE, TJ -°C 150 800 800 700 700 600 500 400 RθJ-A = 20°C/W RθJ-A = 25°C/W RθJ-A = 30°C/W 300 200 100 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - °C 120 140 Figure 10. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125°C, RθJ-A = 20°C/W, 25°C/W and 30°C/W 6 25 50 75 100 125 JUNCTION TEMPERATURE, TJ -°C 150 Figure 9. Relative Light Output vs. Junction Temperature. MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA Figure 8. Forward Voltage Shift vs. Junction Temperature 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 600 500 400 RθJ-MS = 9°C/W 300 200 100 0 0 20 40 60 80 100 120 METAL SLUG TEMPERATURE, TMS - °C 140 Figure 11. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125°C, RθJ-MS = 9°C/W 0.80 0.85 Solder Pad 1.75 3.50 Slug Indepdent 5.20 ø1.90 ø3.2 1.30 Solder Pad Figure 12. Recommended soldering land pattern Figure 13. Recommended pick and place nozzle tip. Inner diameter = 3.2 mm TEMPERATURE 10 - 30 SEC. 217°C 200°C 255 - 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 14. Recommended Reflow Soldering Profile Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 7 Option Selection Details Flux Bin Limit [x2, x3] ASMT-J x1 33 – N x2 x3 x4 x5 x2 – Minimum Flux Bin Selection x3 – Maximum Flux Bin Selection x4 – Color Bin Selection x5 – Packaging Option Luminous Flux (lm) at 350 mA Bin ID Min. Max. Q 30.6 39.8 R 39.8 51.7 S 51.7 67.2 T 67.2 87.4 U 87.4 99.6 V 99.6 113.6 W 113.6 129.5 Tolerance for each bin limits is ±10% Color Bin Selection [x4] Individual reel will contain parts from one color bin selection only. Cool White Warm White Selection Bin ID Selection Bin ID 0 Full Distribution 0 Full Distribution H UN, VN, U0 and V0 H M1, N1, M0 and N0 J WN, VN, W0 and V0 J P1, N1, P0 and N0 K XN, WN, X0 and W0 K Q1, P1, Q0 and P0 P Y0 Neutral White Selection Bin ID 0 Full Distribution G S1, R1, S0 and R0 H TN, S1, T0 and S0 8 0.48 0.42 0.40 0.44 5000K UN 5650K U0 VN 6300K WN 0.36 0.34 V0 7000K 10000K XN X0 W0 BLACK BODY CURVE Y0 0.30 Y-COORDINATE Y-COORDINATE 0.38 0.32 0.46 4500K 0.28 0.30 0.32 0.34 X-COORDINATE 0.36 0.38 0.40 0.44 Y-COORDINATE 0.42 3800K 4100K 4500K TN S1 S0 3500K R1 R0 T0 0.36 BLACK BODY CURVE 0.34 0.32 0.34 0.36 0.38 0.40 X-COORDINATE Figure 17. Color bin structure for Neutral White 9 0.40 P1 P0 N1 N0 M1 M0 Q0 0.38 BLACK BODY CURVE 0.32 0.38 0.40 0.42 0.44 0.46 X-COORDINATE Figure 16. Color bin structure for Warm White 0.46 0.38 Q1 3050K 2850K 2700K 0.34 Figure 15. Color bin Structure for Cool White 0.40 3250K 0.36 0.28 0.26 0.26 3500K 0.42 0.42 0.44 0.48 0.50 Color Bin Limits Warm White Color Limits (Chromaticity Coordinates) 0.347 0.372 Bin M1 x y 0.460 0.430 0.453 0.416 0.467 0.419 0.473 0.432 0.344 0.344 0.346 0.359 Bin M0 x y 0.453 0.416 0.444 0.399 0.459 0.403 0.467 0.419 0.329 0.357 0.347 0.372 0.346 0.359 Bin N1 x y 0.444 0.426 0.438 0.412 0.453 0.416 0.460 0.430 0.329 0.331 0.329 0.345 0.346 0.359 0.344 0.344 Bin N0 x y 0.438 0.412 0.429 0.394 0.444 0.399 0.453 0.416 x y 0.329 0.345 0.316 0.333 0.315 0.344 0.329 0.357 Bin P1 x y 0.430 0.421 0.424 0.407 0.438 0.412 0.444 0.426 Bin W0 x y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.333 Bin P0 x y 0.424 0.407 0.416 0.389 0.429 0.394 0.438 0.412 Bin XN x y 0.305 0.322 0.303 0.333 0.315 0.344 0.316 0.333 Bin Q1 x y 0.414 0.414 0.409 0.400 0.424 0.407 0.430 0.421 Bin X0 x y 0.308 0.311 0.305 0.322 0.316 0.333 0.317 0.320 Bin Q0 x y 0.409 0.400 0.402 0.382 0.416 0.389 0.424 0.407 Bin YO x y 0.308 0.311 0.283 0.284 0.274 0.301 0.303 0.333 Tolerance: ±0.01 Cool White Color Limits (Chromaticity Coordinates) Bin UN x y 0.365 0.386 0.362 0.372 0.346 0.359 Bin U0 x y 0.362 0.372 0.360 0.357 Bin VN x y 0.329 0.345 Bin V0 x y Bin WN Tolerance: ±0.01 Packaging Option [x5] Neutral White Color Limits (Chromaticity Coordinates) Bin R1 x y 0.414 0.414 0.409 0.400 0.392 0.391 0.397 0.406 Bin R0 x y 0.392 0.391 0.387 0.374 0.402 0.382 0.409 0.400 Bin S1 x y 0.397 0.406 0.392 0.391 0.378 0.382 0.382 0.397 Example Bin S0 x y 0.392 0.391 0.387 0.374 0.374 0.366 0.378 0.382 ASMT-JW33-NSU01 Bin TN x y 0.382 0.397 0.378 0.382 0.362 0.372 0.365 0.386 Bin T0 x y 0.378 0.382 0.374 0.366 0.360 0.357 0.362 0.372 Tolerance: ±0.01 10 Selection Option 1 Tape and Reel ASMT-JW33-Nxxxx – Cool White, InGaN, Electrically isolated Heat Sink X2 = S – Minimum Flux Bin S X3 = U – Maximum Flux Bin U X4 = 0 – Full Distribution X5 = 1 – Tape and Reel Option Tape and Reel – Option 1 ø1.5 ±0.1 4.00 ±.10 0.25 ±0.02 2.00 ±.05 8.00 ±.10 ø1.5 ±0.25 8° 2.01 ±0.1 0.25 ±0.02 2.05 ±.10 4.15 ±.10 5.25 ±.10 12.00 +.30 .10 5.50 ±.05 5° 1.75 ±0.01 Figure 18. Carrier Tape Dimensions 13.2 ±.5 16.0 ±.5 3 ±0.5 ø21.0 ±0.5 ø13.1 ±0.5 ø10 178 ±1 ø60 ±0.5 4 ±0.5 5 ±0.5 Notes: 1. Empty component pockets sealed with top cover tape. 2. 250 or 500 pieces per reel. 3. Drawing not to scale. 4. All dimensions are in millimeters. Figure 19. Reel dimensions 11 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 20. Reeling Orientation DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-2430EN - December 1, 2014