ASMT-MW22-NNP00

ASMT-Mx22 / ASMT-MxE2 Moonstone 3 W High Brightness Power LED Light Source Data Sheet Description Features The Moonstone 3W High Brightness Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. • Available in Cool White & Warm White color The Cool White Power LED is available in various color temperature ranging from 4000 K to 10000 K and Warm White Power LED ranging from 2600 K to 4000 K. • High current operation The low profile package design is suitable for a wide variety of applications especially where height is a constraint. • Silicone encapsulation The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. Applications • Sign backlight • Safety, exit and emergency sign lightings • Specialty lighting such as task lighting and reading lights • Retail display • Commercial lighting • Accent or marker lightings, strip or step lightings • Portable lightings, bicycle head lamp, torch lights. • Decorative lighting • Architectural lighting • Pathway lighting • Street lighting • Pedestrian street lighting • Tunnel lighting • Energy efficient • Exposed pad for excellent heat transfer • Suitable for reflow soldering process • Long operation life • Wide viewing angle • Non-ESD sensitive (threshold > 16 kV) • MSL 4 products Specifications • InGaN Technology • 3.5 V (max) at 350 mA • 110° viewing angle Package Dimensions 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 Metal Slug 1.27 3 LED Ø 5.26 10.60 8.50 Ø 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Figure 1. ASMT-Mx22 / ASMT-MxE2 package outline drawing. Notes: 1. All dimensions are in millimeters. 2. Unless otherwise stated, the tolerance for dimension is ±0.1 mm. 3. Metal slug is connected to anode for electrically non-isolated option. 2 + − ZENER Part Numbering System ASMT – M x1 x2 x3 – N x4 x5 x6 x7 Packaging Option Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Heat Sink 2 – Electrically Isolated Silicone Type 2 – Non-diffused E – Diffused Color W – Cool White Y – Warm White Note: 1. Please refer to Page 8 for selection details. Device Selection Guide (TJ = 25° C) Max. Test Current (mA) Die Technology Electrically Isolated Metal Slug 140 350 InGaN Yes 100 140 350 InGaN Yes 110 115 140 350 InGaN Yes 95 98 140 350 InGaN Yes Luminous Flux, Φv [1,2] (lm)   Part Number   Color Min. Typ. ASMT-MW22-NNP00 Cool White 110 120 ASMT-MY22-NMP00 Warm White 95 ASMT-MWE2-NNP00 Cool White Diffused ASMT-MYE2-NMP00 Warm White Diffused Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at 25 ms mono pulse condition. 2. Flux tolerance is ±10%. 3 Absolute Maximum Ratings Parameter ASMT- Mx22 / ASMT-MxE2 Units DC Forward Current [1] 700 mA Peak Pulsing Current 2400 mA Power Dissipation 2730 mW LED Junction Temperature 125 °C Operating Metal Slug Temperature Range at 350 mA -40 to +110 °C Operating Metal Slug Temperature Range at 700 mA -40 to +95 °C Storage Temperature Range -40 to +120 °C Soldering Temperature Refer to Figure 11 Reverse Voltage [2] Not recommended Note: 1. Derate linearly based on Figure 9. 2. Not designed for reverse bias operation. Optical Characteristics at 350 mA (TJ = 25° C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle 2θ½ [1] (°) Luminous Efficiency (lm/W) Part Number Color Min. Max. Typ. Typ. ASMT-MW22-NNP00 Cool White 4000 10000 110 107 ASMT-MY22-NMP00 Warm White 2600 4000 110 89 ASMT-MWE2-NNP00 Cool White Diffused 4000 10000 110 103 ASMT-MYE2-NMP00 Warm White Diffused 2600 4000 110 88 Notes: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 4 Electrical Characteristic at 350 mA (TJ = 25° C) Forward Voltage, VF (Volts) Thermal Resistance, Rθj-ms (°C/W) [1] Temperature Coefficient of Forward Voltage (mV/°C), ∆V­F/∆TJ Dice Type Min. Typ. Max. Typ. Typ. InGaN 2.8 3.2 3.5 10 -1.5 to -3.5 Note: 1. Rθj-ms is the Thermal Resistance from LED junction to metal slug. Typical Characteristic at 700 mA (TJ = 25° C) Luminous Flux, ΦV (lm) Forward Voltage, VF (Volts) Part Number Color Typ. Typ. ASMT-MW22-NNP00 Cool White 205 3.6 ASMT-MY22-NMP00 Warm White 170 3.6 ASMT-MWE2-NNP00 Cool White Diffused 196 3.6 ASMT-MYE2-NMP00 Warm White Diffused 167 3.6 5 WARM WHITE COOL WHITE 380 430 480 530 580 630 WAVELENGTH - nm 680 730 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 780 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 tp T IF 0.001 0.1 PULSE DURATION, tp - sec 4 100 200 300 400 500 MONO PULSE CURRENT - mA 600 700 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 5. Radiation Pattern. D= 0.05 0.10 0.25 0.50 1.00 PULSE CURRENT, Ip - A PULSE CURRENT, IP - A Figure 4. Forward Current vs. Forward Voltage. 3.4 3.2 3.0 D = tp 2.8 T 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.00001 0 Figure 3. Relative Luminous Flux vs. Forward Current. NORMALIZED INTENSITY FORWARD CURRENT - mA Figure 2. Relative Intensity vs. Wavelength. 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 10 3.4 3.2 3.0 D = tp 2.8 T 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.00001 tp T IF D= 0.05 0.10 0.25 0.50 1.00 0.001 0.1 PULSE DURATION, tp - sec 10 Figure 6. Maximum pulse current vs. pulse duration. Derated based on Figure 7. Maximum pulse current vs. pulse duration. Derated based on TA = 25° C, RθJ-A = 30°C/W. TA = 85° C, RθJ-A = 30°C/W. 6 RELATIVE LIGHT OUTPUT (%) (NORMALIZED AT 25° C) 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 WARM WHITE COOL WHITE -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 800 800 700 700 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA Figure 8. Relative Light Output vs. Junction Temperature. 600 500 400 RθJ-A = 20°C/W RθJ-A = 25°C/W RθJ-A = 30°C/W 300 200 100 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - °C 120 140 Figure 9. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125° C, RθJ-A = 20°C/W, 25°C/W and 30°C/W. 600 500 400 RθJ-MS = 10°C/W 300 200 100 0 0 20 40 60 80 100 120 TMS - METAL SLUG TEMPERATURE - °C 140 Figure 10. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125° C, RθJ-MS = 10°C/W. 10.70±0.10 TEMPERATURE 10 - 30 SEC. 217°C 200°C 255 - 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 8.40±0.10 17.00±0.20 1.00±0.10 3°C/SEC. MAX. 3.1±0.10 100 SEC. MAX. 60 - 120 SEC. TIME Figure 11. Recommended Reflow Soldering. 5.08±0.10 (Acc. to J-STD-020C) Figure 12. Recommended soldering land pattern. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 7 Option Selection Details ASMT – M x1 x2 x3 – N x4 x5 x6 x7 x4 – Minimum Flux Bin x5 – Maximum Flux Bin x6 – Color Bin Selection x7 – Packaging Option Flux Bin Limit [x4, x5] Luminous Flux (lm) at IF = 350mA Bin Min. Max. K 56.0 73.0 L 73.0 95.0 M 95.0 110.0 N 110.0 125.0 P 125.0 140.0 Tolerance for each bin limits is ±10%. Color Bin Selections [x3] Individual reel will contain parts from one color bin selection only. Cool White Warm White Selection Bin ID Selection Bin ID 0 Full Distribution 0 Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only N A and C only H H only P B and D only L A and G only Q E and C only M B and H only R F and D only N A and C only U E and F only P B and D only W C and D only Q E and C only Z A and B only R F and D only 1 A, B, C and D only S G and H only 4 C, D, E and F only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only 8 Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Warm White Color Limits (Chromaticity Coordinates) Bin A X 0.367 0.362 0.329 0.329 Bin A X 0.452 0.488 0.470 0.438 Y 0.400 0.372 0.345 0.369 Y 0.434 0.447 0.414 0.403 Bin B X 0.362 0.356 0.329 0.329 Bin B X 0.438 0.470 0.452 0.424 Y 0.372 0.330 0.302 0.345 Y 0.403 0.414 0.384 0.376 Bin C X 0.329 0.329 0.305 0.301 Bin C X 0.407 0.418 0.452 0.438 Y 0.369 0.345 0.322 0.342 Y 0.393 0.422 0.434 0.403 Bin D X 0.329 0.329 0.311 0.305 Bin D X 0.395 0.407 0.438 0.424 Y 0.345 0.302 0.285 0.322 Y 0.362 0.393 0.403 0.376 Bin E X 0.303 0.307 0.283 0.274 Bin E X 0.381 0.387 0.418 0.407 Y 0.333 0.311 0.284 0.301 Y 0.377 0.404 0.422 0.393 Bin F X 0.307 0.311 0.290 0.283 Bin F X 0.373 0.381 0.407 0.395 Y 0.311 0.285 0.265 0.284 Y 0.349 0.377 0.393 0.362 Bin G X 0.388 0.379 0.362 0.367 Tolerance: ± 0.01 Y 0.417 0.383 0.372 0.400 Bin H X 0.379 0.369 0.356 0.362 Y 0.383 0.343 0.330 0.372 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k C B H 0.34 5.6k Black Body Curve 0.32 7k D E 0.30 10k F 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE 0.48 0.46 0.44 Y - COORDINATE Y - COORDINATE Tolerance: ± 0.01 0.42 C 0.40 0.38 0.36 E 4.0k F 3.5k D A 3.0k B 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Figure 13. Color bins (Cool White). Figure 14. Color bins (Warm White). Packaging Option [x7] Example Selection Option ASMT-MW20-NLNZ0 0 Tube 1 Tape and Reel ASMT-MW20-Nxxxx – Cool White, Electrically Non-isolated Heat Sink, Non-diffused x4 = L – Minimum Flux Bin L x5 = N – Maximum Flux Bin N x6 = Z – Color Bin A and B only x7 = 0 – Tube Option 9 Packing Tube – Option 0 5.39 10.3 37.00 6.5 20.85 11.00 10.95 6.3 8.3 535.00 SIDE VIEW TOP VIEW Figure 15. Tube dimensions Tape & Reel – Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Dim Value AO 8.80±0.10 BO 16.45±0.10 KO 3.60±0.1 E 1.75±0.10 F 11.50±0.10 W 24.0±0.10 P 16.0±0.10 Q'ty/Reel 250 units All dimensions in millimeters. Ao SECTION B Figure 16. Carrier tape dimensions 10 END START MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 17. Carrier tape leader and trailer dimensions. *Note: Tape & Reel Packaging only applicable as per this datasheet only. Reel Dimension +1.00 24.0 −0.00 2.30 2.30 0 2.50 ± 0.50 0º 60. ∅99.50 ± 1.00 R10.0 0 0.5 ∅268.00 R1 ∅13.50 ∅330.00 ± 1.00 120.0º Figure 18. Reel dimensions. 11 .50 ±0 ± 0.50 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use – Unopen moisture barrier bag (MBB) can be stored at < 40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. – It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB – The humidity indicator card (HIC) shall be read immediately upon opening of MBB. – The LEDs must be kept at < 30°C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. C. Control for unfinished reel – For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at < 5%RH. D. Control of assembly boards – If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at < 5%RH to ensure no LEDs have exceeded their floor life of 72 hours. E. Baking is required if – HIC “10%” indicator is not blue and “5%” indicator is pink. – The LEDs are exposed to condition of > 30°C/60%RH at any time. – The LEDs floor life exceeded 72 hrs. Recommended baking condition: 60±5°C for 20 hrs. DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. AV02-3158EN - December 10, 2012