ASMT-MWB9-NKLS0

ASMT-Mxx9 Moonstone® 1W Power LED Light Source Data Sheet Description Features The Moonstone® 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. x Available in Cool White & Warm White color It is available in various color temperatures ranging from 2600K to 10000K. x High current operation The package is compatible with reflow soldering. To facilitate easy pick and place assembly, the LEDs are also available in EIA-compliant tape and reel. x Wide viewing angle The 1W Power LED light source can be mounted onto metal core PCB enabling optimum heat dissipation and ease of installation. x MSL 4 products x Energy efficient x Exposed pad for excellent heat transfer x Suitable for reflow soldering process x Long operation life x Silicone encapsulation x Non-ESD sensitive (threshold >16kV) Applications x Sign backlight, billboard illumination or backlight x Exit sign or emergency sign lightings x Commercial lightings x Accent and marker lightings x Pathway lighting x Task lighting x Reading lights x Decorative lighting x Garden lighting x Architectural lighting x Portable (flash light, bicycle head light) Package Dimension for Moonstone® 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 1.27 Metal Slug 3 Ø 5.26 LED 10.60 + ZENER − 8.50 Ø 8.00 2.00 5.25 1.30 2 1 5.08 Notes: 1. All dimensions in mm. 2. Tolerance = ±0.10mm unless otherwise specified. 3. Terminal finish: Ag plating. 4. Metal slug is connected to anode. 0.81 Figure 1. Moonstone® package outline drawing. Package Dimension for Moonstone® on MCPCB 1 16.00 2.50 Anode 60 ° 2 Cathode 3 Heat Sink ∅ 5.00 ∅ 3.00 20.00 14.00 ∅ 19.00 R 1.60 4.00 3.00 19.00 1.40 2.30 1.60 1.30 4.60 24.00 Figure 2. MCPCB I package outline drawing. Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1 mm unless otherwise specified. 2 4.90 3.30 19.90 Figure 3. MCPCB II package outline drawing. Part Numbering System ASMT-M x1 x 2 9 – N x 3 x 4 x 5 x 6 Packaging option Color Bin Selection Maximum -Flux Bin Selection Minimum -Flux Bin Selection Moonstone® Type 0 – Non-diffused B – Diffused A – Non-diffused on MCPCB I C – Diffused on MCPCB I K – Non-diffused on MCPCB II L – Diffused on MCPCB II Color W – Cool White Y – Warm White Note: 1. Please refer to Page 7 for selection details. Device Selection Guide (Tj = 25qC) for Moonstone® Luminous Flux, ΦV [1,2] (lm) Dice Technology Electrically Isolated Metal Slug InGaN No Part Number Color Min. Typ. Max. Test Current (mA) ASMT-MW09-NLM00 Cool White 73.0 90.0 124.0 350 95.0 100.0 124.0 350 InGaN No Warm White 56.0 75.0 124.0 350 InGaN No 73.0 80.0 124.0 350 InGaN No ASMT-MW09-NMM00 ASMT-MY09-NKM00 ASMT-MY09-NLM00 ASMT-MWB9-NLM00 Cool White Diffused 73.0 87.0 124.0 350 InGaN No ASMT-MYB9-NKM00 Warm White Diffused 56.0 72.0 124.0 350 InGaN No Dice Technology Electrically Isolated Metal Slug Device Selection Guide (Tj = 25qC) for Moonstone® on MCPCB Luminous Flux, ΦV [1,2] (lm) Part Number Color Min. Typ. Max. Test Current (mA) ASMT-MWK9-NLM00 Cool White 73.0 90.0 124.0 350 InGaN No ASMT-MYK9-NKM00 Warm White 56.0 75.0 124.0 350 InGaN No Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is ±10 %. 3 Absolute Maximum Ratings Parameter ASMT-Mxx9 Units DC Forward Current [1] 500 mA Power Dissipation 2100 mW LED Junction Temperature 125 °C Operating Metal Slug Temperature Range at 350 mA -40 to +110 °C Operating Metal Slug Temperature Range at 500 mA -40 to +105 °C Storage Temperature Range -40 to +120 °C Soldering Temperature Refer to Figure 14 Reverse Voltage [2] Not recommended Notes: 1. Derate linearly based on Figure 11. 2. Not designed for reverse bias operation. Optical Characteristics at 350 mA (TJ = 25 °C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 2T½ [2] (°) Luminous Efficiency (lm/W) Part Number Color Min. Max. Typ. Typ. ASMT-MW09-NLM00 Cool White 4000 10000 110 71 ASMT-MWK9-NLM00 4000 10000 110 71 ASMT-MW09-NMM00 4000 10000 110 79 ASMT-MY09-NKM00 2600 4000 110 60 ASMT-MY09-NKM00 Warm White 2600 4000 110 60 ASMT-MY09-NLM00 2600 4000 110 63 ASMT-MWB9-NLM00 Cool White Diffused 4000 1000 110 69 ASMT-MYB9-NKM00 Warm White Diffused 2600 4000 110 57 Thermal Resistance, RTj-ms(°C/W) [1] Thermal Resistance, RTj-b(°C/W) [2] Notes: 1. T½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristic at 350 mA (TJ = 25°C) Forward Voltage, VF (Volts) Dice Type Min. Typ. Max. Typ. Typ. InGaN 3.2 3.6 4.0 10 14 Notes: 1. RTj-ms is the thermal resistance from LED junction to metal slug. 2. RTj-b is the thermal resistance from LED junction to MCPCB. 4 Cool White Warm White 400 450 500 550 600 650 WAVELENGTH - nm 700 750 IF - FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 350 800 Figure 4. Relative intensity vs. wavelength 1.0 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX - lm 1.2 0.8 0.6 0.4 0.2 0.0 50 100 150 200 250 300 350 400 450 500 IF - FORWARD CURRENT - mA Figure 6. Relative luminous flux vs. forward current. 500mA 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - ° 3.5 4.0 60 90 0.000 350mA -0.001 250mA -0.002 0.002 0.003 500mA 0.001 Y - COORDINATES Y - COORDINATES 1.5 2.0 2.5 3.0 VF - FORWARD VOLTAGE - V 0.002 0.001 150mA 350mA 0.000 250mA -0.001 150mA -0.002 -0.003 -0.003 50mA 50mA -0.002 -0.001 0.000 X - COORDINATES 0.001 0.002 Figure 8. Chromaticity coordinate shift vs. forward current (Cool White). 5 1.0 Figure 7. Radiation pattern. 0.002 -0.004 -0.003 0.5 Figure 5. Forward voltage vs. forward current. 1.4 0 500 450 400 350 300 250 200 150 100 50 0 0.0 -0.004 -0.002 -0.001 0.000 0.001 X - COORDINATES Figure 9. Chromaticity coordinate shift vs. forward current (Warm White). 1.2 0.5 FORWARD VOLTAGE SHIFT - V (NORMALISED TO 25°C) 0.4 1 RELATIVE LIGHT OUTPUT (NORMALISED TO 25°C) Warm White 0.8 Cool White 0.6 0.4 0.1 Cool White & Warm White 0.0 -0.2 -0.3 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE -°C 100 -0.4 -40 120 Figure 10. Relative light output vs. junction temperature. -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE -°C 100 120 Figure 11. Forward voltage shift vs. junction temperature. 600 600 MAX. ALLOWABLE DC CURRENT - mA MAX. ALLOWABLE DC CURRENT - mA 0.2 -0.1 0.2 0 -40 0.3 500 400 RTj-a = 30°C/W 300 RTj-a = 40°C/W RTj-a = 50°C/W 200 100 0 500 400 RTj-ms = 10°C/W 300 200 100 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 Figure 12. Maximum forward current vs. ambient temperature 0 20 40 60 80 100 120 Tms - METAL SLUG TEMPERATURE - °C 140 Figure 13. Maximum forward current vs. metal slug temperature 10.70±0.10 TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 - 260°C 3°C/SEC. MAX. 8.40±0.10 6°C/SEC. MAX. 150°C 17.00±0.20 1.00±0.10 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 3.1±0.10 5.08±0.10 TIME (Acc. to J-STD-020C) Figure 14. Recommended soldering profile. Figure 15 Recommended soldering land pattern. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 6 Option Selection Details Flux Bin Limit [x3 x4] ASMT - M x1 x2 9 - N x3 x4 x5 x6 Luminous Flux (lm) @ IF = 350mA x3 = Minimum flux bin Bin ID Min Max x4 = Maximum flux bin K 56.0 73.0 x5 = Color Bin Selection L 73.0 95.0 x6 = Packaging Option M 95.0 124.0 Tolerance: ±10% Color Bin Selections [x5] Individual reel or tube will contain parts from one color bin selection only. Cool White Warm White Selection Bin ID Selection Bin ID 0 Full Distribution 0 Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only N A and C only H H only P B and D only L A and G only Q E and C only M B and H only R F and D only N A and C only U E and F only P B and D only W C and D only Q E and C only Z A and B only R F and D only 1 A, B, C and D only S G and H only 4 C, D, E and F only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only 7 Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Warm White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Tolerance: ± 0.01 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k C H B 0.34 5.6k Black Body Curve 0.32 7k D E 0.30 10k F 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE 0.48 0.46 0.44 Y - COORDINATE Y - COORDINATE Tolerance: ± 0.01 A 0.42 C 0.40 E 0.38 4.0k F 0.36 3.5k D 3.0k B 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Figure 16. Color bins (Cool White) Figure 17. Color bins (Warm White) Packaging option [x6] Example Selection Option ASMT-MW09-NLMZ1 0 Tube (for Moonstone® only) Tray (for Moonstone® on MCPCB only) ASMT-MW09-Nxxxx - Cool White, Non-diffused 1 Tape & reel 8 x3 = L - Minimum Flux Bin L x4 = M - Maximum Flux Bin M x5 = Z - Color Bin A and B only x6 = 1 - Tape and Reel Option Packing Tube - Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 535.00 8.30 SIDE VIEW TOP VIEW Quantity per tube = 25 pcs Figure 18. Tube dimensions Tape and Reel - Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Dim Value AO 8.80±0.10 BO 16.45±0.10 KO 3.60±0.1 E 1.75±0.10 F 11.50±0.10 W 24.0±0.10 P 16.0±0.10 Q'ty/Reel 250 units All dimensions in mm. Ao SECTION B Figure 19. Carrier tape dimensions 9 END START MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. *Note: Tape & Reel Packaging only applicable as per this datasheet only. Figure 20. Carrier tape leader and trailer dimensions +1.00 24.0 -0.00 2.30 2.30 0 R10.0 2.50 ± 0.50 0 0.5 ∅ 99.50 ± 1.00 ± .50 R10 0 ± 0.50 ∅ 13.5 60. 0º 120.0º ∅268.00 ∅ 330.00 ± 1.00 Figure 21. Reel dimensions 10 Packing Tray - Option 0 (for Moonstone® on MCPCB only) Figure 22. Tray dimensions. 11 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB – The humidity indicator card (HIC) shall be read immediately upon opening of MBB. – The LEDs must be kept at