ASMT-QAB2-FDE0E

ASMT-QxB2-Fxxxx Super 0.5 W Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5 W Power PLCC-4 SMT LED is an extension of Power PLCC-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. • Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9 mm) • High reliability package with enhanced silicone resin encapsulation • High intensity brightness with optimum flux performance using AllnGaP chip technologies • Available in Red, Red Orange and Amber colors • High optical efficiency • Available in 8 mm carrier tape and 7 inch reel • Low thermal resistance • Super wide viewing angle at 120 degrees • Longer life time with minimum degradation due to enhanced Silicone resin material • JEDEC MSL 2a The Super 0.5 W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. Super 0.5 W Power PLCC-4 SMT LED is available in red, red orange and amber colors. Applications • Exterior automotive - Turn signals - Side repeaters - CHSML - Rear combination lamp - Side markers - Truck clearance lamp • Electronic signs and signals - Channel lettering - Contour lighting - Indoor variable message sign • Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting CAUTION: ASMT-QxB2-Fxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing 1.9 0.2 2.8 0.2 0.8 0.1 2.2 0.2 C 0.15 (TYP.) 2.40 C 1.15 0.05 0.41 (TYP.) 3.6 0.2 3.2 0.2 0.56 (TYP.) 0.8 0.3 A A ANODE MARKING NOTES: 1. 2. 3. 4. 0.5 0.1 2.30 0.05 0.7 0.1 ALL DIMENSIONS IN MILLIMETERS. LEAD POLARITY AS SHOWN IN FIGURE 13. TERMINAL FINISH: Ag PLATING. ENCAPSULATION MATERIAL: SILICONE RESIN. Figure 1. Package drawing Table 1. Device Selection Guide (TJ = 25 °C) Luminous Flux, ΦV[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Amber ASMT-QAB2-FDE0E 9.0 11.4 15.0 150 AlInGaP Red Orange ASMT-QHB2-FEF0E 11.5 14.0 19.5 150 AlInGaP Red ASMT-QRB2-FCD0E 7.0 9.8 11.5 150 AlInGaP Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12%. Part Numbering System A S M T – Q X1 B 2 – F X2 X3 X4 X5 Packaging Option Color Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color A - Amber H - Red Orange R - Red 2 Table 2. Absolute Maximum Ratings (TA = 25°C) Parameters ASMT-QxB2-Fxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 200 mA Power Dissipation 470 mW Reverse Voltage 5V Junction Temperature 125°C Operating Temperature -40°C to +110°C Storage Temperature -40°C to +110°C Notes: 1. Derate l inearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz. Table 3. Optical Characteristics (TJ = 25°C) Dominant Wavelength λD[1] (nm) Viewing Angle 2θ1/2[2] (Degrees) Luminous Efficiency ηe(lm/W) Total Flux / Luminous Intensity FV (lm) / IV (cd) Color Part Number Dice Technology Typ. Typ. Typ. Typ. Amber ASMT-QAB2-Fxxxx AlInGaP 594.5 120 28 3.3 Red Orange ASMT-QHB2-Fxxxx AlInGaP 617.0 120 35 3.3 Red ASMT-QRB2-Fxxxx AlInGaP 624.0 120 21 3.3 Notes: 1. The dominant wavelength, λD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Table 4. Electrical Characteristics (TJ = 25°C) Forward Voltage VF (Volts) @ IF = 150 mA Reverse Voltage VR @ 100 μA Thermal Resistance RθJ-P (°C/W) Part Number Typ. Max. Min. ASMT-QAB2-Fxxxx 2.70 3.25 5 60 ASMT-QHB2-Fxxxx 2.70 3.25 5 60 ASMT-QRB2-Fxxxx 3.10 3.55 5 60 3 1.0 0.9 AlInGaP AMBER 160 AlInGaP RED 0.7 0.6 0.5 0.4 0.3 0.2 0.1 140 120 100 80 60 AlInGaP RED 40 AlInGaP RED-ORANGE 20 0 380 430 480 580 530 630 WAVELENGTH – nm 680 730 0 780 Figure 2. Relative intensity vs. wavelength 1 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 25 C) 2.2 2.0 1.0 AMBER 0.8 0.6 RED/RED-ORANGE 0.4 0.2 0 0 0 50 100 150 RED -25 120 140 60 60 20 20 20 40 60 80 JUNCTION TEMPERATURE – °C 100 120 Figure 6a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C, RθJ-A = 130°C/W, 110°C/W, 100°C/W and 80°C/W. 4 80 40 0 RED 100 40 0 125 AMBER / RED-ORANGE 120 RJA = 130 °C/W 80 100 160 RJA = 80 °C/W RJA = 110 °C/W 100 0 25 50 75 JUNCTION TEMPERATURE – C Figure 5. Relative intensity vs. temperature CURRENT – mA MAXIMUM FORWARD CURRENT – mA RJA = 100 °C/W 4 RED-ORANGE DC FORWARD CURRENT – mA 140 3 AMBER 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -50 200 Figure 4. Relative intensity vs. forward current 160 2 FORWARD VOLTAGE – V Figure 3. Forward current vs. forward voltage 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 150 mA) AlInGaP AMBER 180 FORWARD CURRENT – mA RELATIVE INTENSITY 0.8 200 AlInGaP RED-ORANGE 0 0 20 40 60 80 TEMPERATURE – °C 100 120 Figure 6b. Maximum forward current vs. solder point temperature. Derated based on TJMAX = 125°C, RJP = 60°C/W. 0.30 D= 0.05 0.10 0.25 0.50 1 0.20 D= 0.10 D= 0.00 1.00E-05 1.00E-03 tp T tp tp T IF D= 0.05 0.10 0.25 0.50 1 0.10 IF T 1.00E-01 tp - Time - (S) tp T 0.20 CURRENT - A CURRENT - A 0.30 0.00 1.00E-05 1.00E+01 Figure 7a. Maximum pulse current vs. ambient temperature. Derated based on TA = 25°C, RθJ-A =110°C/W. 1.00E-03 1.00E-01 tp - Time - (S) 1.00E+01 Figure 7b. Maximum pulse current vs. ambient temperature.Derated vased on TA= 85°C, RθJ-P =110°C/W. 630 0.15 0.10 620 FORWARD VOLTAGE SHIFT (V) DOMINANT WAVELENGTH – nm AlInGaP RED AlInGaP RED-ORANGE 610 600 AlInGaP AMBER 590 580 0 50 100 150 200 FORWARD CURRENT – mA NORMALIZED INTENSITY Figure 8. Dominant wavelength vs. forward current – AlInGaP devices 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 10. Radiation pattern 5 60 90 0.05 0 -0.05 -0.10 -0.15 -50 -25 0 25 50 TJ – JUNCTION TEMPERATURE – C Figure 9. Forward voltage shift vs. temperature 75 100 10 - 30 SEC. TEMPERATURE 255 - 260 °C ID Note: Diameter "ID" should be bigger than 2.3mm 217 °C 200 °C 3 °C/SEC. MAX. -6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure11. Recommended pick and place nozzle size Figure 12. Recommended Pb-free reflow soldering profile Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 2.4 0.6 0.9 X 6 C C C C 1.3 x 6 A A 0.4 A A A 1.1 A 4.6 ANODE MARKING C CATHODE 0.3 A ANODE SOLDER MASK ANODE MARKING Figure 13. Recommended soldering pad pattern 6 MINIMUM 55 mm2 OF ANODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 480 mm MIN. FOR ∅180 REEL. 960 mm MIN. FOR ∅330 REEL. 200 mm MIN. FOR ∅180 REEL. 200 mm MIN. FOR ∅330 REEL. C A USER FEED DIRECTION Figure 14. Tape leader and trailer dimensions Ø1.5 +0.1 –0 4 ± 0.1 4 ± 0.1 2 ± 0.05 1.75 ± 0.1 2.29 ± 0.1 C C A A 3.5 ± 0.05 8 +0.3 –0.1 3.05 ± 0.1 +0.1 Ø1 –0 0.229 ± 0.01 8° ALL DIMENSIONS IN mm. Figure 15. Tape dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 16. Reeling orientation 7 3.8 ± 0.1 Device Color (X1) Color Bin Select (X4) Individual reel will contain parts from one full bin only. A Amber H Red Orange X4 R Red 0 Full Distribution A 1 and 2 only B 2 and 3 only C 3 and 4 only Flux Bin Select (X2X3) Individual reel will contain parts from one bin only. X2 Min Flux Bin X3 Max Flux Bin Flux Bin Limits Bin ID Min. (lm) D 4 and 5 only E 5 and 6 only G 1, 2 and 3 only H 2, 3 and 4 only J 3, 4 and 5 only K 4, 5 and 6 only M 1, 2, 3 and 4 only Max. (lm) N 2, 3, 4 and 5 only 3, 4, 5 and 6 only A 4.30 5.50 P B 5.50 7.00 R 1, 2, 3, 4 and 5 only C 7.00 9.00 S 2, 3, 4, 5 and 6 only Z Special Color Bin D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 Color Bin Limits J 33.00 43.00 Amber/Yellow Min. (nm) Max. (nm) K 43.00 56.00 2 583.0 586.0 L 56.00 73.00 3 586.0 589.0 4 589.0 592.0 5 592.0 595.0 6 595.0 598.0 Red Orange Min. (nm) Max. (nm) 1 611.0 616.0 2 616.0 620.0 3 620.0 625.0 Red Min. (nm) Max. (nm) Full Distribution 620.0 635.0 Tolerance of each bin limit = ±12%. Tolerance of each bin limit = ±1 nm. 8 VF Binning Moisture Sensitivity Bin Min. Max. 2D 2.35 2.50 2E 2.50 2.65 2F 2.65 2.80 2G 2.80 2.95 2H 2.95 3.10 2J 3.10 3.25 2K 3.25 3.40 2L 3.40 3.55 Tolerance of each bin = ±0.1 V. Packaging Option (X5 ) Option Test Current Package Type Reel Size E 150 mA Top Mount 7 Inch Handling Precaution The encapsulation of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. This might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detailed information. For product information and a complete list of distributors, please go to our website: This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at