ASMT-QABD-AEF0E

ASMT-QxBD-Axxxx Super 0.5 W Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5 W Power PLCC-4 SMT LED is an extension of Power PLCC-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED.  Industry Standard PLCC 4 platform (3.2 mm 2.8 mm  1.9 mm)  High reliability package with enhanced silicone resin encapsulation  High intensity brightness with optimum flux performance using AllnGaP chip technologies  Available in Red and Amber colors  High optical efficiency  Available in 8mm carrier tape & 7 inch reel  Low Thermal Resistance 60C/W  Super wide viewing angle at 120  Longer life time with minimum degradation due to enhanced Silicone resin material  JEDEC MSL 2 The Super 0.5 W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. Super 0.5 W Power PLCC-4 SMT LED is available in red and amber colors. Applications  Exterior automotive – Turn signals – Side repeaters – CHSML – Rear combination lamp – Side markers – Truck clearance lamp  Electronic signs and signals – Channel lettering – Contour lighting – Indoor variable message sign  Office automation, home appliances, equipment – Front panel backlighting – Push button backlighting – Display backlighting CAUTION: ASMT-QxBD-Axxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. industrial Package Drawing 1.9 ± 0.2 2.2 ± 0.2 C A A 1.15 ± 0.2 0.97 0.56 (TYP.) φ 2.4 3.2 ± 0.2 3.6 ± 0.2 0.41 (TYP.) C 0.6 ± 0.3 0.79 ± 0.3 2.8 ± 0.2 0.7 ANODE MARKING Note: 1. All Dimensions in millimeters. 2. Lead Polarity as shown in Figure 12. 3. Terminal Finish: Ag plating 4. Encapsulation material: Silicone resin Figure 1. Package Drawing Table 1. Device Selection Guide Luminous Flux, V[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Amber ASMT-QABD-AEF0E 11.5 16.5 19.5 150 AlInGaP Amber ASMT-QABD-AEFJE 11.5 - 19.5 150 AlInGaP Red Orange ASMT-QHBD-AEFBE 11.5 - 19.5 150 AlInGaP Red Orange ASMT-QHBD-AFH0E 15.0 17.5 33.0 150 AlInGaP Red Orange ASMT-QHBD-AFG0E 15.0 - 25.5 150 AlInGaP Red ASMT-QRBD-AEF0E 11.5 16.5 19.5 150 AlInGaP Notes: 1. V is the total luminous flux output as measured with an integrating sphere at mono pulse condition. 2. Flux tolerance is ±12% Part Numbering System ASMT- Q X1 B D  A X2 X3 X4 X5 Packaging Option Color Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color A – Amber H – Red Orange 2 Table 2. Absolute Maximum Ratings (TA = 25 C) Parameters ASMT-QxBD-Axxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 450 mW Reverse Voltage, VR @ 100 A 5V Junction Temperature 125 C Operating Temperature -40C to +120C Storage Temperature -40C to +120C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1 kHz Table 3. Optical Characteristics (TJ = 25 C) Peak Wavelength PEAK (nm) Dominant Wavelength D [1] (nm) Viewing Angle Luminous 2½ [2] Efficiency e (Degrees) (lm/W) Total Flux / Luminous Intensity V (lm) / IV (cd) Typ. Typ. Typ. Typ. Typ. Color Part Number Dice Technology Amber ASMT-QABD-Axx0E AlInGaP 596.2 593.1 120 44 2.5 Red Orange ASMT-QHBD-Axx0E AlInGaP 624.1 616.1 120 47 2.5 Red ASMT-QRBD-Axx0E AlInGaP 629.7 621.1 120 44 2.5 Notes: 1. The dominant wavelength, D, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Table 4. Electrical Characteristics (TJ = 25°C) Forward Voltage VF (V) @ IF = 150 mA Part Number Min. Typ. Max. Thermal Resistance RJ-P (C/W) ASMT-QABD-AxxxE 2.05 2.30 2.95 60 ASMT-QHBD-AxxxE 2.05 2.50 2.95 60 ASMT-QRBD-AxxxE 2.05 2.50 2.95 60 3 250 FORWARD CURRENT - mA RELATIVE INTENSITY 300 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 AlInGaP Red AlInGaP Amber AlInGaP Amber 200 AlInGaP Red 150 100 50 0 430 480 530 580 630 WAVELENGTH - nm 680 730 0 780 Figure 2. Relative Intensity Vs. Wavelength RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 25°C) RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 50 100 150 200 DC FORWARD CURRENT - mA 250 4 AlInGaP Red -25 0 25 50 JUNCTION TEMPERATURE - °C 75 100 120 140 Figure 5. Relative Intensity Vs. Temperature 160 140 140 Rθ JA = 130°C/W 120 120 Rθ JA = 110°C/W 100 CURRENT - mA CURRENT - mA 3 AlInGaP Amber -50 160 Rθ JA = 100°C/W 80 60 Rθ JP = 60°C/W 100 80 60 40 40 20 20 0 0 20 40 60 80 100 TEMPERATURE (°C) 120 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated based on TJMAX = 125°C, RJ-A=130°C/W, 110°C/W & 100°C/W. 4 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 300 Figure 4. Relative Intensity Vs. Forward Current 0 2 FORWARD VOLTAGE - V Figure 3. Forward Current Vs. Forward Voltage. 1.8 0 1 140 0 20 40 60 80 100 TEMPERATURE (°C) Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on TJMAX = 125°C, RJ-P =60°C/W. 0.40 0.30 0.30 CURRENT - A CURRENT - A 0.40 0.20 0.10 D= tp T D= 0.05 0.10 0.25 0.50 1 0.20 0.10 tp IF D= T tp T tp IF T 0.00 0.00 1.00E-05 1.00E-03 1.00E-01 tp - Time - (S) 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E+01 1.00E-01 1.00E+00 1.00E+01 1.00E+02 tp - Time - (S) Figure 7a. Maximum Pulse Current vs. Ambient Temperature. Derated based on TA = 25°C, RJ-A =110°C/W. Figure 7b. Maximum Pulse Current vs. Ambient Temperature. Derated based on TA = 85°C, RJ-A =110°C/W. 625.0 0.4 620.0 FORWARD VOLTAGE SHIFT - V DOMINANT WAVELENGTH - nm AlInGaP Red 615.0 610.0 605.0 600.0 595.0 AlInGaP Amber 590.0 0 50 100 150 200 FORWARD CURRENT - mA 250 300 NORMALIZED INTENSITY Figure 8. Dominant Wavelength Vs. Forward Current - AlInGaP Devices. -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 10. Radiation Pattern 5 AlInGaP Red 0.2 AlInGaP Amber 0.1 0.0 -0.1 -0.2 -50 -25 0 25 50 TJ - JUNCTION TEMPERATURE - °C Figure 9. Forward Voltage Shift Vs. Temperature. 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 0.3 90 75 100 TEMPERATURE 10 - 30 SEC. 217°C 200°C 255 - 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. Figure 11. Recommended Pb-free Reflow Soldering Profile 2.4 0.6 0.9 X 6 C C C C 1.3 x 6 A A 0.4 ANODE MARKING A A A A 1.1 4.6 C CATHODE 0.3 A ANODE SOLDER MASK ANODE MARKING Figure 12. Recommended Soldering Pad Pattern 6 MINIMUM 55 mm2 OF ANODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. COMPONENT LEADER 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 13. Tape Leader and Trailer Dimensions Ø1.5 +0.1 –0 4 ± 0.1 4 ± 0.1 2 ± 0.05 1.75 ± 0.1 2.29 ± 0.1 C C A A 3.5 ± 0.05 8 +0.3 –0.1 3.05 ± 0.1 +0.1 Ø1 –0 0.229 ± 0.01 8° ALL DIMENSIONS IN mm. Figure 14. Tape Dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 15. Reeling Orientation 7 3.8 ± 0.1 Device Color (X1) Color Bin Select (X4) Individual reel will contain parts from one full bin only. A Amber H Red Orange X4 R Red 0 Full Distribution A 1 and 2 only B 2 and 3 only C 3 and 4 only D 4 and 5 only E 5 and 6 only G 1, 2 and 3 only H 2, 3 and 4 only J 3, 4 and 5 only K 4, 5 and 6 only M 1, 2, 3 and 4 only N 2, 3, 4 and 5 only P 3, 4, 5 and 6 only R 1, 2, 3, 4 and 5 only S 2, 3, 4, 5 and 6 only Z Special Color Bin Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Flux Bin Limits Bin ID Min. (lm) Max. (lm) 0 3.30 4.30 A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 J 33.00 43.00 K 43.00 56.00 L 56.00 73.00 Tolerance of each bin limit = ± 12% 8 Color Bin Limits VF Binning Amber/Yellow Min. (nm) Max. (nm) Bin Min. Max. 2 583.0 586.0 2B 2.05 2.20 3 586.0 589.0 2C 2.20 2.35 4 589.0 592.0 2D 2.35 2.50 5 592.0 595.0 2E 2.50 2.65 6 595.0 598.0 2F 2.65 2.80 2G 2.80 2.95 Red Orange Min. (nm) Max. (nm) 1 611.0 616.0 2 616.0 620.0 3 620.0 625.0 Red Min. (nm) Max. (nm) Full Distribution 620.0 635.0 Tolerance of each bin limit = ±1 nm 9 Tolerance of each bin = ±0.1 V Packaging Option (X5) Option Test Current Package Type Reel Size E 150 mA Top Mount 7 inch Precautionary Notes 1. Handling precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxyencapsulant that is hard and brittle, silicone is softerand flexible. Special handling precautions must be observed during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for more information. a. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. b. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. c. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. d. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. e. For automated pick and place, Avago has tested the following nozzle size to work with this LED. However, due to the possibility of variations in other parameters, such as pick and place, machine maker/ model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. 2. Handling of moisture sensitive device This product has a Moisture Sensitive Level 2 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use — An unopened moisture barrier bag (MBB) can be stored at