ASMT-QGBE-NFH0E

ASMT-QxBE-Nxxxx Super 0.5W Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5W Power PLCC-4 SMT LED is first Blue & Green mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. x Industry Standard PLCC 4 platform (3.2x2.8x1.9mm) The Super 0.5W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. x Low Thermal Resistance 40°C/W To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. x High reliability package with enhanced silicone resin encapsulation x High brightness with optimum flux performance using InGaN chip technologies x Available in Blue and Green color x Available in 8mm carrier tape & 7 inch reel x Super wide viewing angle at 120 degree x JEDEC MSL 2a Applications 1. Electronic signs and signals a. Decorative/Advertising Lighting b. Channel Lettering c. Signs Luminaire d. RGB Backlighting CAUTION: ASMT-QXBE-Nxxxx LEDs are ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing 1.9 ± 0.2 2.2 ± 0.2 A C C 1.15 ± 0.2 0.97 0.56 (TYP.) Ø 2.4 3.2 ± 0.2 3.6 ± 0.2 0.41 (TYP.) A 0.6 ± 0.3 0.79 ± 0.3 2.8 ± 0.2 0.7 CATHODE MARKING Notes: 1. All dimensions in millimeters 2. Lead polarity as shown in figure 13. 3. Terminal finish: Ag plating. 4. Encapsulation material: silicone resin. Figure 1. Package Drawing Table 1. Device Selection Guide Luminous Flux, )V[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Blue ASMT-QBBE-N0B0E 3.4 4.8 7.0 150 InGaN Green ASMT-QGBE-NFH0E 15.0 23.0 33.0 150 InGaN Notes: 1. )V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12% Part Numbering System ASMT–QX 1BE–NX 2 X 3 X 4 X 5 Packaging Option Colour Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color B - Blue G - Green 2 Table 2. Absolute Maximum Ratings (TA = 25 °C) Parameters ASMT-QWBE-Nxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 513 mW Reverse Voltage -4V Junction Temperature 125 °C Operating Temperature -40 °C to +110 °C Storage Temperature -40 °C to +110 °C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TJ = 25 °C) Peak Wavelength λPEAK (nm) Viewing Dominant Wavelength λD Angle 2T½[1] (nm) (Degrees) Luminous Efficiency Ke (lm/W) Total Flux / Luminous Intensity ΦV (lm) / IV (cd) Typ. Typ. Typ. Typ. Typ. Color Part Number Dice Technology Blue ASMT-QBBE-Nxxxx InGaN 459.0 464.5 120 10 2.75 Green ASMT-QGBE-Nxxxx InGaN 516.5 522.0 120 35 2.75 Notes: 1. T½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Table 4. Electrical Characteristics (TJ = 25 °C) Forward Voltage VF (Volts) @ IF = 150 mA Part Number Typ. Max. Thermal Resistance RTJ-P (°C/W) ASMT-QBBE-N0B0E 3.6 4.1 40 ASMT-QGBE-NFH0E 3.6 4.1 40 3 300 FORWARD CURRENT - mA RELATIVE INTENSITY 350 1.0 0.9 0.8 0.7 Blue 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 Green 100 480 530 580 630 WAVELENGTH - nm 680 730 0 780 0 1 1.2 1 1.1 0.8 0.6 0.4 0.2 0 30 60 90 120 DC FORWARD CURRENT - mA 150 4 5 1 0.9 0.8 0.7 -50 0.6 0 50 100 JUNCTION TEMPERATURE - °C 150 Figure 5. Relative Flux Vs. Temperature Figure 4. Relative Flux Vs. Forward Current 160 160 140 140 100 RT JA = 110°C/W 80 60 100 80 60 40 40 20 20 0 20 40 60 80 TEMPERATURE (°C) RT JP = 40°C/W 120 CURRENT - mA 120 RT JA = 90°C/W 0 2 3 FORWARD VOLTAGE - V Figure 3. Forward Current Vs. Forward Voltage RELATIVE LUMINOUS FLUX (NORMALIZED AT 25°C) RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 150 1.2 0 CURRENT - mA 200 50 Figure 2. Relative Intensity Vs. Wavelength 100 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. DeratedBased on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W 4 250 120 0 0 20 40 60 80 TEMPERATURE (°C) 100 Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 125°C, RθJ-P=40°C/W. 120 0.40 0.40 D= 0.05 0.10 0.25 0.50 1 0.20 0.10 D= 0.00 0.00001 0.0001 0.001 tp T 0.01 0.1 tp - Time - (s) 0.30 CURRENT - A 0.30 CURRENT - A D= 0.20 IF T 0 10 0.00 0.00001 0.0001 0.001 100 FORWARD VOLTAGE SHIFT - V-- DOMINANT WAVELENGTH - nm 520 510 500 490 480 470 60 90 FORWARD CURRENT - mA 120 150 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES NORMALIZED INTENSITY Figure 10. Radiation Pattern 5 0 10 100 0.25 0.2 0.15 0.1 0.05 -50 -25 0 0 -0.05 -0.1 -0.15 -0.2 -0.25 25 50 T J - JUNCTION TEMPERATURE - °C Figure 8. Dominant wavelength Vs. forward current. 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 0.01 0.1 tp - Time - (s) Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA= 85°C, RθJ-P=110°C/W. 530 30 IF T D= 0.05 0.10 0.25 0.50 1 540 0 tp 0.10 tp Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA = 25°C, RθJ-A=110°C/W. 460 tp T Figure 9. Forward Voltage Shift Vs. Temperature. 90 75 100 10 - 30 SEC. 255 - 260ºC 3 C/SEC. MAX. TEMPERATURE 217ºC 200ºC -6ºC/SEC. MAX. D 150ºC 3ºC/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. TIME (Acc. to J-STD-020C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. Note: Diameter "D" should be smaller than 2.2mm Figure 11. Recommended Pb-free Reflow Soldering Profile Figure 12. Recommended Pick and Place Nozzle Size 2.4 0.6 0.9 X 6 1.3 x 6 A A A 0.4 A 1.1 C C C C C CATHODE MARKING 0.3 SOLDER MASK A ANODE C CATHODE Figure 13. Recommended Soldering Pad Pattern 6 4.6 C CATHODE MARKING MINIMUM 55 mm2 OF CATHODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 14. Tape Leader and Trailer Dimensions Ø1.5 +0.1 –0 4 ± 0.1 4 ± 0.1 2 ± 0.05 1.75 ± 0.1 2.29 ± 0.1 C C A A 3.5 ± 0.05 8 +0.3 –0.1 3.05 ± 0.1 3.8 ± 0.1 +0.1 Ø1 –0 0.229 ± 0.01 8° ALL DIMENSIONS IN mm. Figure 15. Tape Dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 16. Reeling Orientation 7 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. B Blue G Green Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Flux Bin Limits Bin ID Min. (lm) Max. (lm) 0 3.40 4.30 A 4.30 5.50 B 5.50 7.00 - Unopen moisture barrier bag (MBB) can be stored at