ASMT-QTB2-0AA02

ASMT-QTB2-xxxxx PLCC-4 Surface Mount LED Indicator Data Sheet Description Features This family of SMT LEDs is packaged in the industry standard PLCC-4 package. These SMT LEDs have high brightness and reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under exterior and interior full color signs application conditions. • Industry Standard PLCC-4 package - (Plastic Leaded Chip Carrier) • High reliability LED package due to enhanced silicone resin material To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin; except red color to provide close uniformity. • Super wide viewing angle at 120° These LEDs are compatible with IR soldering process. This super wide viewing angle at 120° together with the built in reflector pushing up the intensity of the light output makes these LED suitable to be used in the interior electronics signs. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. This is suitable for general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. • High brightness using AlInGaP and InGaN dice technologies • Available in 8mm carrier tape on 7-inch reel • Compatible with IR soldering process • Black surface RGB PLCC-4 for higher contrast • JEDEC MSL 2a Applications • Electronic Signs and Signals - Exterior and Interior Full Color Sign - Variable Message Sign • Interior automotive - Instrument cluster backlighting - Central console backlighting - Cabin backlighting • Office automation, Home appliances, Industrial Equipment - Front panel backlighting - Display backlighting CAUTION: ASMT-QTB2-xxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.  Package Dimensions Notes: 1. All Dimensions are in millimeters. 2. Tolerance = ±0.2 mm unless otherwise specified. 3. Terminal Finish: Ag plating 4. Encapsulation material: Silicone resin Lead Configuration 1 Cathode Red 2 Common Anode 3 Cathode Blue 4 Cathode Green Figure 1. Package Drawing Table 1. Device Selection Guide Tri Color Part Number Color 1 Color 2 Color 3 ASMT-QTB2-0xxxx AlInGaP Red InGaN Green InGaN Blue Color 1 Color 2 Color 3 Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA Part Number Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) ASMT-QTB2-0A002 T2 355 505 V1 715 1015 S2 224 325 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ± 12 %  Part Numbering System A S M T – Q T B 2 – X1 X2 X3 X4 X5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Table 2. Absolute Maximum Ratings (Ta = 25°C) Parameter Red Green & Blue Unit DC forward current [1] 50 30 mA Peak forward current [2] 100 300 mA Power dissipation 130 117 mW Reverse voltage 4V V Maximum junction temperature Tj max 125 °C Operating board temperature, Ta range - 40 to + 110 °C Storage temperature range - 40 to + 110 °C Note: 1. Derate Linearly as shown in Figure 5a & 5b. 2. Duty Factor = 0.5%, Frequency = 500Hz Table 3. Optical Characteristics (Ta = 25°C) Dominant Wavelength, ld (nm) [1] Peak Wavelength, lp (nm) Viewing Angle, 2q½ [2] (Degrees) Luminous Efficacy, hV [3] (lm/W) Luminous Efficiency, he (lm/W) Luminous Intensity / Total Flux, [4] IV (cd) / FV (lm) Typ. Typ. Typ. Typ. Typ. Typ. Color Dice Technology Red AlInGaP 628 639 120 160 30 0.35 Green InGaN 526 519 120 530 45 0.35 Blue InGaN 472 467 120 70 15 0.35 Notes: 1. The chromaticity coordinates and dominant wavelength are derived from the CIE Chromaticity Diagram and represent the perceived color of the device. The values area average for all LEDs in the product. 2. The total spectral width at 1/2 of the peak intensity for all LEDs of a specific color. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt. 4. FV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. Table 4. Electrical Characteristics (Tj = 25°C) Forward Voltage VF (V) [1] Reverse Voltage VR @ 10mA Thermal Resistance RqJ-P (°C/W) Color Typ. Max. Min. Min. Typ. Red 2.06 2.60 4 - 95 Green 3.32 3.90 - 4 70 Blue 3.32 3.90 - 4 60 Note: 1. Tolerance ± 0.1V.  Reverse Voltage VR @ 100mA 1.0 RELATIVE INTENSITY InGaN Green InGaN Blue 0.8 AlInGaP Red 0.6 0.4 0.2 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm Figure 2. Relative intensity vs. wavelength 60 3.00 40 RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 20 mA) FORWARD CURRENT - mA 50 AlInGaP 30 InGaN 20 10 0 0 1 2 3 2.50 1.50 InGaN 1.00 0.50 0.00 4 AlInGaP 2.00 0 10 20 30 40 DC FORWARD CURRENT - mA FORWARD VOLTAGE - V Figure 3. Forward current vs. forward voltage 60 AlInGaP 40 InGaN 30 AlInGaP 50 FORWARD CURRENT - mA FORWARD CURRENT - mA 50 20 10 40 InGaN 30 20 10 Derating Curve - 1 Chip On Derating Curve - 3 Chips On 0 20 40 60 80 100 120 AMBIENT TEMPERATURE - °C Figure 5a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C, RθJA = 600°C/W (3 chip on).  60 Figure 4. Relative Intensity vs. forward current 60 0 50 0 0 20 40 60 80 AMBIENT TEMPERATURE - °C 100 120 Figure 5b. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C, RθJA = 340°C/W (1 chip on). 1 650 AlINGaP Red 0.9 DOMINANT WAVELENGTH - nm NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 600 InGaN Green 550 500 InGaN Blue 450 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 6. Radiation pattern. Figure 8. Recommended soldering land pattern.  60 90 400 0 10 20 30 FORWARD CURRENT - mA Figure 7. Dominant wavelength vs. forward current 40 50 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 100-150°C 183°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. TEMPERATURE TEMPERATURE 20 SEC. MAX. 217 °C 200 °C 255 - 260°C 3°C/SEC.MAX. 6°C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 60-150 SEC. TIME TIME Figure 9. Recommended leaded reflow soldering profile. Figure 10. Recommended Pb-free reflow soldering profile. (Acc. To J-STD-020C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. Figure 11. Carrier Tape Dimension 2 +0.5 -0 ∅20.5 ± 0.3 62.5 180 +0 -2.5 ∅13 ± 0.2 13.2 ± 0.50 (MEASURED AT OUTER EDGE) 16.2 ± 0.50 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) Figure 12. Reel Dimension.  USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling Orientation. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at