ASMT-QWBB-NGH0E

ASMT-QWBB-Nxxxx Super 0.5W Cool White Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5W Cool White Power PLCC-4 SMT LED is Cool white mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. • Industry Standard PLCC 4 platform (3.2x2.8x1.9mm) The Super 0.5W Cool White Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. • Low Thermal Resistance 40°C/W To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. • High reliability package with enhanced silicone resin encapsulation • High brightness with optimum flux performance using InGaN chip technologies • Available in Cool White • Available in 8mm carrier tape & 7 inch reel • Wide viewing angle at 120 degree • JEDEC MSL 2 Applications 1. Interior automotive a. Instrument panel backlighting b. Central console backlighting c. Navigation and audio system backlighting d. Dome/Map lighting e. Push button backlighting f. Puddle lamp g. Glove compartment illumination 2. Exterior automotive a. Number plate illumination 3. Electronic signs and signals a. Decorative lighting 4. Office automation, home appliances, industrial equipment a. Panel/button backlighting b. Display backlighting CAUTION: ASMT-QWBB-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing 1.9 ± 0.2 2.2 ± 0.2 A C C 1.15 ± 0.2 0.97 0.56 (TYP.)  2.4 3.2 ± 0.2 3.6 ± 0.2 0.41 (TYP.) A 0.6 ± 0.3 0.79 ± 0.3 2.8 ± 0.2 0.7 CATHODE MARKING Note: 1. All Dimensions in millimeters. 2. Lead Polarity as shown in Figure 13. 3. Terminal Finish: Ag plating 4. Encapsulation material: Silicone resin Figure 1. Package Drawing Table 1. Device Selection Guide (TJ = 25 °C) Luminous Flux, ΦV[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Cool White ASMT-QWBB-NHH0E 25.5 29.0 33.0 150 InGaN Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12% Part Numbering System A S M T - Q X1 B B – N X 2 X 3 X 4 X 5 Packaging Option Colour Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color W - Cool White 2 Table 2. Absolute Maximum Ratings (TA = 25°C) Parameters ASMT-QWBB-Nxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 615 mW Reverse Voltage Not Recommended Junction Temperature 125°C Operating Temperature -40°C to +110°C Storage Temperature -40°C to +110°C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TJ = 25°C) Color Part Number Dice Technology Cool White ASMT-QWBB-Nxxxx InGaN Typical Chromaticity Coordinates Viewing Angle 2θ½[1] (Degrees) Luminous Efficiency ηe (lm/W) Total Flux / Luminous Intensity ΦV (lm) / IV (cd) x y Typ. Typ. Typ. 0.32 0.31 120 48 2.85 Notes: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Table 4. Electrical Characteristics (TJ = 25°C) Forward Voltage VF (Volts) @ IF = 150 mA Part Number Typ. Max. Thermal Resistance RθJ-P (°C/W) ASMT-QWBB-NxxxE 3.5 4.1 40 3 300 250 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 200 150 100 50 0 780 NORMALIZED LUMINOUS FLUX (NORMALIZED AT 25°C) RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 DC FORWARD CURRENT - mA 125 3 4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 150 -25 0 25 50 T J - JUNCTION TEMPERATURE - °C 75 100 Figure 5. Relative Flux Vs. Temperature Figure 4. Relative Flux vs. Forward Current 160 160 140 140 RJA = 90°C/W 120 RJA = 110°C/W 100 80 60 100 80 60 40 40 20 20 0 20 40 60 80 TEMPERATURE (°C) RJP = 40°C/W 120 CURRENT - mA CURRENT - mA 2 FORWARD VOLTAGE - V 1.4 1.0 100 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W. 4 1 Figure 3. Forward Current Vs. Forward Voltage Figure 2. Relative Intensity Vs. Wavelength 0 0 120 0 0 20 40 60 80 TEMPERATURE (°C) 100 Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 125°C, RθJ-P=40°C/W. 120 0.40 0.40 D= D= 0.05 0.10 0.25 0.50 1 0.20 0.10 t D= p T 0.00 0.00001 0.0001 0.001 0.01 0.1 tp - Time - (s) 0.30 0.20 IF T 0 10 0.00 0.00001 0.0001 0.001 100 FORWARD VOLTAGE SHIFT - V COORDINATE SHIFT 0.000 Cx -0.005 Cy 0 50 100 150 200 FORWARD CURRENT - mA 250 300 Figure 8. Chromaticity shift vs forward current NORMALIZED INTENSITY 10 100 0 25 50 75 TJ - JUNCTION TEMPERATURE - °C 100 0.15 -0.010 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 10. Radiation Pattern 5 0 0.20 0.005 -90 0.01 0.1 tp - Time - (s) Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA = 85°C, RθJ-A=110°C/W. 0.010 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 IF T 0.10 tp Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA = 25°C, RθJ-A=110°C/W. -0.015 tp D= 0.05 0.10 0.25 0.50 1 CURRENT - A CURRENT - A 0.30 tp T 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -50 -25 Figure 9. Forward Voltage Shift Vs. Temperature 90 TEMPERATURE 10 to 30 SEC. 255 - 260°C 3°C/SEC. MAX. 217 °C 200 °C 6°C/SEC. MAX. ID 150 °C Note: Diameter "ID" should be bigger than 2.3mm 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J - STD-020C) Figure 12. Recommended Pb-free Reflow Soldering Profile Figure 11. Recommended Pick and Place Nozzle Size Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 2.4 0.6 0.9 X 6 1.3 x 6 A A A 0.4 A 1.1 C C C C CATHODE MARKING C 0.3 SOLDER MASK A ANODE C CATHODE Figure 13. Recommended Soldering Pad Pattern 6 4.6 C CATHODE MARKING MINIMUM 55 mm2 OF CATHODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 14. Tape Leader and Trailer Dimensions Ø1.5 4 ± 0.1 +0.1 –0 4 ± 0.1 2 ± 0.05 1.75 ± 0.1 2.29 ± 0.1 C C A A 3.5 ± 0.05 8 +0.3 –0.1 3.05 ± 0.1 +0.1 Ø1 –0 0.229 ± 0.01 8° ALL DIMENSIONS IN mm. Figure 15. Tape Dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 16. Reeling Orientation 7 3.8 ± 0.1 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Device Color (X1) W Cool White Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Moisture Sensitivity Flux Bin Limits This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. Bin ID Min. (lm) Max. (lm) 0 3.40 4.30 A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 A. Storage before use D 9.00 11.50 - Unopen moisture barrier bag (MBB) can be stored at