ASMT-QYBF-NJK0E

ASMT-QYBF-NJK0E Super 0.5 W Warm White Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5 W Warm White Power PLCC-4 SMT LED is using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED.  Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9 mm) The Super 0.5 W Warm White Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions.  Available in 8 mm carrier tape & 7 inch reel To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity.  High reliability package with enhanced silicone resin encapsulation  High brightness with optimum flux performance using InGaN chip technologies  Available in Warm White  Wide viewing angle at 120 degree  JEDEC MSL 2 Applications  Interior automotive a. Instrument panel backlighting b. Central console backlighting c. Navigation and audio system backlighting d. Dome/Map lighting e. Push button backlighting f. Puddle lamp g. Glove compartment illumination  Electronic signs and signals a. Decorative lighting  Office automation, home appliances, equipment a. Panel/button backlighting b. Display backlighting industrial  Others Illuminations Advertising board Back lighting CAUTION: LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Package Drawing 0.79 ± 0.3 2.8 ± 0.2 2.2 ± 0.2 A C C 0.7 1.9 ± 0.2 0.6 ± 0.3 1.15 ± 0.2 0.56 (TYP.) 0.97 Ø 2.4 3.6 ± 0.2 3.2 ± 0.2 0.41 (TYP.) A CATHODE MARKING Notes: 1. All dimensions in millimeters. 2. Terminal finish: ag plating. 3. Encapsulation material: silicone resin. Device Selection Guide (TJ = 25° C) Luminous Flux, V [1] (lm) Color Part Number Min Typ Max Test Current (mA) Dice Technology Warm White ASMT-QYBF-NJK0E 33 39 56 150 InGaN Notes: 1. V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance ±12%. Part Numbering System ASMT – Q X1 BF – N X2 X3 X4 X5 Packaging Option Color Bin Selection Maximum Flux Bin Selection Minimum Flux Bin Selection Color Y : Warm White 2 Absolute Maximum Ratings (TA = 25 °C) Parameter Rating Unit DC Forward Current 150 mA Peak Forward Current [1] 300 mA Power Dissipation 570 mW Reverse Voltage Not Recommended V Junction Temperature 125 °C Operating Temperature -40 to +120 °C Storage Temperature -40 to +120 °C Note: 1. Duty Factor = 10%, Frequency = 1 kHz Optical / Electrical Characteristics (TJ = 25° C, IF = 150 mA) Viewing Angle 2½ [1] (Degree) Luminous Efficiency e (lm/W) Forward Voltage VF (Volt) CCT (K) Typ Typ Typ Max Thermal Resistance RJ-P (°C/W) 2500 ~ 4800 120 78 3.30 3.50 50 Note: 1. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 3 1.8 1.4 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 1.6 1.2 1 0.8 0.6 0.4 0.2 0 0 50 100 150 200 250 DC FORWARD CURRENT - mA 300 350 Figure 1. Relative luminous flux vs Forward current 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 780 Figure 2. Color spectrum 350 1 FORWARD CURRENT - mA NORMALIZED INTENSITY 300 0.75 0.5 0.25 250 200 150 100 50 0 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 3. Radiation Pattern RELATIVE LUMINOUS FLUX (NORMALIZE AT 25°) 1.0 0.8 0.6 0.4 0.2 -40 -15 10 35 60 85 JUNCTION TEMPERATURE, TJ -°C Figure 5. Relative flux vs Temperature 4 1 2 FORWARD VOLTAGE - V Figure 4. Forward current vs Forward voltage 1.2 0.0 0 110 3 4 0.02 0.030 COORDINATE SHIFT 0.015 CHROMATICITY COORDINATE SHIFT X-Coordinate Y-Coordinate 0.01 0.005 0 -0.005 -0.01 -0.015 -0.02 100 200 FORWARD CURRENT - mA -0.020 -40 0.40 0.160 0.30 0.140 0.20 0.120 FORWARD CURRENT - A FORWARD VOLTAGE SHIFT - V -0.010 -15 10 35 60 85 JUNCTION TEMPERATURE, TJ -°C 110 Figure 7. Chromaticity shift vs Temperature 0.10 0.00 -0.10 -0.20 0.100 0.080 0.060 0.040 0.020 -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 Duty cycle D = parameter, TA = 25° C 0.35 D= 0.05 0.10 0.25 0.50 1 0.30 0.25 0.20 t D= p T 0.05 0.00 1.00E-05 1.00E-03 1.00E-01 tp - Time - (S) 20 40 60 80 100 AMBIENT TEMPERATURE - °C 120 140 Duty cycle D = parameter, TA = 85° C 0.30 D= 0.25 0.15 0.10 0 Figure 9. Maximum forward current vs. Ambient temperature. Derated base on Tj max 125° C, Rja 150°C/W. CURRENT - A 0.35 0.000 150 Figure 8. Relative forward voltage shift vs Temperature CURRENT - A 0.000 300 Figure 6. Chromaticity shift vs Forward current IF tp T tp IF T D= 0.05 0.10 0.25 0.50 1 0.20 0.15 0.10 tp 0.05 T 1.00E+01 Figure 10. Maximum pulse current vs Ambient temperature TA = 25° C 5 0.010 -0.030 0 -0.30 X-Coordinate Y-Coordinate 0.020 0.00 1.00E-05 1.00E-03 1.00E-01 tp - Time - (S) 1.00E+01 Figure 11. Maximum pulse current vs Ambient temperature TA = 85° C TEMPERATURE 10 to 30 SEC. D 217° C 200° C 255 - 260° C 3° C / SEC. MAX. 6° C / SEC. MAX. 150° C 3° C / SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Note: Diameter “D” should be smaller than 2.2 mm SMT LED Indicator Components Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting Figure 12. Recommended pick and place nozzle size Figure 13. Recommended Pb free reflow soldering profile 2.4 0.6 0.9 X 6 1.3 x 6 A A A 0.4 A 1.4 C C C C CATHODE MARKING C 0.3 SOLDER MASK A ANODE C CATHODE Figure 14. Recommended soldering pad pattern 6 4.6 C CATHODE MARKING MINIMUM 55 mm2 OF CATHODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 15. Tape leader and trailer dimensions 4 ± 0.1 4 ± 0.1 1.75 ± 0.1 2 ± 0.05 2.29 ± 0.1 1.5 +0.1 –0 3.5 ± 0.05 C 8 +0.3 –0.1 C 3.8 ± 0.1 A A 3.05 ± 0.1 1 +0.1 –0 0.229 ± 0.01 8° Figure 16. Tape dimensions 7 Handling Precaution Device Color (X1) The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Y Flux Bin Select (X2X3) X2 Min Flux Bin Moisture Sensitivity X3 Max Flux Bin This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Flux Bin A. Storage before use – Unopen moisture barrier bag (MBB) can be stored at