ASMT-QYBG-NEGHE

ASMT-QYBG, ASMT-QYBH 0.5 W Warm White Power PLCC4 Surface Mount LED Data Sheet Description Features The Avago Technologies ASMT-QYBx series 0.5W Warm White Power PLCC4 SMT LED lamps use InGaN chip technology and superior package design to enable them to produce higher light output with better flux performance. They can be driven at high current and are able to dissipate the heat more efficiently resulting in better performance with higher reliability. These lamps are able to operate under a wide range of environmental conditions making them ideal for various applications including fluorescent replacement, under cabinet lighting, retail display lighting and panel lights. • 2700 K to 3500 K CCT To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. • ANSI bin • Wide view angle 120° • High reliability package with enhanced silicone resin encapsulation Applications • Fluorescent replacement • Under cabinet lighting • Panel lights • Retail display lighting CAUTION: Static sensitive device. Please observe appropriate precautions during handling and processing. Package Drawing 1.10 CATHODE MARK. 0.45 2.60 1 3.5 2.4 4 2.80 2 1.30 3 0.75 0.56 3.2 Isolated Heat Pad 3.50 3 2 4 1 Notes: 1. Dimensions in mm. 2. Tolerance xx.x ± 0.2. 3. Tolerance xx.xx ± 0.1. 4. Terminal Finish: Ag plating. Device Selection Guide CRI Luminous Flux (lm)1,2 Color Part Number CCT (K) Typ Min Typ Max Test Current (mA) Warm White ASMT-QYBG-NEG1E 2700 ~ 3500 85 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBG-NEGGE 3500 85 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBG-NEGHE 3000 85 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBG-NEGJE 2700 85 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBH-NEG1E 2700 ~ 3500 75 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBH-NEGGE 3500 75 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBH-NEGHE 3000 75 39.8 41.8 56.8 150 InGaN Warm White ASMT-QYBH-NEGJE 2700 75 39.8 41.8 56.8 150 InGaN Notes: 1. Luminous flux is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance ±12%. 2 Chip Part Numbering System ASMT – Q X 1 B x – N X 2 X 3 X 4 X 5 Packaging Option Colour Bin Max Flux Bin Min Flux Bin Color W − Cool White Y − Warm White Absolute Maximum Ratings (TA = 25° C) Parameter Rating Unit DC Forward Current 180 mA Peak Forward Current (D = 10%, f = 1 kHz) 300 mA Power Dissipation 640 mW Reverse Voltage Not recomended V Junction Temperature 125 °C Operating Temperature -40 to 100 °C Storage Temperature -40 to 100 °C Optical / Electrical Characteristics (TJ = 25° C) Parameter Test Condition Min Viewing Angle 2θ½1 Max 120 Forward Voltage VF2 IF = 150 mA Thermal Resistance RTH junction to pin 2.8 Notes: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 2. Tolerance ±0.1 V. 3 Typ 3.2 40 Unit degree 3.4 V °C/W 1.8 350 300 1.4 FORWARD CURRENT - mA RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 1.6 1.2 1 0.8 0.6 0.4 0 50 100 150 200 DC FORWARD CURRENT - mA 250 RELATIVE EMISSION INTENSITY NORMALIZED INTENSITY 0.75 0.5 0.25 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 FORWARD CURRENT- A RELATIVE LIGHT OUTPUT 1 0.8 0.6 0.4 0.2 0 Figure 5. Relative Light Output 1 2 FORWARD VOLTAGE - V 3 4 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 CRI 75 CRI 85 380 480 580 WAVELENGTH - nm 680 780 Figure 4. Spectrum Distribution 1.2 -20 0 Figure 2. Forward Current vs. Forward Voltage Figure 3. Radiation Diagram 4 100 0 1 0 -40 150 300 Figure 1. Relative Luminous Flux vs. Forward Current 0 200 50 0.2 0 250 20 40 TJ - °C 60 80 100 120 0.200 0.180 0.160 0.140 0.120 0.100 0.080 0.060 0.040 0.020 0.000 0 20 40 60 80 100 AMBIENT TEMPERATURE- °C Figure 6. Forward Current Derating Curve. RTHja 130°C/W. 120 140 ID OD ID = 1.7 mm OD = 3.5 mm Figure 7. Recommended Pick and Place Nozzle Size 2.9 TEMPERATURE 10 to 30 SEC. 217° C 200 ° C 0.95 255 - 260° C 3°C/SEC. MAX. 6°C/SEC. MAX. 150 ° C 3°C/SEC. MAX. 100 SEC. MAX. TIME (Acc. to J-STD-020C) Figure 8. Recommended Pb Free Reflow Soldering Profile USER FEED DIRECTION CATHODE SIDE Figure 10. Reeling Orientation 5 0.76 0.72 60 - 120 SEC. PRINTED LABEL 4.1 0.85 Figure 9. Recommended Solder Pad 179.00 ± 0.50 1.15 ± 0.15 13.60 ± 1.00 1.10 ± 0.15 ∅ 10 .00 57 ∅1 ∅5 8.0 0 ∅ 76. .00 58 15.8 ± 1.0 Figure 11. Reel Dimensions 1.5 + 0.1 0 Package Marking 2 ±0.05 4 ±0.1 1.75 ±0.1 5.5 ±0.05 + – + – 3.8 ±0.1 3.8 ±0.1 Figure 12. Carrier Tape Dimensions 6 8 ±0.1 12 ±0.3 Handling Precaution Device Color (X1) The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. W Cool White Y Warm White Flux Bin (X2X3) Individual reel will contain parts from one bin only. Moisture Sensitivity X2 Min Flux Bin This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. X3 Max Flux Bin Bin Min (lm) Max (lm) A. Storage before use A 18.1 23.5 B 23.5 30.6 - Unopen moisture barrier bag (MBB) can be stored at