ASMT-UWB1-NX3J2

ASMT-UWB1-Nxxxx OneWhite Surface Mount PLCC-2 LED Indicator Data Sheet Description Features This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used as interior signs application conditions. • High reliability package with silicone encapsulation To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin. • JEDEC MSL 3 product These LEDs are compatible with reflow soldering process. The wide viewing angle at 120° makes these LEDs ideally suited for panel, push button, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. • Compatible with reflow soldering process • High optical efficiency with 100 lm/W • Available in 8 mm carrier tape with reel diameter 180mm • ESD threshold of 1000 V (HBM model) per Jedec Applications • Non-automotive use • General Signage backlighting • Amusement machine backlighting • Industrial lighting • Light strips CAUTION: LEDs are ESD sensitive. Please observe appropriate precautions during handling and processing. Package Drawing 2.8 ± 0.2 1.9 ± 0.2 2.2 ± 0.2 0.1 TYP. 3.2 ± 0.2 0.8 ± 0.1 3.5 ± 0.2 0.8 ± 0.3 0.5 ± 0.1 CATHODE MARKING Notes: 1. All dimensions in millimeters. 2. Terminal finish = Ag plating. Device Selection Guide Luminous Intensity (mcd) [1,2] Min Typ Max Test Current (mA) Chip Color Part Number CCT (K) White ASMT-UWB1-NX302 4500 ~ 8000 1800 2300 3550 20 InGaN White ASMT-UWB1-NX312 2700 ~ 4000 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3A2 8000 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3B2 6500 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3C2 5700 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3D2 5000 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3E2 4500 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3F2 4000 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3G2 3500 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3H2 3000 1800 2300 3550 20 InGaN White ASMT-UWB1-NX3J2 2700 1800 2300 3550 20 InGaN White ASMT-UWB1-NX7B2 6500 2240 - 4500 20 InGaN White ASMT-UWB1-NX7D2 5000 2240 - 4500 20 InGaN White ASMT-UWB1-NX7C2 5700 2240 - 4500 20 InGaN Notes: 1. The luminous intensity is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance ±12% 2 Part Numbering System AS MT – U X1 B1 – N X2 X3 X4 X5 Packaging Option Color Bin Selection Intensity Bin Selection LED Chip Color Absolute Maximum Ratings (TA = 25° C) Parameters Rating DC Forward Current (1) 30 mA Peak Forward Current (2) 100 mA Power Dissipation 108 mW Junction Temperature 110° C Operating Temperature -40° C to +100° C Storage Temperature -40° C to +100° C Notes: 1. Derate linearly as shown in derating curve. 2. Duty Factor = 10%, Frequency = 1 kHz Optical Characteristics (TA = 25° C) Color Part Number Dice Technology White ASMT-UWB1 InGaN Typ. Chromaticity Coordinates (1) Viewing Angle 2θ½ (2) (Degrees) Luminous Efficiency ηe (lm/W) Total Flux / Luminous Intensity θV (lm) / IV (cd) CRI x y Typ. Typ. Typ. Min. 0.33 0.34 120 100 2.8 70 Notes: 1. The chromaticity coordinates are derived from the CIE 1931Chromaticity diagram and represents the perceived color of the device. 2. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (TA = 25° C) Forward Voltage VF (Volts) @ IF = 20 mA Reverse Voltage VR (1) @ 10 mA Color Part Number Min. Max. Min. Thermal Resistance RθJ-P (°C/W) White ASMT-UWB1 2.8 3.6 5 150 Note: 1. Reverse Voltage indicates product final test condition. Long term reverse bias is not recommended. 3 1.6 30 1.4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT (mA) 35 25 20 15 10 5 0 0 1 2 FORWARD VOLTAGE (V) 3 4 Figure 1. Forward current vs. forward voltage 0.003 Y -0.001 -0.002 10mA -0.003 -0.004 -0.005 0.6 0.4 0.2 0 5 30 35 1 20mA 0 0.8 10 15 20 25 DC FORWARD CURRENT (mA) Figure 2. Relative intensity vs. forward current NORMALIZED INTENSITY 0.001 1 0 30mA 0.002 1.2 0.75 0.5 0.25 5mA -0.006 -0.0014 -0.001 -0.0006 -0.0002 0 0.0002 0 0.0006 -90 -60 X Figure 3. Chromaticity shift vs. current -30 0 30 ANGULAR DISPLACEMENT (°) 60 90 Figure 4. Radiation pattern 30 10 - 30 SEC. 25 TEMPERATURE MAXIMUM FORWARD CURRENT (mA) 35 20 15 10 5 0 255 - 260° C 3°C/SEC. MAX. 6°C/SEC. MAX. 150° C 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 40 60 80 100 AMBIENT TEMPERATURE (°C) Figure 5. Maximum forward current vs. ambient temperature. Derated based on Tjmax 110° C, Rthja 600°C/W 4 217° C 200° C 0 20 120 TIME Figure 6. Recommended Pb-free reflow soldering profile (Acc. to J-STD-020C) 2.60 1.50 4.50 SOLDER RESIST Figure 8. Recommended Soldering Pad Pattern END START THERE SHALL BE A MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 400 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. USER FEED DIRECTION Figure 9. Tape Leader and Trailer Dimensions 2.00 ±0.05 Cathode Marking 4.00 ±0.1 1.55 ±0.05 1.75 ±0.1 3.5 ±0.1 3.85 ±0.1 4.00 ±0.1 2.15 ±0.1 Figure 10. Tape Dimensions (Unit: mm) 5 3.10 ±0.1 8.00 ±0.1 Ø 20.5 ± 0.3 2 +0.5 –0 62.5 180 +0 –2.5 Ø 13 ± 0.2 +1.50 8.4 –0.00 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) 7.9 (MIN.) 10.9 (MAX.) Figure 10. Reel Dimensions (Unit: mm) USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 11. Reel Orientation 6 Intensity Bin Select (X2 X3) Individual reel will contain parts from one half bin only. Color Bin Selection (X4) X2 Individual reel will contain parts from one full bin only. Min IV Bin X4 X3 Bin Color Bin ID 0 Full Distribution A 1A, 1B, 1C, 1D 3 3 half bins starting from x21 B 2A, 2B, 2C, 2D 4 4 half bins starting from x21 C 3A, 3B, 3C, 3D 5 5 half bins starting from x21 D 4A, 4B, 4C, 4D 7 3 half bins starting from x22 E 5A, 5B, 5C, 5D 8 4 half bins starting from x22 F 6A, 6B, 6C, 6D 9 5 half bins starting from x22 G 7A, 7B, 7C, 7D H 8A, 8B, 8C, 8D J 9A, 9B, 9C, 9D K 1A, 1B, 1C, 1D, 2A, 2B, 2C, 2D, L 2A, 2B, 2C, 2D, 3A, 3B, 3C, 3D M 3A, 3B, 3C, 3D, 4A, 4B, 4C, 4D N 4A, 4B, 4C, 4D, 5A, 5B, 5C, 5D Q 6A, 6B, 6C, 6D, 7A, 7B, 7C, 7D R 7A, 7B, 7C, 7D, 8A, 8B, 8C, 8D S 8A, 8B, 8C, 8D, 9A, 9B, 9C, 9D 0 1A, 1B, 1C, 1D, 2A, 2B, 2C, 2D, 3A, 3B, 3C, 3D, 4A, 4B, 4C, 4D, 5A, 5B, 5C, 5D 1 6A, 6B, 6C, 6D, 7A, 7B, 7C, 7D, 8A, 8B, 8C, 8D, 9A, 9B, 9C, 9D Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) X1 1800 2240 X2 2240 2850 Y1 2850 3550 Y2 3550 4500 Z1 4500 5600 Z2 5600 7150 AA 2000 2500 Tolerance of each bin limit = ±12% 7 Color Bin ID Limits Color Bin ID Chromaticity Coordinates Limits 1A x 0.2950 0.2920 0.2984 0.3009 y 0.2970 0.3060 0.3133 0.3042 x 0.2920 0.2895 0.2962 0.2984 y 0.3060 0.3135 0.3220 0.3133 1B 1C 1D 2A 2B 2C 2D 3A 3B 3C 3D 4A 4B 4C 4D 5A 5B 5C 5D x 0.2984 0.2962 0.3028 0.3048 y 0.3133 0.3220 0.3304 0.3207 x 0.2984 0.3048 0.3068 0.3009 y 0.3133 0.3207 0.3113 0.3042 x 0.3048 0.3130 0.3144 0.3068 y 0.3207 0.3290 0.3186 0.3113 x 0.3028 0.3115 0.3130 0.3048 y 0.3304 0.3391 0.3290 0.3207 x 0.3115 0.3205 0.3213 0.3130 y 0.3391 0.3481 0.3373 0.3290 x 0.3130 0.3213 0.3221 0.3144 y 0.3290 0.3373 0.3261 0.3186 x 0.3215 0.3290 0.3290 0.3222 y 0.3350 0.3417 0.3300 0.3243 x 0.3207 0.3290 0.3290 0.3215 y 0.3462 0.3538 0.3417 0.3350 x 0.3290 0.3376 0.3371 0.3290 y 0.3538 0.3616 0.3490 0.3417 x 0.3290 0.3371 0.3366 0.3290 y 0.3417 0.3490 0.3369 0.3300 x 0.3371 0.3451 0.3440 0.3366 y 0.3490 0.3554 0.3427 0.3369 x 0.3376 0.3463 0.3451 0.3371 y 0.3616 0.3687 0.3554 0.3490 x 0.3463 0.3551 0.3533 0.3451 y 0.3687 0.3760 0.3620 0.3554 x 0.3451 0.3533 0.3515 0.3440 y 0.3554 0.3620 0.3487 0.3427 x 0.3530 0.3615 0.3590 0.3512 y 0.3597 0.3659 0.3521 0.3465 x 0.3548 0.3641 0.3615 0.3530 y 0.3736 0.3804 0.3659 0.3597 x 0.3641 0.3736 0.3702 0.3615 y 0.3804 0.3874 0.3722 0.3659 x 0.3615 0.3702 0.3670 0.3590 y 0.3659 0.3722 0.3578 0.3521 Tolerance of each bin limit = ±0.01 8 Color Bin ID Chromaticity Coordinates Limits 6A x 0.3670 0.3702 0.3825 0.3783 y 0.3578 0.3722 0.3798 0.3646 x 0.3702 0.3736 0.3869 0.3825 y 0.3722 0.3874 0.3958 0.3798 x 0.3825 0.3869 0.4006 0.3950 y 0.3798 0.3958 0.4044 0.3875 x 0.3783 0.3825 0.3950 0.3898 y 0.3646 0.3798 0.3875 0.3716 x 0.3889 0.3941 0.4080 0.4017 y 0.3690 0.3848 0.3916 0.3751 x 0.3941 0.3996 0.4146 0.4080 y 0.3848 0.4015 0.4089 0.3916 x 0.4080 0.4146 0.4299 0.4221 y 0.3916 0.4089 0.4165 0.3984 x 0.4017 0.4080 0.4221 0.4147 y 0.3751 0.3916 0.3984 0.3814 x 0.4147 0.4221 0.4342 0.4259 y 0.3814 0.3984 0.4028 0.3853 x 0.4221 0.4299 0.4430 0.4342 y 0.3984 0.4165 0.4212 0.4028 x 0.4342 0.4430 0.4562 0.4465 y 0.4028 0.4212 0.4260 0.4071 x 0.4259 0.4342 0.4465 0.4373 y 0.3853 0.4028 0.4071 0.3893 x 0.4373 0.4465 0.4582 0.4483 y 0.3893 0.4071 0.4099 0.3919 x 0.4465 0.4562 0.4687 0.4582 y 0.4071 0.4260 0.4289 0.4099 x 0.4582 0.4687 0.4813 0.4700 y 0.4099 0.4289 0.4319 0.4126 x 0.4483 0.4582 0.4700 0.4593 y 0.3919 0.4099 0.4126 0.3944 6B 6C 6D 7A 7B 7C 7D 8A 8B 8C 8D 9A 9B 9C 9D Tolerance of each bin limit = ±0.01 0.4400 3000K 3500K 0.4200 8B 4000K 0.4000 5000K 0.3800 5C 5700K Y 0.3600 6500K 0.3400 8OOOK 2C 2B 2D 1C 2A 1B 1D 1A 0.3200 0.3000 0.2800 0.2800 0.3000 3B 3A 0.3200 4500K 5B 4C 5D 4B 5A 4D 3C 4A 3D 0.3400 6B 6A 0.3600 7A 6D 0.3800 7C 7B 6C 7D 0.4000 8A 0.4200 8C 8D 9A 0.4400 2700K 9B 9C 9D 0.4600 0.4800 X Figure 11. Color Bins Packaging Option (X5) Forward Voltage Bin Option Test Current Package Type Reel Size Bin ID Min. Max 2 20 mA Top Mount 7 Inch F03 2.4 2.6 F04 2.6 2.8 F05 2.8 3.0 F06 3.0 3.2 Tolerance of each bin limit = ±0.1 V 9 0.5000 PRECAUTIONARY NOTES 1. Handling precautions 2. Handling of moisture sensitive device The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Special handling precautions need to be observed during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Do refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for more information. a. Do not poke sharp objects into the silicone encapsulant. Sharp object like tweezers or syringes might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. b. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. The LED should only be held by the body. c. Do no stack assembled PCBs together. Use an appropriate rack to hold the PCBs. d. Surface of silicone material attracts dusk and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, a cotton bud can be used with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. e. For automated pick and place, Avago has tested nozzle size below to be working fine with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/ model and other settings of the machine, customer is recommended to verify the nozzle selected will not cause damage to the LED. ID Note: Diameter "ID" should be bigger than 2.3mm This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use - An unopened moisture barrier bag (MBB) can be stored at