ASMT-UWBG-NACC8

ASMT-UWBG, ASMT-UWBH 0.25 W Cool White Power PLCC4 Surface Mount LED Data Sheet Description Features The Avago Technologies ASMT-UWBx series 0.25W Cool White Power PLCC4 SMT LED lamps use InGaN chip technology and superior package design to enable them to produce higher light output with better flux performance. They can be driven at high current and are able to dissipate the heat more efficiently resulting in better performance with higher reliability. These lamps are able to operate under a wide range of environmental conditions making them ideal for various applications including fluorescent replacement, under cabinet lighting, retail display lighting and panel lights. • 4000 K to 8000 K CCT To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. • ANSI bin • Wide view angle 120° • High reliability package with enhanced silicone resin encapsulation Applications • Fluorescent replacement • Under cabinet lighting • Panel lights • Retail display lighting CAUTION: Static sensitive device. Please observe appropriate precautions during handling and processing. Package Drawing 1.10 CATHODE MARK. 0.45 2.60 1 3.5 2.4 4 2.80 2 1.30 3 0.75 0.56 3.2 Isolated Heat Pad 3.50 3 2 4 1 Notes: 1. Dimensions in mm. 2. Tolerance xx.x ± 0.2. 3. Tolerance xx.xx ± 0.1. 4. Terminal Finish: Ag plating. Device Selection Guide CRI Luminous Flux (lm)1,2 Color Part Number CCT (K) Typ Min Typ Max Test Current (mA) Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White Cool White ASMT-UWBG-NAC08 ASMT-UWBG-NACA8 ASMT-UWBG-NACB8 ASMT-UWBG-NACC8 ASMT-UWBG-NACD8 ASMT-UWBG-NACE8 ASMT-UWBG-NACF8 ASMT-UWBH-NBD08 ASMT-UWBH-NBDA8 ASMT-UWBH-NBDB8 ASMT-UWBH-NBDC8 ASMT-UWBH-NBDD8 ASMT-UWBH-NBDE8 ASMT-UWBH-NBDF8 4000 ~ 8000 8000 6500 5700 5000 4500 4000 4000 ~ 8000 8000 6500 5700 5000 4500 4000 85 85 85 85 85 85 85 75 75 75 75 75 75 75 18.1 18.1 18.1 18.1 18.1 18.1 18.1 23.5 23.5 23.5 23.5 23.5 23.5 23.5 19.0 19.0 19.0 19.0 19.0 19.0 19.0 24.7 24.7 24.7 24.7 24.7 24.7 24.7 35.2 35.2 35.2 35.2 35.2 35.2 35.2 39.8 39.8 39.8 39.8 39.8 39.8 39.8 80 80 80 80 80 80 80 80 80 80 80 80 80 80 Notes: 1. Luminous flux is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance ±12%. 2 Chip InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN InGaN Part Numbering System ASMT – U X 1 B x – N X 2 X 3 X 4 X 5 Packaging Option Colour Bin Max Flux Bin Min Flux Bin Color W − Cool White Y − Warm White Absolute Maximum Ratings (TA = 25° C) Parameter Rating Unit DC Forward Current 100 mA Peak Forward Current (D = 10%, f = 1 kHz) 200 mA Power Dissipation 360 mW Reverse Voltage Not recomended V Junction Temperature 125 °C Operating Temperature -40 to 100 °C Storage Temperature -40 to 100 °C Optical / Electrical Characteristics (TJ = 25° C) Parameter Test Condition Min Viewing Angle 2θ½1 Typ Forward Voltage VF2 IF = 80 mA 3.2 Thermal Resistance RTH junction to pin 50 Notes: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 2. Tolerance ±0.1 V. 3 Max 120 Unit degree 3.4 V °C/W 250 2 200 FORWARD CURRENT - mA RELATIVE LUMINOUS FLUX (NORMALIZED AT 80 mA) 2.5 1.5 1 0.5 0 0 50 100 150 200 DC FORWARD CURRENT - mA RELATIVE INTENSITY NORMALIZED INTENSITY 0.5 0.25 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 0.120 1.0 0.100 0.8 0.080 0.6 0.040 0.2 0.020 -15 10 35 60 85 JUNCTION TEMPERATURE, TJ - °C Figure 5. Relative Light Output 3 4 480 580 WAVELENGTH - nm 680 780 0.060 0.4 -40 2 FORWARD VOLTAGE - V CRI 75 CRI 85 1.2 0.0 1 Figure 4. Spectrum Distribution IF - A RELATIVE LUMINOUS FLUX (NORMALIZE AT 25° C) Figure 3. Radiation Diagram 4 0 Figure 2. Forward Current vs. Forward Voltage 0.75 -60 50 0 1 -90 100 250 Figure 1. Relative Luminous Flux vs. Forward Current 0 150 110 135 0.000 0 10 20 30 40 50 60 TA - °C 70 80 Figure 6. Forward Current Derating Curve. RTHja 140°C/W. 90 100 110 ID OD ID = 1.7 mm OD = 3.5 mm Figure 7. Recommended Pick and Place Nozzle Size 2.9 TEMPERATURE 10 to 30 SEC. 217° C 200 ° C 0.95 255 - 260° C 3°C/SEC. MAX. 6°C/SEC. MAX. 150 ° C 3°C/SEC. MAX. 100 SEC. MAX. TIME (Acc. to J-STD-020C) Figure 8. Recommended Pb Free Reflow Soldering Profile USER FEED DIRECTION CATHODE SIDE Figure 10. Reeling Orientation 5 0.76 0.72 60 - 120 SEC. PRINTED LABEL 4.1 0.85 Figure 9. Recommended Solder Pad 179.00 ± 0.50 1.15 ± 0.15 13.60 ± 1.00 1.10 ± 0.15 ∅ 10 .00 57 ∅1 ∅5 8.0 0 ∅ 76. .00 58 15.8 ± 1.0 Figure 11. Reel Dimensions 1.5 + 0.1 0 Package Marking 2 ±0.05 4 ±0.1 1.75 ±0.1 5.5 ±0.05 + – + – 3.8 ±0.1 3.8 ±0.1 Figure 12. Carrier Tape Dimensions 6 8 ±0.1 12 ±0.3 Handling Precaution Device Color (X1) The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. W Cool White Y Warm White Flux Bin (X2X3) Individual reel will contain parts from one bin only. Moisture Sensitivity X2 Min Flux Bin This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. X3 Max Flux Bin Bin Min (lm) Max (lm) A 18.1 23.5 A. Storage before use B 23.5 30.6 C 30.6 35.2 D 35.2 39.8 E 39.8 45.7 F 45.7 51.7 G 51.7 56.8 H 56.8 62 J 62.0 67.2 K 67.2 73.9 - Unopen moisture barrier bag (MBB) can be stored at