ASMT-YTB0-0AA02

ASMT-YTB0-0xxxx PLCC-6 Surface Mount Tricolor LED Data Sheet Description Features This family of Surface Mount Tricolor LEDs are housed in a PLCC-6 package. They are designed with a separate heat path for each LED die, enabling them to be driven at higher current. The high reliability package is able to withstand a wide range of environmental conditions making them ideally suited for interior and exterior full color sign applications. x Industry Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration A super wide viewing angle of 115° combined with a built in reflector increase the intensity of the light output making these LEDs suitable for interior electronics signs applications. The black surface top provides better contrast enhancement especially in the full color sign applications. These LEDs are compatible with reflow soldering process and to facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Each reel will be shipped in single intensity and color bin; except red color to provide close uniformity. x High reliability LED package with silicone encapsulation x High brightness using AlInGaP and InGaN dice technologies x Wide viewing angle at 115° x Compatible with reflow soldering process x JEDEC MSL 2a x Water-Resistant (IPX6*) per IEC 60529:2001 * The test is conducted on component level by mounting the components on PCB with proper potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application. Applications x Indoor and outdoor full color display CAUTION:LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. Package Dimensions 5 2 6 1 0.80 3 0.65 4 3.70±0.20 4.40±0.20 3.90 2.60±0.20 0.90±0.20 3.40 4.00±0.20 PIN 1 3.50±0.20 1.35 4.40±0.20 3 4 Red 2 5 Green 0.9±0.2 Notes: 1. All Dimensions are in millimeters 2. Tolerance = ±0.2 mm unless otherwise specified 3. Terminal Finish: Ag plating 4. Encapsulantion material: silicone resin 6 1 Blue Lead Configuration 1 Cathode Blue 2 Cathode Green 3 Cathode Red 4 Anode Red 5 Anode Green 6 Anode Blue Figure 1. Package drawing. Table 1. Device Selection Guide Part Number Color 1 Color 2 Color 3 ASMT-YTB0-0xxxx AlInGaP Red InGaN Green InGaN Blue Color 1 - Red Color 2 - Green Color 3 - Blue Min. Iv @20mA Typ. Iv @20mA Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA Part Number Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) ASMT-YTB0-0AA02 U1 450 648 V2 900 1243 S2 224 238 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ± 12 % 2 Part Numbering System A S M T –Y T B 0– X1 X2 X3X4 X5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Table 2. Absolute Maximum Ratings (TA = 25°C) Parameter Red Green & Blue Unit DC forward current [1] 50 30 mA Peak forward current [2] 100 100 mA Power dissipation 120 117 mW Reverse voltage 4V[3] V Maximum junction temperature Tj max 125 °C - 40 to + 110[4] °C - 40 to + 110 °C Operating temperature range Storage temperature range Note: 1. Derate linearly as shown in Figure 5a & 5b. 2 Duty Factor = 0.5%, Frequency = 500Hz 3. Driving the LED in reverse bias condition is suitable for short term only 4 Refer to Figure 5a and figure 5b for more information Table 3. Optical Characteristics (TA = 25°C) Dominant Wavelength, λd (nm) [5] Peak Wavelength, λp (nm) Viewing Angle 2θ½[6] (Degrees) Luminous Efficac ηV[7] (lm/W) Luminous Efficiency ηe (lm/W) Total Flux / Luminous Intensity [8] ΦV / IV (lm/cd) Color Min Typ. Max Typ. Typ. Typ. Typ. Typ. Red 618 621 628 629 115 200 40 2.60 Green 525 528 535 521 115 530 50 2.60 Blue 465 470 475 465 115 70 10 2.60 Notes: 5. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 6. θ½ is the off axis angle where the luminous intensity is ½ the peak intensity 7. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / ηV, where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens / watt. 8. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse condition. 3 Table 4. Electrical Characteristics (TA = 25°C) Forward Voltage, VF (V) [1] Reverse Voltage VR @ 100μA Reverse Voltage VR @ 10μA Color Min Typ. Max. Min. Min. Red 1.80 2.10 2.40 4 - Green 2.80 3.20 3.90 - 4 Blue 2.80 3.20 3.90 - 4 Note: 1. Tolerance ± 0.1V. 1.0 InGaN Green AlInGaP Red FORWARD CURRENT – mA RELATIVE INTENSITY InGaN Blue 0.8 0.6 0.4 0.2 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 20 mA) 2.50 AlInGaP 1.50 InGaN 0.50 0.00 0 10 20 30 40 DC FORWARD CURRENT - mA Figure 4. Relative Intensity vs. forward current 4 InGaN 0 1 2 Figure 3. Forward current vs. forward voltage 3.00 1.00 AlInGaP FORWARD VOLTAGE - V Figure 2. Relative intensity vs. wavelength 2.00 50 45 40 35 30 25 20 15 10 5 0 50 60 3 4 60 MAX. ALLOWABLE DC CURRENT (mA) MAX. ALLOWABLE DC CURRENT (mA) 60 AlInGaP 50 40 30 InGaN 20 10 0 AlInGaP 40 30 InGaN 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 7 6 5 4 3 2 1 0 -1 0 -2 -3 0 120 Figure 5a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C.(3 chips) DOMINANT WAVELENGTH SHIF T (NORMALIZED AT 20mA) - nm 50 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 120 Figure 5b. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C. (single chip) Green Blue Red 10 20 30 40 50 FORWARD CURRENT - mA 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 RED GREEN BLUE -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 7b. Radiation Pattern for X axis 5 Figure 7a. Component Axis for Radiation Patterns NORMALIZED INTENSIT Y NORMALIZED INTENSIT Y Figure 6. Dominant wavelength shift (normalized at 20mA) 60 90 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 RED GREEN BLUE -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 7c. Radiation Pattern for Y axis 60 90 0.30 FORWARD VOLTAGE SHIFT - V NORMALIZED LUMINOUS INTENSITY 10 1 0.1 -50 RED GREEN BLUE -25 0 25 50 75 TJ - JUNCTION TEMPERATURE - °C 100 0.20 0.10 0.00 -0.10 -0.20 -0.40 -50 125 Figure 8. Relative Intensity vs Junction Temperature RED GREEN BLUE -0.30 -25 0 25 50 75 TJ - JUNCTION TEMPERATURE - °C Figure 9. Forward Voltage vs Junction Temperature 4.20 1.60 1.60 4.20 0.40 -ve SOLDER MASK 1.10 2.60 1.10 8.40 +ve -ve 3.15 Reflow soldering direction 0.80 0.65 0.80 3.15 +ve 100 -ve +ve 4.20 Figure 10. Recommended soldering land pattern. H L Dimension of LxH should be > 3.9mm x 3.4mm Figure 11. Recommended pick and place nozzle tip 6 4.20 125 20 SEC. MAX. TEMPERATURE 183°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 100-150°C 217 °C 200 °C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 60-150 SEC. TIME TIME Figure 12. Recommended leaded reflow soldering profile Figure 13. Recommended Pb-free reflow soldering profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components 8.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 Ø1.50 +0.10 3.83 ± 0.10 1.75 ± 0.10 5.50 ± 0.05 12.00 +0.30 -0.10 4.85 ± 0.10 0.32 ± 0.02 Ø1.50 Figure 14. Carrier Tape Dimension 7 +0.25 2.30 Label Area Figure 15. Reel Dimension Pin 1 Printed Label Figure 16. Reeling Orientation 8 Ø330.0+1.0 Ø99.5+1.0 2.5 0± 0.5 0 330.0 Ø3.50±0.50 2.30 Intensity Bin Select (X2, X3) Intensity Bin Limits Individual reel will contain parts from 1 half bin only Bin ID Min Iv Bin (Minimum Intensity Bin) Min (mcd) Max (mcd) S2 224.0 285.0 T1 285.0 355.0 X2 Red Green Blue T2 355.0 450.0 0 0 0 0 U1 450.0 560.0 A U1 V2 S2 U2 560.0 715.0 V1 715.0 900.0 V2 900.0 1125.0 W1 1125.0 1400.0 W2 1400.0 1800.0 X1 1800.0 2240.0 Number of Half bin from X2 X3 Red Green Blue 0 0 0 0 A 4 4 4 Tolerance of each bin limit ± 12% Note: 0 represents no maximum bin limit Color Bin Limits Color Bin Select (X4) Individual Reel will contain part from 1 full bin only Red Full distribution Min (nm) Max (nm) 618.0 628.0 Min (nm) Max (nm) Color Bin Combinations X4 Red Green Blue Green 0 Full distribution C&D B&C C 525.0 530.0 D 530.0 535.0 Min (nm) Max (nm) B 465.0 470.0 C 470.0 475.0 Blue Tolerance of each bin limit is ± 1 nm 9 Packaging Option (X5) Option Test Current Package Type Reel Size 2 20mA Top mount 13 inch Note: Each reel contains 1000pcs LED 0.90 0.80 C D 0.70 Green Y - COORDINATE 0.60 0.50 0.40 Red 0.30 0.20 Blue 0.10 C B 0.00 0.00 10 0.10 0.20 0.30 0.40 0.50 X-COORDINATE 0.60 0.70 0.80 Handling Precaution B. Control after opening the MBB The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. x The humidity indicator card (HIC) shall be read immediately upon opening of MBB. Moisture Sensitivity x For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at