ASMT-YTB2-0BB02

ASMT-YTB2-0BB02 High Brightness Tricolor PLCC6 Black Surface LED Data Sheet Description Features The high brightness black top surface tri-color PLCC-6 family of SMT LEDs has a separate heat path for each LED dice, enabling the LED to be driven at higher current. These SMT LEDs are in the high brightness category, are high reliability devices, are high performance and are designed for a wide range of environmental conditions. By integrating the black top surface Avago devices deliver better contrast enhancement for your application. They also provide super wide viewing angle at 120° with the built in reflector pushing up the intensity of the light output. The high reliability characteristics and other features make the black top surface tri-color PLCC-6 family ideally suitable for exterior and interior full color signs application conditions.        NOTE For easy pick and place, the LEDs are shipped in EIA-compliant tape and reel. Every reel is shipped from a single intensity and color bin; except red color providing better uniformity. These tri-color LEDs are compatible with reflow soldering process. CAUTION LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. Industry Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration High reliability LED package with silicone encapsulation High brightness using AlInGaP and InGaN dice technologies Wide viewing angle at 120° Compatible with reflow soldering process JEDEC MSL 2a Water-Resistant (IPX6, see note) per IEC 60529:2001 The test is conducted on component level by mounting the components on PCB with proper potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application. Applications  Avago Technologies -1- Indoor and outdoor full color display ASMT-YTB2-0BB02 Data Sheet Package Dimensions Package Dimensions 3 5 2 6 1 0.50 4 2.30 2.30 2.80 2.30 3.00 3.40 4 3 1.80 Red 5 2 Green 6 0.20 1 Blue 0.90 NOTE 1. 2. 3. 4. All dimensions are in millimeters. Tolerance = ± 0.2 mm unless otherwise specified. Terminal Finish: Ag plating. Encapsulation material: silicone resin Lead Configuration 1 Cathode Blue 2 Cathode Green 3 Cathode Red 4 Anode Red 5 Anode Green 6 Anode Blue Avago Technologies -2- ASMT-YTB2-0BB02 Data Sheet Device Selection Guide Device Selection Guide Color 1 – AlInGaP Red Part Number Min. Iv @20mA Bin ID (mcd) ASMT-YTB2-0BB02 U2 560 Color 2 – InGaN Green Typ. Iv @ Max Iv @ 20mA 20mA (mcd) (mcd) 745 1125 Min. Iv @ 20mA Typ. Iv @ Max Iv @ 20mA 20mA Bin ID (mcd) W1 1125 (mcd) (mcd) 1600 2240 Color 3 – InGaN Blue Min. Iv @ 20mA Bin ID (mcd) T1 285 Typ. Iv @ Max Iv @ 20mA 20mA (mcd) (mcd) 380 560 NOTE 1. 2. The luminous intensity IV, is measured at the mechanical axis of the LED package and it is tested in pulsing condition. The actual peak of the spatial radiation pattern may not be aligned with this axis. Tolerance = ± 12%. Part Numbering System ASMT –Y TB2 – X1 X2 X3 X4 X5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Package Type B: Black Surface Tricolor Color T: Tricolor Produce Family Y: Silicone Based PLCC6 Avago Technologies -3- ASMT-YTB2-0BB02 Data Sheet Absolute Maximum Ratings (TA = 25 °C) Absolute Maximum Ratings (TA = 25 °C) Parameter Red Green and Blue Unit DC forward current a 50 30 mA Peak forward currentb 100 100 mA Power dissipation 125 114 mW Reverse voltage c 4V V Maximum junction temperature Tj max 125 °C Operating temperature range –40 to + 110d °C Storage temperature range –40 to + 120 °C a. Derate linearly as shown in Figure 4 and Figure 5. b. Duty Factor = 10% Frequency = 1 KHz. c. Driving the LED in reverse bias condition is suitable for short term only. d. Refer to Figure 4 and Figure 5 for more information. Optical Characteristics (TA = 25 °C) Dominant Wavelength, d Color (nm)a Peak Wavelength, p (nm) Viewing Angle 2½b (Degrees) Luminous Efficacy Vc (lm/W) Luminous Efficiency e (lm/W) Typ. Typ. Typ. Typ. Min Typ. Max Red 618 622 628 629 120 210 43 Green 525 530 537 521 120 535 75 Blue 465 470 477 464 120 84 15 a. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. b. ½ is the off axis angle where the luminous intensity is ½ the peak intensity c. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / V, where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens / watt. Electrical Characteristics (TA = 25 °C) Thermal Reverse Voltage Reverse Voltage Resistance R J-P VR @ 100μA VR @ 10μA (°C/W)b Forward Voltage, VF (V)a Color Min Typ. Max. Min. Min. Typ Red 1.80 2.10 2.50 4 — 280 Green ­2.80 3.20 3.80 — 4 180 Blue 2.80 3.20 3.80 — 4 180 a. Tolerance is ± 0.1V. b. One chip on thermal resistance. Avago Technologies -4- ASMT-YTB2-0BB02 Data Sheet Electrical Characteristics (TA = 25 °C) Figure 2 Forward Current – mA vs. Forward Voltage – V 1.0 100 0.8 80 BLUE GREEN FORWARD CURRENT-mA RELATIVE INTENSITY Figure 1 Relative Intensity vs. Wavelength RED 0.6 0.4 0.2 0.0 400 Red Blue / Green 60 40 20 0 450 500 550 600 WAVELENGTH - nm 650 700 100 120 0 1 2 3 FORWARD VOLTAGE-V 4 5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) Figure 3 Relative Intensity vs. Forward Current 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Red Blue Green 0 20 40 60 80 DC FORWARD CURRENT-mA Figure 4 Maximum Forward Current vs Ambient Temperature. Derated based on TJMAX = 125 °C (3 chips). Figure 5 Maximum Forward Current vs Ambient Temperature. Derated based on TJMAX = 125 °C (single chip). 60 AlInGaP 50 MAX ALLOWABLE CURRENT - mA MAX ALLOWABLE CURRENT-mA 60 40 InGaN 30 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 AlInGaP 50 40 InGaN 30 20 10 0 120 Avago Technologies -5- 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 120 ASMT-YTB2-0BB02 Data Sheet Electrical Characteristics (TA = 25 °C) Figure 7 Radiation Pattern for Y Axis 1.0 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 6 Radiation Pattern for X Axis 0.6 0.4 0.2 Red 0.0 -90 -60 Green 0.6 0.4 0.2 Blue -30 0 30 ANGULAR DISPLACEMENT-DEGREE Red 60 0.0 -90 90 -60 Green Blue -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 90 Figure 8 Component Access for Radiation Patterns Y X X Y Figure 9 Relative Intensity vs. Junction Temperature Figure 10 Forward Voltage vs. Junction Temperature 0.3 FORWARD VOLTAGE SHIFT- V NORMALIZED LOP at TJ =25°C 10 1 0.1 -40 Red -20 Green Blue 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 140 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -40 Avago Technologies -6- Red -20 Green Blue 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 140 ASMT-YTB2-0BB02 Data Sheet Electrical Characteristics (TA = 25 °C) Figure 11 Recommended Soldering Land Pattern 1.35 4.35 4.35 4.35 1.60 0.40 0.50 5.25 0.50 0.40 2.35 4.35 1.60 Figure 12 Carrier Tape Dimension Package Marking 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 1.50 +0.10 –0 1.75 ±0.10 2.29 ±0.1 3.50 ±0.05 8.00 3.05 ±0.10 1.00 +0.10 –0 +0.30 –0.10 3.81 ±0.10 0.229 ±0.01 8° Avago Technologies -7- ASMT-YTB2-0BB02 Data Sheet Electrical Characteristics (TA = 25 °C) Figure 13 Reel Dimension Ø 20.5 ±0.3 +0.5 2 –0 62.5 +0 –2.5 180 Ø 13 ±0.2 8.4 +1.50 –0.00 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) 7.9 (MIN.) 10.9 (MAX.) Figure 14 Reeling Orientation USER FEED DIRECTION PIN 1 PRINTED LABEL Avago Technologies -8- ASMT-YTB2-0BB02 Data Sheet Packaging Label Packaging Label (i) Avago Mother Label (Available on MBB bags) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL2a (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (9D) Date Code: Date Code (V) Vendor ID: DeptID: Made In: Country of Origin (ii) Avago Baby Label (Available on reel) (1P) PART #: Part Number BABY LABEL COSB001B V0.0 (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin (9D): DATE CODE: D/C: Date Code VF: CAT: INTENSITY BIN BIN: COLOR BIN (1T) TAPE DATE: Example indicates luminous Intensity information for Red, Green and Blue respectively from label: Example indicates color bin information for Green and Blue from label: CAT: V1 W1 T2 BIN: A B Color Bin for Blue Color Bin for Green Intensity for Blue Intensity for Green Intensity for Red NOTE There will be no red color bin information appear on label as it is not binned and support with full distribution range. Avago Technologies -9- ASMT-YTB2-0BB02 Data Sheet Intensity Bin Select (X2, X3) Intensity Bin Select (X2, X3) Intensity Bin Limits Individual reel will contain parts from 1 half bin only. Bin ID Min (mcd) Max (mcd) T1 285.0 355.0 T2 355.0 450.0 U1 450.0 560.0 U2 560.0 715.0 V1 705.0 900.0 V2 900.0 1125.0 W1 1125.0 1400.0 W2 1400.0 1800.0 X1 1800.0 2240.0 Min Iv Bin (Minimum Intensity Bin) X2 B Red Green Blue U2 W1 T1 Number of Half bin from X2 X3 B Red Green Blue 3 3 3 NOTE Color Bin Select (X4) Individual reel will contain parts from 1 full bin only. Color Bin Combinations X4 0 Red Green Blue Full distribution A, B, C A, B, C, D, E Avago Technologies - 10 - Tolerance of each bin limit is ± 12%. ASMT-YTB2-0BB02 Data Sheet Color Bin Limits Color Bin Limits Red Color Bin Table Bin ID Min. Dom Full Distribution 618 Max. Dom 628           x 0.6873 0.6696 0.6866 0.7052 y 0.3126 0.3136 0.2967 0.2948 Tolerance of each bin limit is ± 1 nm. Green Color Bin Table Bin ID A Min. Dom 525.0 B 531.0 528.0 C Max. Dom 534.0 531.0 537.0           x 0.1142 0.1799 0.2138 0.1625 y 0.8262 0.6783 0.6609 0.8012 x 0.1387 0.1971 0.2298 0.1854 y 0.8148 0.6703 0.6507 0.7867 x 0.1625 0.2138 0.2454 0.2077 y 0.8012 0.6609 0.6397 0.7711 1 2 3 4 x 0.1355 0.1751 0.168 0.127 y 0.0399 0.0986 0.1094 0.053 x 0.1314 0.1718 0.1638 0.122 y 0.0459 0.1034 0.1167 0.063 x 0.1267 0.168 0.1593 0.116 y 0.0534 0.1094 0.1255 0.074 x 0.1215 0.1638 0.1543 0.1096 y 0.0626 0.1167 0.1361 0.0868 x 0.1158 0.1593 0.1489 0.1028 y 0.0736 0.1255 0.1490 0.1029 Tolerance of each bin limit is ± 1 nm. Blue Color Bin Table Bin ID Min. Dom Max. Dom A 465.0 469.0 B 467.0 471.0 C 469.0 473.0 D 471.0 475.0 E 473.0 477.0   Tolerance of each bin limit is ± 1 nm. Packaging Option (X5) Option 2 Test Current 20mA Reel Size 7 inch Avago Technologies - 11 - ASMT-YTB2-0BB02 Data Sheet Soldering Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering (ii) Lead-free reflow soldering 20 SEC. MAX. TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 217°C 200°C 2. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 60-150 SEC. TIME 1. 255 - 260 °C 3°C/SEC. MAX. TIME Reflow soldering must not be done more than 2 times. Make sure the necessary precautions are observed for handling moisture-sensitive device as stated in the following section. 3. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. 4. It is preferred to use reflow soldering to solder the LED. Use hand soldering for rework if this is unavoidable, but it must be strictly controlled to the following conditions: Recommended board reflow direction: Soldering iron tip temperature = 320 °C max — Soldering duration = 3 sec max — Number of cycles = 1 only — Power of soldering iron = 50 W max — 5. Do not touch the LED body with hot soldering iron except the soldering terminals as it may cause damage to the LED. 6. For de-soldering, it is recommended that you use a double flat tip. 7. You are advised to confirm beforehand whether hand soldering will affect the functionality and performance of the LED. REFLOW DIRECTION Avago Technologies - 12 - ASMT-YTB2-0BB02 Data Sheet Precautionary Notes Precautionary Notes 1. Handling precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Special handling precautions need to be observed during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Do refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for more information. a. b. c. d. e. Do not poke sharp objects into the silicone encapsulant. Sharp object like tweezers or syringes might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. The LED should only be held by the body. Do no stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dusk and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, a cotton bud can be used with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Avago has tested nozzle size below to be working fine with this LED.However, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the machine, customer is recommended to verify the nozzle selected will not cause damage to the LED. 2. Handling of moisture sensitive device This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. b. c. d. Avago Technologies - 13 - Before use An unopened moisture barrier bag (MBB) can be stored at