ASMT-YTB7-0AA02

ASMT-YTB7-0AA02 Tricolor PLCC6 Black Surface Mount LED Data Sheet Description Features This family of SMT LEDs packaged in the form of PLCC-6 with separate heat path for each LED dice, enabling it to be driven at higher current.  Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration For easy pick & place, the LEDs are shipped in EIA-compliant tape and reel. Every reel is shipped from a single intensity and color bin; except red color for better uniformity.  LED package with diffused silicone encapsulation These LEDs are compatible with reflow soldering process.  Compatible with reflow soldering process This super wide viewing angle at 120° together with the built in reflector pushing up the intensity of the light output makes these LED suitable to be used in the interior electronics signs.  JEDEC MSL 3 The black top surface of the LED provides better contrast enhancement especially in the full color sign application.  Using AlInGaP and InGaN dice technologies  Wide viewing angle at 120°  Water-Resistance (IPX6*) per IEC 60529:2001 • The test is conducted on component level by mounting the components on PCB with proper potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application Applications  Indoor and outdoor full color display CAUTION: These LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. CAUTION: Customer is advised to keep the LED in the MBB when not in use as prolonged exposure to environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering. Package Dimensions Lead Configuration 4 3 5 2 1 0.50 6 2.30 2.30 2.80 2.30 3.00 1 Cathode Blue 2 Cathode Green 3 Cathode Red 4 Anode Red 5 Anode Green 6 Anode Blue Notes: 1. All Dimensions are in millimeters 2. Tolerance = ±0.2 mm unless otherwise specified 3. Terminal Finish: Ag plating 4. Encapsulantion material: silicone resin 3.40 4 3 1.80 Red 5 2 Green 6 0.20 1 Blue 0.90 Table 1. Device Selection Guide Color 1 - Red Min. Iv @20mA Part Number ASMT-YTB7-0AA02 Color 2 - Green Typ. Iv Max Iv @20mA @ 20mA Min. Iv @ 20mA Color 3 - Blue Typ. Iv Max Iv @ 20mA @ 20mA Min. Iv @ 20mA Typ. Iv Max Iv @ 20mA @ 20mA Bin ID (mcd) (mcd) (mcd) Bin ID (mcd) (mcd) (mcd) Bin ID (mcd) (mcd) (mcd) U2 560 650 1125 W2 1400 1900 2850 T1 285 384 560 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the LED package and it is tested in pulsing condition. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ± 12 % Part Numbering System ASMT – Y T B7 – 0 X 2 X 3 X 4 X 5 Packaging Option 2: 20mA testing current Color Bin Selection 0: Red (Full distribution) Green (A,B,C), Blue (A,B,C,D) Number of half intensity bin A: 3half intensity bin Min Intensity Bin A: Red U2 / Green W2/ Blue T1 Package Type B: Black Surface Tricolor Color T: Tricolor Product Family Y: Silicon Based PLCC6 2 Table 2. Absolute Maximum Ratings (TA = 25°C) Parameter Red Green & Blue Unit 50 25 mA 100 100 mA 90 mW DC forward current [1] Peak forward current [2] Power dissipation 125 Maximum junction temperature Tj max Operating temperature range 110 °C - 40 to + 100 [3] °C - 40 to + 100 °C Storage temperature range Note: 1. Derate linearly as shown in Figure 4a & 4b 2. Duty Factor = 10% Frequency = 1KHz 3. Refer to Figure 4a and Figure 4b for more information Table 3. Optical Characteristics (TA = 25°C) Luminous Intensity, Iv, mcd [1] Color Min Dominant Wavelength, d (nm) [2] Peak Wavelength, p (nm) Viewing Angle 2½ (°) [3] Typ Max. Min Typ Max Typ. Typ Test Current (mA) Red 560 650 1125 617 623 627 630 120 20 Green 1400 1900 2850 525 529 537 522 120 20 Blue 285 384 560 465 469 475 465 120 20 Notes: 1. The luminous intensity Iv is measured at the mechanical axis of LED package and it is tested in pulsing condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. 2. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. ½ is the off axis angle where the luminous intensity is ½ the peak intensity Table 4. Electrical Characteristics (TA = 25°C) Forward Voltage, VF (V) [1] Reverse Voltage VR @100μA [3] Reverse Voltage VR @10μA [3] Min Thermal Resistance RθJ-P (°C/W) [2] Test Current Typ (mA) Color Min Typ. Max. Min Red 1.80 2.10 2.50 4 - 280 20 Green 2.80 3.10 3.60 - 4 240 20 Blue 2.80 3.10 3.60 - 4 240 20 Note: 1. Tolerance ± 0.1V. 2. One chip on thermal resistance 3. Indicated product final testing condition, long term reverse bias is not recommended. 3 100 0.8 80 BLUE GREEN FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 RED 0.6 0.4 0.2 0.0 400 60 40 20 0 450 500 550 600 WAVELENGTH - nm 650 700 Figure 1. Relative Intensity vs Wavelength 0 1 2 3 FORWARD VOLTAGE - V 4 5 Figure 2. Forward Current –mA vs Forward Voltage 3.0 GREEN BLUE RED NORMALIZED INTENSITY 2.5 2.0 1.5 1.0 0.5 0.0 0 10 20 30 FORWARD CURRENT - mA Figure 3. Relative Intensity vs Forward Current 40 50 60 MAXIMUM FORWARD CURRRENT - mA MAX ALLOWABLE CURRENT - mA 60 50 AlInGaP 40 30 InGaN 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 120 Figure 4a. Maximum forward current vs. ambient temperature. (3 chips) 4 AlInGaP 50 40 30 InGaN 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 120 Figure 4b. Maximum forward current vs. ambient temperature. (single chip) 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 0.4 Red Green Blue 0.2 0.0 90 Figure 5a. Radiation Pattern for X axis 0.6 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 90 Figure 5b. Radiation Pattern for Y axis Y X X Y Figure 5c. Component Axis for Radiation Patterns 0.5 Blue Green Red 1 0.1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 6. Relative Intensity vs Junction Temperature 5 FORWARD VOLTAGE SHIFT - V NORMALZIED INTENSITY 10 100 120 Blue Green Red 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 7. Forward Voltage vs Junction Temperature 100 120 1.35 4.35 4.35 4.35 1.60 0.40 0.50 Reflow soldering direction 5.25 0.50 0.40 2.35 4.35 1.60 Figure 8a. Recommended soldering land pattern. Figure 8b. LED Configuration on land pattern ID OD ID = 1.7mm OD = 3.5mm Figure 9. Recommended Pick and Place Nozzle Tip 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME Figure 10. Recommended leaded reflow soldering profile. TEMPERATURE TEMPERATURE 20 SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME Figure 11. Recommended Pb-free reflow soldering profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components 6 Package Marking 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 1.50 +0.10 –0 1.75 ±0.10 2.29 ±0.1 3.50 ±0.05 8.00 +0.30 –0.10 3.81 ±0.10 1.00 +0.10 –0 3.05 ±0.10 0.229 ±0.01 8° Figure 12. Carrier tape Dimension Ø 20.5 ±0.3 +0.5 2 –0 62.5 +0 –2.5 180 Ø 13 ±0.2 8.4 +1.50 –0.00 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) 7.9 (MIN.) 10.9 (MAX.) Figure 13. Reel Dimension USER FEED DIRECTION PIN 1 PRINTED LABEL Figure 14. Reeling Orientation 7 Packaging Label: (i) Avago Mother Label (Available on MBB bags) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL3 (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Color Bin (1P) Item: Part Number (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Available on reel) (1P) PART #: Part Number (1T) LOT #: Lot Number BABY LABEL COSB (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin (9D): DATE CODE: (1T) TAPE DATE: D/C: Date Code 001B V0.0 VF: CAT: INTENSITY BIN BIN: COLOR BIN Example indicates luminous Intensity information for Red, Green and Blue respectively from label: BIN: A B CAT: U2 W2 T1 Intensity for Blue Color Bin for Blue Intensity for Green Color Bin for Green Intensity for Red 8 Example indicates color bin information for Green and Blue from label: Intensity Bin Select (X2, X3) Color Bin Limit Individual reel will contain parts from 1 half bin only Red Color Bin Table Min Iv Bin (Minimum Intensity Bin) X2 Red Green Blue A U2 W2 T1 Bin ID Dominant Wavelength Min Full 617.0 range Number of Intensity bin from X2 Max Chromaticity Coordinate 627.0 x 0.6850 0.6815 0.7000 0.7037 y 0.3149 0.3150 0.2966 0.2962 X3 Red Green Blue Tolerance of each bin limit is ± 1 nm A 3 3 3 Green Color Bin Table Color Bin Select (X4) Bin Min ID Dom Max Dom Individual Reel will contain part from 1 full bin only A 531.0 525.0 Color Bin Combinations X4 Red Green Blue 0 Full distribution A,B,C A,B,C,D Intensity Bin Limits B 528.0 534.0 C 531.0 537.0 Chromaticity Coordinate x 0.1142 0.1624 0.2001 0.1625 y 0.8262 0.7178 0.6983 0.8012 x 0.1387 0.1815 0.2179 0.1854 y 0.8148 0.7089 0.6870 0.7867 x 0.1625 0.2001 0.2353 0.2077 y 0.8012 0.6983 0.6747 0.7711 Tolerance of each bin limit is ± 1 nm Bin ID Min (mcd) Max (mcd) U2 560.0 715.0 V1 715.0 900.0 V2 900.0 1125.0 W1 1125.0 1400.0 W2 1400.0 1800.0 X1 1800.0 2240.0 X2 2240 2850 Tolerance of each bin limit ± 12% Blue Color Bin Table Bin Min ID Dom Max Dom Chromaticity Coordinate A 465.0 469.0 x 0.1355 0.1751 0.168 0.127 y 0.0399 0.0986 0.1094 0.053 B 467.0 471.0 x 0.1314 0.1718 0.1638 0.122 y 0.0459 0.1034 0.1167 0.063 x 0.1267 0.168 0.1593 0.116 y 0.0534 0.1094 0.1255 0.074 x 0.1215 0.1638 0.1543 0.1096 y 0.0626 0.1167 0.1361 0.0868 C 469.0 473.0 D 471.0 475.0 Tolerance f each bin limit is ± 1 nm 9 Handling Precaution The encapsulation material of the LED is made of silicone for better product reliability. Since silicone is a soft material, avoid pressing on the silicon or poking the silicon with a sharp object as the product could be damaged and cause premature failure. During assembly handling, the unit should be held by the body only. Please refer to Avago Application Note AN 5288 for additional handling information and proper procedures. Moisture Sensitivity This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. A. Storage before use - An Unopened moisture barrier bag (MBB) can be stored at