ASMT-YTC2-0AA02

ASMT-YTC2-0AA02 High Brightness Tricolor PLCC6 Black Body LED Data Sheet Description Features This family of SMT LEDs packaged in the form of PLCC-6 with separate heat path for each LED dice, enabling it to be driven at higher current. • Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration Individually addressable pin-outs give higher flexibility in circuitry design. With closely matched radiation pattern along the package’s x-axis, these LEDs are suitable for indoor full color display application. • High reliability LED package with silicone encapsulation For easy pick & place, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity. The full black body of the LED provides extreme contrast enhancement for short distance viewing of fine pitch full color display. • Compatible with reflow soldering process These LEDs are compatible with reflow soldering process. Applications • High brightness using AlInGaP and InGaN dice technologies • Typical viewing angle 120 ° • JEDEC MSL 2a • Water-Resistance (IPX6*) per IEC 60529:2001 * The test is conducted on component level by mounting the components on PCB with proper potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application. • Indoor full color display CAUTION: LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. Package Dimensions 3 5 2 6 1 3.00 0.50 4 2.30 2.80 2.30 3.40 4 1.80 5 0.20 0.90 Lead Configuration 1 Cathode (Blue) 2 Cathode (Green) 3 Cathode (Red) 4 Anode (Red) 5 Anode (Green) 6 Anode (Blue) Notes: 1. All dimensions are in millimeter (mm). 2. Unless otherwise specified, tolerance is ± 0.20 mm. 3. Encapsulation = silicone 4. Terminal finish = silver plating 2 6 Red 3 2 Green Blue 1 Table 1. Absolute Maximum Ratings (TJ = 25 °C) Parameter Red Green & Blue Unit 50 30 mA 100 100 mA 114 mW DC forward current [1] Peak forward current [2] Power dissipation 125 Reverse voltage [3] 4 V 125 °C Operating temperature range -40 to + 110 °C Storage temperature range -40 to + 120 °C Junction temperature Notes: 1. Derate linearly as shown in Figure 7 to Figure 10. 2. Duty Factor = 10% Frequency = 1 kHz 3. Driving the LED in reverse bias condition is suitable for the short term only Table 2. Optical Characteristics (TJ = 25 °C) Luminous Intensity, IV (mcd) @ IF = 20 mA [1] Dominant Wavelength, λd (nm) @ IF = 20 mA [2] Peak Wavelength, λp (nm) @ IF = 20 mA Viewing Angle, 2θ½ (°) [3] Luminous Efficacy, ηV (lm/W) Luminous Efficiency, ηe (lm/W) Color Min. Typ. Max. Min. Typ. Max. Typ. Typ. Typ. Typ. Red 355 450 715 618 622 628 629 120 210 22 Green 450 560 900 525 530 537 521 120 535 25 Blue 140 180 285 465 470 477 464 120 84 5 Notes: 1. Luminous intensity, IV is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. 2. Dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ½ is the off-axis angle where the luminous intensity is ½ of the peak intensity. 4. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse condition. Table 3. Electrical Characteristics (TJ = 25 °C) Forward Voltage, VF (V) @ IF = 20 mA [1] Reverse Voltage, VR (V) @ IR = 100 mA [2] Reverse Voltage, VR (V) @ IR = 10 mA [2] Thermal Resistance, RθJ-S (°C/W) Color Min. Typ. Max. Min. Min. 1 chip on Red 1.8 2.1 2.5 4.0 -- 280 280 Green 2.8 3.2 3.8 -- 4.0 180 230 Blue 2.8 3.2 3.8 -- 4.0 180 230 Notes: 1. Tolerance ± 0.1 V. 2. Indicates product final testing condition. Long-term reverse bias is not recommended. 3 3 chips on Part Numbering System A S M T - Y T C 2 - 0 A x1 A 0 2 x2 x3 x4 x5 Code Description Option x1 x2 Package type Minimum intensity bin C A x3 x4 Number of intensity bins Color bin combination A 0 x5 Test option 2 Black Body Red: bin T2 Red: bin T2, U1, U2 Green: bin U1 Green: bin U1, U2, V1 Blue: bin R1 Blue: bin R2, S1, S2 3 intensity bins from minimum Red: full distribution Green: bin A, B, C Blue: bin A, B, C, D, E Test current = 20 mA Table 4. Bin Information Intensity Bins (CAT) Color Bins (BIN) – Red Bin ID Min (mcd) Max (mcd) R2 140.0 180.0 S1 180.0 224.0 S2 224.0 285.0 T1 285.0 355.0 T2 355.0 450.0 U1 450.0 560.0 U2 560.0 715.0 V1 715.0 900.0 Bin ID Dominant Wavelength (nm) Min. Max. Chromaticity coordinate (for reference) Cx Cy -- 618.0 0.6873 0.6696 0.6866 0.7052 Color Bins (BIN) – Blue Color Bins (BIN) – Green Bin ID Dominant Wavelength (nm) Min. Max. Chromaticity Coordinate (for reference) Cx Cy A 525.0 0.1142 0.1799 0.2138 0.1625 0.1387 0.1971 0.2298 0.1854 0.1625 0.2138 0.2454 0.2077 B C 528.0 531.0 534.0 537.0 0.8262 0.6783 0.6609 0.8012 0.8148 0.6703 0.6507 0.7867 0.8012 0.6609 0.6397 0.7711 Bin ID Dominant Wavelength (nm) Min. Max. Chromaticity coordinate (for reference) Cx Cy A 465.0 469.0 B 467.0 471.0 C 469.0 473.0 D 471.0 475.0 E 473.0 477.0 0.1355 0.1751 0.1680 0.1267 0.1314 0.1718 0.1638 0.1215 0.1267 0.1680 0.1593 0.1158 0.1215 0.1638 0.1543 0.1096 0.1158 0.1593 0.1489 0.1028 Tolerance: ±1 nm Tolerance: ±1 nm 4 0.3126 0.3136 0.2967 0.2948 Tolerance: ±1 nm Tolerance: ±12% 531.0 628.0 0.0399 0.0986 0.1094 0.0534 0.0459 0.1034 0.1167 0.0626 0.0534 0.1094 0.1255 0.0736 0.0626 0.1167 0.1361 0.0868 0.0736 0.1255 0.1490 0.1029 Characteristics 100 1.0 Green Blue Red FORWARD CURRENT-mA RELATIVE INTENSITY 0.8 0.6 0.4 0.2 0.0 380 480 580 WAVELENGTH - nm DOMINANT WAVELENGTH SHIFT - nm Red Blue Green 0 20 20 0 1 2 3 FORWARD VOLTAGE-V 4 5 Figure 5. Relative Luminous Intensity vs. Junction Temperature -2 -4 -6 Red Green Blue -8 120 20 100 0.3 1 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 0 40 60 80 FORWARD CURRENT - mA Figure 4. Dominant Wavelength Shift vs. Forward Current Red Green Blue -20 2 -10 0 100 FORWARD VOLTAGE SHIFT- V RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) RELATIVE INTENSITY 40 4 10 5 Blue / Green Figure 2. Forward Current vs. Forward Voltage 40 60 80 DC FORWARD CURRENT-mA Figure 3. Relative Luminous Intensity vs. Forward Current 0.1 -40 Red 60 0 680 Figure 1. Relative Spectral Emission 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 80 140 120 Red Green Blue 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C Figure 6. Forward Voltage Shift vs. Junction Temperature 120 140 60 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 60 50 TS 40 TA 30 20 10 0 0 20 40 60 80 TEMPERATURE - °C 100 20 10 0 20 40 60 80 TEMPERATURE - °C TS 30 TA 20 10 0 20 40 60 80 TEMPERATURE - °C 100 120 120 TS 30 TA 20 10 0 0 20 40 60 80 TEMPERATURE - °C 100 120 Figure 10. Maximum Forward Current vs. Temperature for Green & Blue (3 chips on) Figure 9. Maximum Forward Current vs. Temperature for Green & Blue (1 chip on) Note: Maximum forward current graphs based on ambient temperature, TA are with reference to thermal resistance RθJ-A below. For more details, see Precautionary Notes (4). Thermal resistance from LED junction to ambient, RθJ-A (°C/W) Condition Red Green & Blue 1 chip on 473 373 3 chips on 563 563 6 100 40 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA TA 30 Figure 8. Maximum Forward Current vs. Temperature for Red (3 chips on) 40 0 TS 40 0 120 Figure 7. Maximum Forward Current vs. Temperature for Red (1 chip on) 50 1 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE 60 0.6 0.4 0 -90 90 Red Green Blue 0.2 -60 -30 Figure 11b. Radiation pattern along y-axis of the package Y X Y Figure 11c. Illustration of package axis for radiation pattern 2.30 0.50 4.55 1.35 1.60 Maximize the size of copper pad of PIN 1, PIN 4, PIN5 for better heat dissipation. 0.40 Figure 12. Recommended soldering land pattern 7 30 ANGULAR DISPLACEMENT - DEGREE Figure 11a. Radiation pattern along x-axis of the package X 0 Copper pad Solder mask 60 90 4.00 ±0.10 4.00 ±0.10 2.00 ±0.05 +0.10 ∅ 1.50 0 Package Marking 1.75 ±0.10 3.50 ±0.05 2.29 ±0.10 +0.30 8.00 -0.10 +0.10 ∅ 1.00 0 3.05 ±0.10 3.81 ±0.10 0.229 ±0.01 Figure 13. Carrier tape dimensions USER FEED DIRECTION PACKAGE MARKING PRINTED LABEL Figure 14. Reeling Orientation 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) 13.1 ± 0.5 Ø (0.516 ± 0.020) 20.20 MIN. Ø (0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 15. Reel dimensions 8 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Packing Label (i) Standard label (attached on moisture barrier bag) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL2a (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (9D) Date Code: Date Code (V) Vendor ID: DeptID: Made In: Country of Origin (ii) Baby label (attached on plastic reel) (1P) PART #: Part Number BABY LABEL COSB001B V0.0 (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin (9D): DATE CODE: (1T) TAPE DATE: D/C: Date Code CAT: INTENSITY BIN BIN: COLOR BIN Example of luminous intensity (Iv) bin information on label: CAT: T2 U1 R1 Intensity for Blue: R1 Intensity for Green: U1 Intensity for Red: T2 Example of color bin information on label: BIN: A B Color Bin for Blue: B Color Bin for Green: A Note: There is no color bin ID for Red color as there is only 1 range ,as stated in Table 4. 9 VF: Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering: (ii) Lead-free reflow soldering: 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME a. Reflow soldering must not be done more than 2 times. Make sure the necessary precautions are observed for handling moisture-sensitive device as stated in the following section. b. Recommended board reflow direction: TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME c. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. d. It is preferred to use reflow soldering to solder the LED. Use hand soldering for rework if this is unavoidable, but it must be strictly controlled to the following conditions: - Soldering iron tip temperature = 320 °C max - Soldering duration = 3 sec max - Number of cycles = 1 only - Power of soldering iron = 50 W max e. Do not touch the LED body with hot soldering iron except the soldering terminals as it may cause damage to the LED. f. For de-soldering, it is recommended that you use a double flat tip. g. You are advised to confirm beforehand whether hand soldering will affect the functionality and performance of the LED. REFLOW DIRECTION 10 PRECAUTIONARY NOTES 1. Handling precautions 2. Handling of moisture-sensitive device The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, whichis hard and brittle, silicone is softer and flexible. Special handling precautions must be taken during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. For more information. refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions. This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. For additional details and a review of proper handling procedures, refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices. a. Before use - An unopened moisture barrier bag (MBB) can be stored at < 40 °C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the Humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. a. Do not poke sharp objects into the silicone encapsulant. Sharp objects such as tweezers or syringes might exert excessive force or even pierce through the silicone and induce failures in the LED die or wire bond. b. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by its body. - It is recommended that the MBB not be opened before assembly (e.g., for IQC). b. Control after opening the MBB - The HIC shall be read immediately upon opening of the MBB. c. Do no stack assembled PCBs together. Use an appropriate rack to hold the PCBs. d. The surface of silicone materials attracts more dust and dirt than to epoxy, due to its surface tackiness. To remove foreign particles on the surface of silicone, a cotton bud can be used with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. e. For automated pick and place, Avago has tested that the following nozzle size works fine with this LED. However, due to possible variations in other parameters such as pick and place machine maker/model and other settings of the machine, it is recommended that you verify that the nozzle selected will not cause damage to the LED. - The LEDs must be kept at < 30 °C/60% RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. c. Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at < 5% RH. d. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB must be stored in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours. e. Baking is required if: - The HIC indicator is not BROWN at 10% and is AZURE at 5%. - The LEDs are exposed to a condition of >30 °C / 60% RH at any time. - The LED floor life exceeded 672 hrs. ID OD ID = 1.7mm OD = 3.5mm 11 The recommended baking condition is: 60 ± 5 °C for 20 hrs. Baking should only be done once. f. Storage - The soldering terminals of these Avago LEDs are silver plated. If the LEDs are exposed in an ambient environment for too long, the silver plating might be oxidized and thus affect its solderability performance. As such, unused LEDs must be kept in a sealed MBB with desiccant or in desiccator at < 5% RH. 3. Application precautions a. Drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the datasheet. Constant current driving is recommended to ensure consistent performance. The complication of using this formula lies in TA and RqJ-A. Actual TA is sometimes subjective and hard to determine. RqJ-A varies from system to system depending on design and is usually not known. b. LED is not intended for reverse bias. Do use other appropriate components for such purpose. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage is not exceeding the allowable limit of the LED. Another way of calculating TJ is by using solder point temperature TS as shown below: c. Do not use the LED in the vicinity of material with sulfur content, in environment of high gaseous sulfur compound and corrosive elements. Examples of material that may contain sulfur are rubber gasket, RTV (room temperature vulcanizing) silicone rubber, rubber gloves etc. Prolonged exposure to such environment may affect the optical characteristics and product life. TJ = TS + RqJ-S x IF x VFmax where; TS = LED solder point temperature as shown in illustration below [°C] RqJ-S = thermal resistance from junction to solder point [°C/W] d. Avoid rapid change in ambient temperature especially in high humidity environment as this will cause condensation on the LED. e. Although the LED is rated as IPx6 according to IEC60529: Degree of protection provided by enclosure, the test condition may not represent actual exposure during application. If the LED is intended to be used in outdoor or harsh environment, the LED must be protected against damages caused by rain water, dust, oil, corrosive gases, external mechanical stress etc. 4. Thermal management Optical, electrical and reliability characteristics of LED are affected by temperature. The junction temperature (TJ ) of the LED must be kept below allowable limit at all times. TJ can be calculated as below: TJ = TA + RqJ-A x IF x VFmax where; TA = ambient temperature [°C] RqJ-A = thermal resistance from LED junction to ambient [°C/W] IF = forward current [A] VFmax = maximum forward voltage [V] Ts point - pin 5 TS can be measured easily by mounting a thermocouple on the soldering joint as shown in illustration above, while RqJ-S is provided in the datasheet. User is advised to verify the TS of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the datasheet. 5. Eye safety precautions LEDs may pose optical hazards when in operation. It is not advisable to view directly at operating LEDs as it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipments. 6. Disclaimer Avago’s products are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. AV02-2589EN - October 15, 2015