ASMT-YTC7-0AA02

ASMT-YTC7-0AA02 Tricolor PLCC6 Black Body LED Data Sheet Description Features This family of SMT LEDs is packaged in the form of PLCC-6 with a separate heat path for each LED die, enabling it to be driven at a higher current.  Individually addressable pin-outs give higher flexibility in circuitry design. With closely matched radiation pattern along the package’s X-axis, these LEDs are suitable for indoor full color display applications.  For easy pick and place, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity. The full black body of the LED provides extreme contrast enhancement for short distance viewing of fine pitch full color display.      * The test is conducted at the component level by mounting the components on the PCB with proper potting to protect the leads. Customers should perform the necessary tests on the components for their final applications. These LEDs are compatible with the reflow soldering process. CAUTION CAUTION These LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration LED package with diffused silicone encapsulation Using AlInGaP and InGaN dice technologies Typical viewing angle 110° Compatible with reflow soldering process JEDEC MSL 3 Water-Resistance (IPX6*) per IEC 60529:2001 Applications  Customers should keep the LED in the MBB when not in use because prolonged exposure to the environment might cause the silver-plated leads to tarnish, which might cause difficulties in soldering. Avago Technologies -1- Full color display ASMT-YTC7-0AA02 Data Sheet Package Dimensions Package Dimensions 3 5 2 6 1 3.00 0.50 4 2.30 2.80 2.30 3.40 4 3 Red 2 1.80 5 Green 0.20 6 1 Blue 0.90 Lead Configuration 1 Cathode (Blue) 2 Cathode (Green) 3 Cathode (Red) 4 Anode (Red) 5 Anode (Green) 6 Anode (Blue) NOTE 1. 2. 3. 4. All dimensions are in millimeters (mm). Unless otherwise specified, tolerance is ± 0.20 mm. Encapsulation = silicone. Terminal finish = silver plating. Avago Technologies -2- ASMT-YTC7-0AA02 Data Sheet Table 1. Absolute Maximum Ratings (TJ = 25 °C) Table 1. Absolute Maximum Ratings (TJ = 25 °C) Parameter Red Green & Blue Unit DC forward currenta 50 25 mA Peak forward current b 100 100 mA Power dissipation 125 90 mW Maximum junction temperature Tj max 110 °C Operating temperature range –40 to + 100 °C Storage temperature range –40 to +100 °C a. Derate linearly as shown in Figure 7 to Figure 10. b. Duty Factor = 10%, frequency = 1 kHz. Table 2. Optical Characteristics (TJ = 25 °C) Luminous Intensity, IV (mcd) @ IF = 20 mAa Color Red Green Blue Dominant Wavelength, d (nm) @IF = 20 mAb Peak Wavelength, P (nm) @IF = 20 mA Viewing Angle, 2½ (°)c Min. Typ. Max. Min. Typ. Max. Typ. Typ. 224 330 450 617 623 627 630 110 560 840 1125 525 529 537 522 110 112.5 160 224 465 469 475 465 110 Test Current (mA) 20 a. The luminous intensity Iv is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Table 3. Electrical Characteristics (TJ = 25 °C) Forward Voltage, VF (V) @IF = 20 mAa Color Reverse Voltage, VR (V) @ IR = 100 μAb Reverse Voltage, VR (V) @ IR = 10 μAb Min. 1 Chip On 3 Chips On Thermal Resistance, RJ-S (°C/W) Min. Typ. Max. Min. Red 1.8 2.1 2.5 4.0 — 280 330 Green 2.8 3.1 3.6 — 4.0 240 357 Blue 2.8 3.1 3.6 — 4.0 240 357 a. Tolerance = ±0.1V. b. Indicates product final testing condition. Long-term reverse bias is not recommended. Avago Technologies -3- ASMT-YTC7-0AA02 Data Sheet Part Numbering System Part Numbering System A S M T - Y T C 7 - 0 x1 Code A A 0 2 x2 x3 x4 x5 Description Option x1 Package type C Black body x2 Minimum intensity bin A Red: bin S2 Green: bin U2 Blue: bin R1 x3 Number of intensity bins A 3 intensity bins from minimum x4 Color bin combination 0 Red: full distribution Green: bin A, B, C Blue: x5 Test option 2 bin A, B, C, D Test current = 20 mA Avago Technologies -4- Red: bin S2, T1, T2 Green: bin U2, V1, V2 Blue: bin R1, R2, S1 ASMT-YTC7-0AA02 Data Sheet Table 4. Bin Information Table 4. Bin Information Color Bins (BIN) – Red Intensity Bins (CAT) Luminous Intensity (mcd) Bin ID Min Max R1 112.5 140.0 R2 140.0 180.0 S1 180.0 224.0 S2 224.0 285.0 T1 285.0 355.0 T2 355.0 450.0 U1 450.0 560.0 U2 560.0 715.0 V1 715.0 900.0 V2 900.0 1125.0 Bin ID — A Color Bins (BIN) – Green A B C Max. Cx Cy 525.0 531.0 0.1142 0.8262 0.1624 0.7178 531.0 534.0 537.0 Max. Cx Cy 617.0 627.0 0.6850 0.3149 0.6815 0.3150 0.7000 0.2966 0.7037 0.2962 Dominant Wavelength (nm) 0.2001 0.6983 0.1625 0.8012 0.1387 0.8148 0.1815 0.7089 0.2179 0.6870 0.1854 0.7867 0.1625 0.8012 0.2001 0.6983 0.2353 0.6747 0.2077 0.7711 B C D Max. Cx Cy 465.0 469.0 0.1355 0.0399 0.1751 0.0986 0.1680 0.1094 0.1267 0.0534 0.1314 0.0459 0.1718 0.1034 0.1638 0.1167 0.1215 0.0626 0.1267 0.0534 0.1680 0.1094 0.1593 0.1255 0.1158 0.0736 0.1215 0.0626 0.1638 0.1167 0.1543 0.1361 0.1096 0.0868 467.0 469.0 471.0 Tolerance: ±1 nm. Tolerance: ±1 nm. Avago Technologies -5- Chromaticity coordinate (for Reference) Min. Chromaticity Coordinate (for Reference) Min. 528.0 Min. Color Bins (BIN) – Blue Bin ID Bin ID Chromaticity Coordinate (for Reference) Tolerance: ±1 nm. Tolerance: ±12% Dominant Wavelength (nm) Dominant Wavelength (nm) 471.0 473.0 475.0 ASMT-YTC7-0AA02 Data Sheet Table 4. Bin Information Figure 1 Relative Intensity vs. Wavelength Figure 2 Forward Current vs. Forward Voltage 100 1.0 Blue Green Red Red 0.6 0.4 0.2 0.0 60 40 20 0 380 480 580 WAVELENGTH - nm DOMINANT WAVELENGTH SHIFT - nm RELATIVE INTENSITY 2.0 1.5 1.0 0.5 0 10 20 30 FORWARD CURRENT - mA 40 4 6 5 Blue Green Red 5 4 3 2 1 0 -1 -2 50 Figure 5 Relative Intensity vs. Junction Temperature 0 10 20 30 FORWARD CURRENT - mA 40 50 Figure 6 Forward Voltage vs. Junction Temperature 10 0.5 Blue Green Red FORWARD VOLTAGE SHIFT - V RELATIVE INTENSITY 2 3 FORWARD VOLTAGE - V 7 Blue Green Red 2.5 1 0.1 1 Figure 4 Dominant Wavelength Shift vs. Forward Current 3.0 0.0 0 680 Figure 3 Relative Intensity vs. Forward Current Green/Blue 80 FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -40 120 Avago Technologies -6- Blue Green Red 0.4 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 120 ASMT-YTC7-0AA02 Data Sheet Table 4. Bin Information Figure 7 Maximum Forward Current vs. Temperature for Red (1 Chip On) Figure 8 Maximum Forward Current vs. Temperature for Red (3 Chips On) 60 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 60 50 TS 40 30 TA 20 10 0 0 20 40 60 80 TEMPERATURE (°C) 100 TA 20 10 0 20 40 60 80 TEMPERATURE (°C) 100 120 30 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 30 Figure 10 Maximum Forward Current vs. Temperature for Green and Blue (3 Chips On) 30 25 TS 20 TA 15 10 5 NOTE TS 40 0 120 Figure 9 Maximum Forward Current vs. Temperature for Green and Blue (1 Chip On) 0 50 0 20 40 60 80 TEMPERATURE (°C) 100 Thermal Resistance from LED Junction to Ambient, RJ-A (°C/W) Red Green and Blue 1 chip on 450 410 3 chips on 630 690 Avago Technologies -7- TS 20 TA 15 10 5 0 120 Maximum forward current graphs based on ambient temperature, TA are with reference to thermal resistance RJ-A as follows. For more details, see Precautionary Notes (4). Condition 25 0 20 40 60 80 TEMPERATURE (°C) 100 120 ASMT-YTC7-0AA02 Data Sheet Table 4. Bin Information Figure 12 Radiation Pattern Along Y-Axis of the Package 1.0 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 11 Radiation Pattern Along X-Axis of the Package 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 90 0.6 0.4 0.2 0.0 -90 Figure 13 Illustration of Package Axis for Radiation Pattern Y X X Y Avago Technologies -8- Red Green Blue -60 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 90 ASMT-YTC7-0AA02 Data Sheet Table 4. Bin Information Figure 14 Recommended Soldering Land Pattern 2.30 0.50 4.55 1.35 1.60 0.40 Maximize the size of copper pad of PIN 1, PIN 4, PIN5 for better heat dissipation. Copper pad Solder mask Figure 15 Carrier Tape Dimensions Package Marking 4.00 ±0.10 4.00 ±0.10 2.00 ±0.05 +0.10 O 1.50 0 1.75 ±0.10 2.29 ±0.10 3.50 ±0.05 +0.30 8.00 -0.10 3.05 ±0.10 +0.10 O 1.00 0 3.81 ±0.10 0.229 ±0.01 Figure 16 Reeling Orientation USER FEED DIRECTION PACKAGE MARKING PRINTED LABEL Avago Technologies -9- ASMT-YTC7-0AA02 Data Sheet Table 4. Bin Information Figure 17 Reel Dimensions 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) 13.1 ± 0.5 Ø (0.516 ± 0.020) 20.20 MIN. Ø (0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Avago Technologies - 10 - ASMT-YTC7-0AA02 Data Sheet Packing Label Packing Label (i) Standard label (attached on moisture barrier bag) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL3 (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (9D) Date Code: Date Code (V) Vendor ID: DeptID: Made In: Country of Origin (ii) Baby label (attached on plastic reel) (1P) PART #: Part Number BABY LABEL COSB001B V0.0 (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin (9D): DATE CODE: (1T) TAPE DATE: D/C: Date Code VF: CAT: INTENSITY BIN BIN: COLOR BIN Example of luminous intensity (lv) bin information on label: Example of color bin information on label: CAT: S2 U2 R1 BIN: A B Intensity bin for Blue: R1 Color bin for Blue: B Color bin for Green: A Intensity bin for Green: U2 Intensity bin for Red: S2 NOTE Avago Technologies - 11 - There is no color bin ID for the Red color because there is only one range, as stated in Table 4. ASMT-YTC7-0AA02 Data Sheet Soldering Soldering Recommended reflow soldering condition (ii) Lead-Free Reflow Soldering (i) Leaded Reflow Soldering 20 SEC. MAX. TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 120 SEC. MAX. 60-150 SEC. TIME TIME 1. Do not perform reflow soldering more than twice. Observe the necessary precautions for handling moisture-sensitive devices as stated in the following section. 2. Recommended board reflow direction is as follows. 3. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. 4. Use reflow soldering to solder the LED. Use hand soldering for rework only if this is unavoidable, and it must be strictly controlled to the following conditions: Soldering iron tip temperature = 320 °C maximum — Soldering duration = 3 sec maximum — Number of cycles = 1 only — Power of soldering iron = 50W maximum — 5. Do not touch the LED body with a hot soldering iron except the soldering terminals because it might damage the LED. 6. For de-soldering, you should use a double flat tip. 7. Confirm beforehand whether hand soldering will affect the functionality and performance of the LED. REFLOW DIRECTION Avago Technologies - 12 - ASMT-YTC7-0AA02 Data Sheet Precautionary Notes Precautionary Notes 2. Handling of moisture sensitive device 1. Handling precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Observe pecial handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for more information. a. b. c. d. e. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and cause failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled forces acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Avago has tested the following nozzle size to work with this LED. However, due to the possibility of variations in other parameters, such as pick and place machine maker/model and other settings of the machine, customers should verify that the selected nozzle will not cause damage to the LED. This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use: An unopened moisture barrier bag (MBB) can be stored at < 40 °C / 90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.  Do not open the MBB prior to assembly (e.g., for IQC). Control after opening the MBB:  Read the humidity indicator card (HIC) immediately upon opening of the MBB.  Keep the LEDs at < 30 °C / 60% RH at all times, and all high temperature-related processes, including soldering, curing or rework, must be completed within 168 hours. Control for unfinished reel:  Store unused LEDs in a sealed MBB with desiccant or desiccator at < 5% RH. Control of assembled boards:  If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. Baking is required if:  The HIC indicator is not BROWN at 10% and is AZURE at 5%.  The LEDs are exposed to condition of > 30 °C / 60% RH at any time.  The LED floor life exceeded 168 hrs.  b. c. d. e. The recommended baking condition is: 60 °C ±5 °C for 20 hrs. Baking should only be done once. f. Storage The soldering terminals of these Avago LEDs are silver plated. If the LEDs are exposed too long in the ambient environment, the silver plating might become oxidized and, thus, affect its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in desiccator at