Data Sheet
ASMT-YTD7-0AA02
Tricolor PLCC6 White Surface LED
Description
Features
This family of SMT LEDs is packaged in the form of PLCC-6
with a separate heat path for each LED die, enabling it to be
driven at a higher current.
Individually addressable pin-outs give higher flexibility in
circuitry design. With closely matched radiation pattern
along the package’s X-axis, these LEDs are suitable for
indoor full color display applications.
For easy pick-and-place, the LEDs are shipped in tape and
reel. Every reel is shipped from a single intensity and color
bin for better uniformity.
NOTE:
These LEDs are compatible with reflow soldering process.
CAUTION! These LEDs are Class 1C ESD sensitive.
Please observe appropriate precautions during
handling and processing. Refer to Broadcom®
Application Note AN-1142 for additional details.
Standard PLCC-6 package (Plastic Leaded Chip
Carrier) with individual addressable pin-out for higher
flexibility of driving configuration
LED package with diffused silicone encapsulation
Using AlInGaP and InGaN dice technologies
Typical viewing angle 110°
Compatible with reflow soldering process
JEDEC MSL 3
Water-Resistance (IPX6, see note) per IEC 60529:2001
The test is conducted at the component level by
mounting the components on the PCB with proper
porting to protect the leads. Customers should
perform the necessary tests on the components
for their final applications.
Applications
Full color display
CAUTION! Customers should keep the LED in the
moisture barrier bag (MBB) when not in use
because prolonged exposure to the
environment might cause the silver-plated
leads to tarnish, which might cause difficulties
in soldering.
Broadcom
AV02-3873EN
October 9, 2018
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Package Dimensions
3
5
2
6
1
3.0 ± 0.2
Package
Marking
0.35 ± 0.2
0.8 ± 0.2
3.4 ± 0.2
0.5 ± 0.2
4
2.3 ± 0.2
2.8 ± 0.2
2.30 ± 0.2
4
3
Red
2
1.8 ± 0.2
5
Green
6
1
Blue
0.2 ± 0.2
0.9 ± 0.2
Lead Configuration
1
Cathode (Blue)
2
Cathode (Green)
3
Cathode (Red)
4
Anode (Red)
5
Anode (Green)
6
Anode (Blue)
NOTE:
1. All dimensions are in millimeters (mm).
2. Unless otherwise specified, tolerance is ± 0.20 mm.
3. Encapsulation = silicone.
4. Terminal finish = silver plating.
Broadcom
AV02-3873EN
2
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Absolute Maximum Ratings
TJ = 25°C.
Parameter
Red
Green and Blue
Unit
DC forward currenta
50
25
mA
Peak forward current b
100
100
mA
Power dissipation
125
90
mW
Maximum junction temperature Tj max
110
°C
Operating temperature range
–40 to + 100
°C
Storage temperature range
–40 to +100
°C
a. Derate linearly as shown in Figure 7 to Figure 10.
b. Duty Factor = 10%, frequency = 1 kHz.
Optical Characteristics
TJ = 25°C.
Luminous Intensity,
IV (mcd) @ IF = 20 mAa
Dominant Wavelength,
λd (nm) @IF = 20 mAb
Peak
Wavelength, λP
Viewing Angle,
(nm)
@IF = 20 mA
2θ½ (°)c
Min.
Typ.
Max.
Min.
Typ.
Max.
Typ.
Typ.
Test Current
(mA)
Red
560
650
1125
617
623
627
630
120
20
Green
1400
1900
2850
525
529
537
522
120
Blue
285
384
560
465
469
475
465
120
Color
a. The luminous intensity Iv is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the
spatial radiation pattern may not be aligned with the axis.
b. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
c. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristics
TJ = 25°C.
Forward Voltage,
VF (V) @IF = 20 mAa
Color
Reverse Voltage,
VR (V) @ IR = 100 µAb
Reverse Voltage,
VR (V) @ IR = 10 µAb
Thermal Resistance,
RθJ-S (°C/W)
Min.
Typ.
Max.
Min.
Min.
1 Chip On
3 Chips On
Red
1.8
2.1
2.5
4.0
—
280
330
Green
2.6
3.1
3.4
—
4.0
240
357
Blue
2.6
3.1
3.4
—
4.0
240
357
a. Tolerance = ±0.1V.
b. Indicates product final testing condition. Long-term reverse bias is not recommended.
Broadcom
AV02-3873EN
3
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Part Numbering System
A
S
M
T
-
Y
T
D
7
-
0
x1
Code
Description
Option
x1
Package type
D
x2
Minimum intensity bin
A
A
A
0
2
x2
x3
x4
x5
White surface
Red:
bin U2
Green: bin W2
Blue:
bin T1
x3
Number of intensity bins
A
3 intensity bins from minimum
x4
Color bin combination
0
Red:
Red:
bin U2, V1, V2
Green: bin W2, X1, X2
Blue: bin T1, T2, U1
full distribution
Green: bin A, B, C
Blue:
x5
Broadcom
Test option
2
bin A, B, C, D
Test current = 20 mA
AV02-3873EN
4
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Bin Information
Intensity Bins (CAT)
Color Bins (BIN) – Red
Luminous Intensity (mcd)
Bin ID
Min.
Max.
T1
285
355
T2
355
450
U1
450
560
U2
560
715
V1
715
900
V2
900
1125
W1
1125
1400
W2
1400
1800
X1
1800
2240
X2
2240
2850
Dominant Wavelength
(nm)
Bin ID
Min.
Max.
Cx
Cy
—
617.0
627.0
0.6850
0.3149
0.6815
0.3150
0.7000
0.2966
0.7037
0.2962
Tolerance: ±1 nm.
Color Bins (BIN) – Blue
Dominant Wavelength
(nm)
Tolerance: ±12%
Color Bins (BIN) – Green
Dominant Wavelength
(nm)
Bin ID
A
B
C
Min.
525.0
528.0
531.0
Max.
531.0
534.0
537.0
Cy
Chromaticity coordinate
(for Reference)
Bin ID
Min.
Max.
Cx
Cy
A
465.0
469.0
0.1355
0.0399
0.1751
0.0986
0.1680
0.1094
0.1267
0.0534
0.1314
0.0459
0.1034
Chromaticity
Coordinate (for
Reference)
Cx
Chromaticity
Coordinate (for
Reference)
B
467.0
471.0
0.1142
0.8262
0.1718
0.1624
0.7178
0.1638
0.1167
0.2001
0.6983
0.1215
0.0626
0.1625
0.8012
0.1267
0.0534
0.1094
C
469.0
473.0
0.1387
0.8148
0.1680
0.1815
0.7089
0.1593
0.1255
0.2179
0.6870
0.1158
0.0736
0.1854
0.7867
0.1215
0.0626
0.1167
D
471.0
475.0
0.1625
0.8012
0.1638
0.2001
0.6983
0.1543
0.1361
0.2353
0.6747
0.1096
0.0868
0.2077
0.7711
Tolerance: ±1 nm.
Tolerance: ±1 nm.
Broadcom
AV02-3873EN
5
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Figure 1: Relative Intensity vs. Wavelength
Figure 2: Forward Current vs. Forward Voltage
100
1.0
Blue
Green
Red
0.6
0.4
0.2
0.0
80
FORWARD CURRENT - mA
RELATIVE INTENSITY
0.8
60
480
580
WAVELENGTH - nm
680
Figure 3: Relative Intensity vs. Forward Current
1
2
3
FORWARD VOLTAGE - V
4
5
8.0
2.0
1.5
1.0
0.5
0
10
20
30
FORWARD CURRENT - mA
40
50
DOMINANT WAVELENGTH SHIFT - nm
(NORMALIZED AT 20mA)
Blue
Green
Red
2.5
RELATIVE INTENSITY
0
Figure 4: Dominant Wavelength Shift vs. Forward Current
3.0
0.0
Green/Blue
20
0
380
Red
40
Red
Green
6.0
Blue
4.0
2.0
0.0
-2.0
-4.0
0
10
20
30
40
50
60
MONO PULSE CURRENT - mA
Figure 5: Relative Intensity vs. Junction Temperature
0.50
FORWARD VOLTAGE SHIFT - V
RELATIVE INTENSITY
10
Blue
Green
Red
1
0.1
Figure 6: Forward Voltage vs. Junction Temperature
Red
0.40
Green
0.30
Blue
0.20
0.10
0.00
-0.10
-0.20
-0.30
-40
Broadcom
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE - °C
100
120
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE, TJ - °C
AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Figure 7: Maximum Forward Current vs. Temperature for Red
(1 Chip On)
Figure 8: Maximum Forward Current vs. Temperature for Red
(3 Chips On)
60
MAXIMUM FORWARD CURRENT - mA
MAXIMUM FORWARD CURRENT - mA
60
50
Ts
40
TA
30
20
10
0
0
20
40
60
80
TEMPERATURE (°C)
100
TA
20
10
0
20
40
60
80
TEMPERATURE (°C)
100
120
30
MAXIMUM FORWARD CURRENT - mA
MAXIMUM FORWARD CURRENT - mA
30
Figure 10: Maximum Forward Current vs. Temperature for
Green and Blue (3 Chips On)
30
25
Ts
20
TA
15
10
5
0
Ts
40
0
120
Figure 9: Maximum Forward Current vs. Temperature for
Green and Blue (1 Chip On)
50
0
NOTE:
20
40
60
80
TEMPERATURE (°C)
100
120
25
Ts
20
TA
15
10
5
0
0
20
40
60
80
TEMPERATURE (°C)
100
120
Maximum forward current graphs based on
ambient temperature, TA are with reference to
thermal resistance RθJ-A as follows. For more
details, see Thermal Management.
Thermal Resistance from LED Junction to
Ambient, RθJ-A (°C/W)
Condition
Red
Green and Blue
1 chip on
450
410
3 chips on
630
690
Broadcom
AV02-3873EN
7
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Figure 12: Radiation Pattern Along Y-Axis of the Package
1.0
1.0
0.8
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
Figure 11: Radiation Pattern Along X-Axis of the Package
0.6
0.4
Red
Green
Blue
0.2
0.0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT-DEGREE
0.6
0.4
0.0
90
Red
Green
Blue
0.2
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT-DEGREE
90
Figure 13: Illustration of Package Axis for Radiation Pattern
Y
X
X
Y
Figure 14: Recommended Soldering Land Pattern
2.30
0.50
4.55
1.35
1.60
0.40
Maximize the size of copper pad of PIN 1, PIN 4, PIN5
for better heat dissipation.
Copper pad
Broadcom
Solder mask
AV02-3873EN
8
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Figure 15: Carrier Tape Dimensions
Package Marking
4.00 ±0.10
4.00 ±0.10
2.00 ±0.05
+0.10
O 1.50 0
1.75 ±0.10
2.29 ±0.10
3.50 ±0.05
+0.30
8.00 -0.10
3.05 ±0.10
+0.10
O 1.00 0
3.81 ±0.10
0.229 ±0.01
Figure 16: Reeling Orientation
USER FEED DIRECTION
PACKAGE MARKING
PRINTED LABEL
Broadcom
AV02-3873EN
9
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Figure 17: Reel Dimensions
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
13.1 ± 0.5
Ø (0.516 ± 0.020)
20.20 MIN.
Ø (0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Broadcom
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
AV02-3873EN
10
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Packing Label
(i) Standard label (attached on moisture barrier bag)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant Halogen Free
e4 Max Temp 260C MSL3
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Color Bin
(P) Customer Item:
(9D) Date Code: Date Code
(V) Vendor ID:
DeptID:
Made In: Country of Origin
(ii) Baby label (attached on plastic reel)
(1P) PART #: Part Number
BABY LABEL COSB001B V0.0
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
(9D): DATE CODE:
(1T) TAPE DATE:
D/C: Date Code
VF:
CAT: INTENSITY BIN
BIN: COLOR BIN
Example of luminous intensity (lv) bin information on
label:
Example of color bin information on label:
BIN: A B
CAT: U2 W2 T1
Intensity bin for Blue: T1
Intensity bin for Green: W2
Intensity bin for Red: U2
Broadcom
Color bin for Blue: B
Color bin for Green: A
NOTE:
No color bin ID exists for the Red color because
there is only one range (see Bin Information).
AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Soldering
Recommended reflow soldering condition.
(ii) Lead-Free Reflow Soldering
(i) Leaded Reflow Soldering
20 SEC. MAX.
TEMPERATURE
TEMPERATURE
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
183°C
100-150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
60-150 SEC.
Do not perform reflow soldering more than twice.
Observe the necessary precautions for handling
moisture-sensitive devices as stated in the following
section.
Recommended board reflow direction is as follows.
6°C/SEC. MAX.
150°C
3 °C/SEC. MAX.
TIME
217°C
200°C
255 - 260 °C
3°C/SEC. MAX.
TIME
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering for rework only if this is unavoidable, and it
must be strictly controlled to the following conditions:
– Soldering iron tip temperature = 320°C maximum
– Soldering duration = 3 seconds maximum
– Number of cycles = 1 only
– Power of soldering iron = 50W maximum
Do not touch the LED body with a hot soldering iron
except the soldering terminals because it might
damage the LED.
For de-soldering, use a double flat tip.
Confirm beforehand whether hand soldering will affect
the functionality and performance of the LED.
REFLOW DIRECTION
Broadcom
AV02-3873EN
12
ASMT-YTD7-0AA02 Data Sheet
Tricolor PLCC6 White Surface LED
Precautionary Notes
Handling Precautions
Handling of Moisture-Sensitive Devices
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant that is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED. Refer to Application Note AN5288, Silicone
Encapsulation for LED: Advantages and Handling
Precautions for more information.
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and cause failures to the LED die or wire bond.
Do not touch the silicone encapsulant. Uncontrolled
forces acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
The surface of the silicone material attracts dust and
dirt easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, use
a cotton bud with isopropyl alcohol (IPA). During
cleaning, rub the surface gently without putting
pressure on the silicone. Ultrasonic cleaning is not
recommended.
For automated pick-and-place, Broadcom has tested
the following nozzle size to work with this LED.
However, due to the possibility of variations in other
parameters, such as pick and place machine maker/
model and other settings of the machine, verify that the
selected nozzle will not cause damage to the LED.
Before use:
– An unopened moisture barrier bag (MBB) can be
stored at < 40°C / 90% RH for 12 months. If the
actual shelf life has exceeded 12 months and the
humidity indicator card (HIC) indicates that baking is
not required, it is safe to reflow the LEDs per the
original MSL rating.
– Do not open the MBB prior to assembly (for
example, for IQC).
Control after opening the MBB:
– Read the HIC immediately upon opening the MBB.
– Keep the LEDs at < 30°C / 60% RH at all times, and
all high temperature-related processes, including
soldering, curing or rework, must be completed
within 168 hours.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or
desiccator at < 5% RH.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high-temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at < 5% RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
Baking is required if:
– The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
– The LEDs are exposed to condition of > 30°C / 60%
RH at any time.
– The LED floor life exceeded 168 hours.
The recommended baking condition is: 60°C ± 5°C for
20 hours.
ID
OD
Baking should only be done once.
ID = 1.7mm
OD = 3.5mm
Broadcom
AV02-3873EN
13
ASMT-YTD7-0AA02 Data Sheet
Storage
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed too long in the
ambient environment, the silver plating might become
oxidized and, thus, affect its solderability performance.
As such, keep unused LEDs in a sealed MBB with
desiccant or in desiccator at
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