ASMW-FWG0-NJLB6

Data Sheet ASMW-FWG0-Nxxx6 0.2W 2835 Surface-Mount LED Overview Features The Broadcom® ASMW-FWG0 surface-mount LEDs use InGaN chip technology with superior package design to enable them to produce higher light output with better flux performance. They can be driven at high current and are able to dissipate the heat more efficiently, which results in better performance with higher reliability.  These LEDs can operate under a wide range of environmental conditions, making them ideal for various applications, including fluorescent replacement, undercabinet lighting, retail display lighting, and panel lights. To facilitate easy pick-and-place assembly, the LEDs are packed in tape and reel. Every reel is shipped in single flux and color bin to provide close uniformity.     Available in 3000K, 4000K and 6500K per ANSI CRI ≥ 80 Moisture Sensitivity Level 3 High reliability with silicone encapsulation Low package profile and large emitting area for better uniformity in linear lighting Applications    For lighting and luminaires Channel letter and advertisement board backlighting Office automation, home appliances, industrial equipment – Front panel backlighting – Pushbutton backlighting – Display backlighting – Scanner lighting CAUTION: This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom ASMW-FWG0-Nxxx6-DS102 February 10, 2021 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Figure 1: Package Dimensions NOTE: 1. All dimensions are in mm. 2. Tolerance is ±0.20 mm unless otherwise specified. 3. Encapsulation = silicone. 4. Terminal finish = silver plating. 5. Dimensions in brackets are for reference only. Broadcom ASMW-FWG0-Nxxx6-DS102 2 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Device Selection Guide (TJ = 25°C, IF = 60 mA) Correlated Color Temperature, CCT (Kelvin) Luminous Intensity (cd)c Luminous Flux ΦV (lm)a,b Part Number Typ. Min. Typ. Max. Typ. ASMW- FWG0-NHKH6 3000 19.0 21.5 24.0 7.2 ASMW-FWG0-NJLH6 3000 20.0 24.5 26.0 8.2 ASMW- FWG0-NJLF6 4000 20.0 23.0 26.0 7.7 ASMW-FWG0-NKMF6 4000 22.0 25.5 28.0 8.5 ASMW- FWG0-NJLB6 6500 20.0 23.0 26.0 7.7 ASMW-FWG0-NKMB6 6500 22.0 25.5 28.0 8.5 ASMW-FWG0-NLNB6 6500 24.0 25.5 30.0 8.5 a. The luminous flux, ΦV, is measure at the mechanical axis of the package, and it is tested with a single current pulse condition. b. Tolerance = ±12%. c. For reference only. Absolute Maximum Ratings Parameter ASMW-FWG0-Nxxx6 Units DC Forward Currenta 100 mA Peak Forward Currentb 180 mA Power Dissipation 330 mW Reverse Voltage Not designed for reverse bias operation LED Junction Temperature 125 °C Operating Temperature Range –40 to +100 °C Storage Temperature Range –40 to +100 °C a. Derate linearly as shown in Figure 15 and Figure 16. b. Duty factor = 10%, frequency = 1 kHz. Optical and Electrical Characteristics (TJ = 25°C, IF = 60 mA) Parameter Min. Typ. Max. Units — 120 — ° 2.80 2.92 3.30 V Reverse Current, IR at VR = 5Vc — — 10 µA Color Rendering Index, CRI 80 — — — RθJ-Sd — 40 — °C/W Viewing Angle, θ1/2a Forward Voltage, VFb Thermal Resistance, a. θ1/2 is the off axis angle where the luminous intensity is half of the peak intensity. b. Forward voltage tolerance is ±0.1V. c. Indicates production final test condition only. Long term reverse bias is not recommended. d. Thermal resistance from the LED junction to the solder point. Broadcom ASMW-FWG0-Nxxx6-DS102 3 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Performance Characteristics (TJ = 25°C) Forward Current (mA) Relative Luminous Flux (Normalized at 60 mA) Luminous Flux, ΦV (lm) Forward Voltage, VF (V) Luminous Efficiency (lm/W) Typ. Typ. Typ. 7.9 2.74 144.2 ASMW-FWG0-NHKH6 20 0.367 30 0.537 11.5 2.80 137.6 40 0.698 15.0 2.84 132.1 50 0.852 18.3 2.88 127.3 60 (Test current) 1.000 21.5 2.92 122.7 65 1.072 23.0 2.94 120.6 70 1.142 24.6 2.96 118.5 80 1.279 27.5 2.99 115.1 90 1.411 30.3 3.02 111.8 100 1.538 33.1 3.04 108.7 ASMW-FWG0-NJLF6, ASMW-FWG0-NJLB6 20 0.367 8.5 2.74 154.2 30 0.537 12.3 2.80 147.2 40 0.698 16.1 2.84 141.3 50 0.852 19.6 2.88 136.1 60 (Test current) 1.000 23.0 2.92 131.3 65 1.072 24.7 2.94 129.0 70 1.142 26.3 2.96 126.8 80 1.279 29.4 2.99 123.2 90 1.411 32.5 3.02 119.6 100 1.538 35.4 3.04 116.2 20 0.367 9.0 2.74 164.3 30 0.537 13.2 2.80 156.9 40 0.698 17.1 2.84 150.6 ASMW-FWG0-NJLH6 50 0.852 20.9 2.88 145.0 60 (Test current) 1.000 24.5 2.92 139.9 65 1.072 26.3 2.94 137.4 70 1.142 28.0 2.96 135.1 80 1.279 31.3 2.99 131.2 90 1.411 34.6 3.02 127.4 100 1.538 37.7 3.04 123.8 Broadcom ASMW-FWG0-Nxxx6-DS102 4 ASMW-FWG0-Nxxx6 Data Sheet Forward Current (mA) 0.2W 2835 Surface-Mount LED Relative Luminous Flux (Normalized at 60 mA) Luminous Flux, ΦV (lm) Forward Voltage, VF (V) Typ. Luminous Efficiency (lm/W) Typ. Typ. ASMW-FWG0-NKMF6, ASMW-FWG0-NKMB6, ASMW-FWG0-NLNB6 20 0.367 9.4 2.74 171.0 30 0.537 13.7 2.80 163.3 40 0.698 17.8 2.84 156.7 50 0.852 21.7 2.88 150.9 60 (Test current) 1.000 25.5 2.92 145.6 65 1.072 27.3 2.94 143.0 70 1.142 29.1 2.96 140.6 80 1.279 32.6 2.99 136.6 90 1.411 36.0 3.02 132.6 100 1.538 39.2 3.04 128.9 Part Numbering System A S M W – F W x1 0 – N x2 x3 x4 Code Description Options x1 Color Rendering Index G x2 Minimum Flux Bin Refer to Flux Bin Limits (CAT) table. x3 Maximum Flux Bin x4 Color Bin x5 Test Option H x5 CRI ≥ 80 3000K F 4000K B 6500K 6 Test current = 60 mA Part Number Example ASMW-FWG0-NJLH6 x 1: G – CRI ≥ 80 x 2: J – Minimum flux bin J x 3: L – Maximum flux bin L x 4: H – CCT 3000K with bins 8A, 8B, 8C, 8D x 5: 6 – Test current = 60 mA Broadcom ASMW-FWG0-Nxxx6-DS102 5 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Bin Information Flux Bin Limits (CAT) Forward Bin Limits (VF) Luminous Flux, ΦV (lm) Forward Voltage, VF (V) Bin ID Min. Max. Bin ID Min. Max. H 19.0 20.0 G03 2.8 2.9 J 20.0 22.0 G04 2.9 3.0 K 22.0 24.0 G05 3.0 3.1 L 24.0 26.0 G06 3.1 3.2 M 26.0 28.0 G07 3.2 3.3 N 28.0 30.0 Tolerance: ±0.1V Tolerance: ±12% Color Bins (BIN) Chromacity Coordinates CCT Bin ID 3000K 8A 8B 8C 8D Chromacity Coordinates x y CCT Bin ID x 4000K 6A Chromacity Coordinates y CCT Bin ID x y 6500K 2A 0.4147 0.3814 0.3670 0.3578 0.3048 0.3207 0.4221 0.3984 0.3702 0.3722 0.3130 0.3290 0.4342 0.4028 0.3825 0.3798 0.3144 0.3186 0.4259 0.3853 0.3783 0.3646 0.3068 0.3113 0.4221 0.3984 0.3702 0.3722 0.3028 0.3304 0.4299 0.4165 6B 0.3736 0.3874 0.3115 0.3391 0.4430 0.4212 0.3869 0.3958 0.3130 0.3290 0.4342 0.4028 0.3825 0.3798 0.3048 0.3207 0.4342 0.4028 0.3825 0.3798 0.3115 0.3391 0.4430 0.4212 0.3869 0.3958 0.3205 0.3481 0.4562 0.4260 0.4006 0.4044 0.3213 0.3373 0.4465 0.4071 0.3950 0.3875 0.3130 0.3290 6C 6D 2B 2C 0.4259 0.3853 0.3783 0.3646 0.3130 0.3290 0.4342 0.4028 0.3825 0.3798 2D 0.3213 0.3373 0.4465 0.4071 0.3950 0.3875 0.3221 0.3261 0.4373 0.3893 0.3898 0.3716 0.3144 0.3186 Tolerance: ±0.01 Example of bin information on reel and packaging label: CAT: H – Flux bin H BIN: 8A – Color bin 8A VF: G05 – Broadcom VF bin G05 ASMW-FWG0-Nxxx6-DS102 6 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Figure 2: Chromaticity Diagram 0.44 0.43 3000K 0.42 8C 0.41 8B 4000K 0.40 8D 6C 8A 0.39 6B 0.38 y 6D 0.37 6A 0.36 0.35 6500K 0.34 0.33 0.32 2C 2B 2D 2A 0.31 0.30 0.29 0.31 0.33 0.35 0.37 0.39 0.41 0.43 0.45 0.47 x Broadcom ASMW-FWG0-Nxxx6-DS102 7 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Figure 3: Spectral Power Distribution Figure 4: Forward Current vs. Forward Voltage 1.0 200 0.9 FORWARD CURRENT - mA RELATIVE INTENSITY 180 3000K 0.8 4000K 0.7 0.6 6500K 0.5 0.4 0.3 0.2 160 140 120 100 80 60 40 0.1 20 0.0 0 380 430 480 530 580 630 680 WAVELENGTH - nm 730 780 1.8 1.0 1.6 0.9 1.2 1.0 0.8 0.6 0.4 0.2 2.8 3.0 3.2 FORWARD VOLTAGE - V 3.4 3.6 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREE 90 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0 20 40 60 80 100 MONO PULSE CURRENT - mA 120 Figure 7: Chromaticity Coordinate Shift vs. Mono Pulse Current (3000K) -90 -60 Figure 8: Chromaticity Coordinate Shift vs. Mono Pulse Current (4000K) 0.010 0.010 CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 60mA) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 60mA) 2.6 0.8 1.4 0.008 0.006 Cx 0.004 0.002 Cy 0.000 -0.002 -0.004 -0.006 -0.008 -0.010 0 20 40 60 80 100 MONO PULSE CURRENT - mA Broadcom 2.4 Figure 6: Radiation Pattern RELATIVE INTENSITY RELATIVE LUMINOUS FLUX - lm (NORMALIZED AT 60mA) Figure 5: Relative Luminous Flux vs. Mono Pulse Current 2.2 120 0.008 0.006 0.004 0.002 0.000 -0.002 Cx -0.004 Cy -0.006 -0.008 -0.010 0 20 40 60 80 100 120 MONO PULSE CURRENT - mA ASMW-FWG0-Nxxx6-DS102 8 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Figure 9: Chromaticity Coordinate Shift vs. Mono Pulse Current (6500K) Figure 10: Relative Light Output vs. Junction Temperature 120 0.008 RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25°C) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 60mA) 0.010 0.006 0.004 0.002 0.000 -0.002 Cx -0.004 Cy -0.006 -0.008 80 60 40 20 0 -0.010 0 20 40 60 80 100 MONO PULSE CURRENT - mA -50 120 Figure 11: Forward Voltage Shift vs. Junction Temperature 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -25 -50 -25 0 25 50 75 100 125 0.008 0.006 0.004 0.002 0.000 -0.002 -0.004 -0.006 Cy -0.008 -50 150 -25 JUNCTION TEMPERATURE, TJ - °C Figure 13: Chromaticity Coordinate Shift vs. Junction Temperature (4000K) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) 0.008 0.006 0.004 0.002 0.000 -0.002 -0.004 Cx Cy -0.008 -0.010 -25 0 25 50 75 100 125 JUNCTION TEMPERATURE, TJ - °C 150 0.010 0.008 0.006 0.004 0.002 0.000 -0.002 -0.004 -0.006 Cx Cy -0.008 -0.010 -50 Cx 0 25 50 75 100 125 JUNCTION TEMPERATURE, TJ - °C Figure 14: Chromaticity Coordinate Shift vs. Junction Temperature (6500K) 0.010 -0.006 150 0.010 -0.010 -0.20 Broadcom 0 25 50 75 100 125 JUNCTION TEMPERATURE, TJ - °C Figure 12: Chromaticity Coordinate Shift vs. Junction Temperature (3000K) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) 0.30 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) 100 150 -50 -25 0 25 50 75 100 125 JUNCTION TEMPERATURE, TJ - °C 150 ASMW-FWG0-Nxxx6-DS102 9 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Figure 16: Maximum Forward Current vs. Solder Point Temperature. Derated based on TJMAX = 125°C, RθJ-S = 40°C/W 120 120 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA Figure 15: Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125°C 100 80 RșJ-A=100°C/W RșJ-A=140°C/W RșJ-A=180°C/W 60 40 20 0 0 20 40 60 80 100 120 100 80 60 40 20 0 0 AMBIENT TEMPERATURE, TA - °C 20 40 60 80 100 120 SOLDER POINT TEMPERATURE, TS - °C Figure 17: Pulse Handling Capability at TS ≤ 100°C D= 0.05 0.10 0.25 0.50 1.00 0.18 IP - PULSE CURRENT - A 0.16 0.14 0.12 0.10 0.08 0.06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 tp - PULSE DURATION - sec Figure 18: Recommended Soldering Land Pattern 4.50 2.49 1.42 2.10 2.01 MAXIMIZE CATHODE COPPER PAD AREA FOR BETTER HEAT DISSIPATION COPPER PAD SOLDER MASK NOTE: Broadcom All dimensions are in millimeters (mm). ASMW-FWG0-Nxxx6-DS102 10 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Figure 19: Carrier Tape Dimensions P2 E1 P0 T ‡D0 F W B0 A0 P1 POLARITY MARK K0 USER DIRECTION OF UNREELING F P0 P1 3.5 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 NOTE: P2 D0 E1 2.0 ± 0.05 1.55 ± 0.05 1.75 ± 0.10 W T B0 K0 A0 8.0 ± 0.2 0.2 ± 0.05 3.8 ± 0.1 1.05 ± 0.1 3.1 ± 0.1 All dimensions are in millimeters (mm). Figure 20: Reel Dimension 9.0 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: Broadcom All dimensions are in millimeters (mm). ASMW-FWG0-Nxxx6-DS102 11 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Precautionary Notes Handling Precautions Soldering      Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 315°C maximum – Solder duration = 3 seconds maximum – Number of cycles = 1 only – Power of soldering iron = 50W maximum Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for more information.     Figure 21: Recommended Lead-Free Reflow Soldering Profile TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX.  6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do no stack assembled PCBs together. Use an appropriate rack to hold the PCBs. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of the silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick-and-place, Broadcom has tested a nozzle size with OD 3.5 mm to work well with this LED. However, due to the possibility of variations in other parameters, such as pick-and-place machine maker/ model and other settings of the machine, verify that the selected nozzle will not damage the LED. Handling of Moisture-Sensitive Devices TIME Figure 22: Recommended Board Reflow Direction This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.  REFLOW DIRECTION Broadcom Before use: – An unopened moisture barrier bag (MBB) can be stored at < 40°C / 90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. ASMW-FWG0-Nxxx6-DS102 12 ASMW-FWG0-Nxxx6 Data Sheet   – Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life. Control after opening the MBB: – Read the HIC immediately upon opening of MBB. – Keep the LEDs at < 30°C / 60% RH at all times, and complete all high temperature-related processes, including soldering, curing, or rework, within 168 hours. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccators at < 5% RH.  Baking is required if the following conditions exist: – The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC. – The LEDs are exposed to condition of > 30°C / 60% RH at any time. – The LED’s floor life exceeded 168 hours. The recommended baking condition is: 60°C ±5ºC for 20 hours. Baking should only be done once.  Storage: The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed in ambient environment for too long, the silver plating might be oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in desiccators at < 5% RH. Application Precautions      Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccators at < 5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours.  0.2W 2835 Surface-Mount LED The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning intensity, Broadcom   wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. Do not use the LED in the vicinity of material with sulfur content or in environments of high gaseous sulfur compounds and corrosive elements. Examples of materials that might contain sulfur are rubber gaskets, room-temperature vulcanizing (RTV) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments may affect the optical characteristics and product life. White LEDs must not be exposed to acidic environment and must not be used in the vicinity of compounds that may have acidic outgas, such as, but not limited to, acrylate adhesive. These environments have an adverse effect on LED performance. Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED. If the LED is intended to be used in harsh or outdoor environment, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stress, and so on. Thermal Management The optical, electrical and reliability characteristics of LED are affected by temperature. Keep the junction temperature (TJ) of the LED below the allowable limit at all times. TJ can be calculated as follows: TJ = TA + RθJ-A × IF × VFmax where: TA = Ambient temperature (°C) RθJ-A = Thermal resistance from the LED junction to ambient (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RθJ-A. Actual TA is sometimes subjective and hard to determine. RθJ-A varies from system to system depending on design and is usually not known. ASMW-FWG0-Nxxx6-DS102 13 ASMW-FWG0-Nxxx6 Data Sheet 0.2W 2835 Surface-Mount LED Another way of calculating TJ is by using the solder point temperature, TS as follows: TJ = TS + RθJ-S × IF × VFmax where: TS = LED solder point temperature as shown in Figure 23 (°C) RθJ-S = Thermal resistance from the junction to the solder point (°C/W) IF = Forward current (A) Eye Safety and Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. VFmax = Maximum forward voltage (V) Figure 23: Solder Point Temperature on PCB PRINTED CIRCUIT BOARD TS POINT LED CATHODE MARK TS can be easily measured by mounting a thermocouple on the soldering joint as shown in Figure 23. Verify the TS of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the data sheet. Broadcom ASMW-FWG0-Nxxx6-DS102 14 Disclaimer Broadcom's products are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2017-2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Lead (Pb) Free RoHS Compliant