ASMW-L300-AFH0E

Data Sheet ASMW-LD00, ASMW-L300, ASMW-LL00 0.5W 2835 Surface Mount LED Overview Features The Broadcom® 2835 Surface Mount LEDs are energy efficient LEDs that can be driven at high driving current and able to dissipate heat efficiently resulting in a better performance in reliability. Its low profile package design addresses a wide variety of applications where superior robustness and high efficiency are required. In addition to being compatible to reflow soldering process, the silicone encapsulation ensures product superiority and longevity.  To facilitate easy pick and place assembly, the LEDs are packed in tape and reel. Every reel is shipped in single flux and color bin, to provide close uniformity.     High reliability package with enhanced silicone resin encapsulation Available in Deep Red, Far Red and Royal Blue Wide viewing angle at 120° JEDEC MSL 3 Enhanced corrosion resistance Applications     Horticulture lighting General lighting Commercial lighting Architecture lighting CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. Broadcom ASMW-LD00, ASMW-L300, ASMW-LL00-DS February 5, 2018 ASMW W-LD00, ASMW-L300, ASMW-LL00 Data D Sheet 0.5W 2835 S Surface Mount LED D Figurre 1: Package Drawing NOTE: 1. 2. 3. 4. 5. All dimensions d in millimeters (m mm). Tole erance is ±0.2 20mm unless otherwise specified. Enca apsulation = silicone. s Term minal finish = silver plating. Dimensions in bra acket are for reference onlly. Dev vice Sellection Guide G (T TJ = 25°C C, IF = 15 50mA) Partt Number Color Viewing Angle, a 2θ½ Rad diant Flux, Φe (mW)b, c PPF, ΦP (µ µmol/s)d, e, f Luminous Flux, Φv f (lm) Dice Technology y Typ. Min. Typ. Max x. Typ. Typ. ASM MW-LD00-AGJ0 0E Deep Re ed 120 85 115 180 0 0.61 8.8 AlInGaP ASM MW-L300-AFH0 0E Far Red d 120 65 95 140 0 0.58 - AlInGaP ASM MW-LL00-NKM0E Royal Blue 120 180 240 330 0 0.90 8.6 InGaN a. θ½ is the off-a axis angle where the luminous inttensity is half of the t peak intensity ty. b. Radiant flux, Φe / Luminous flux, Φv is the tota al output measure ed with an integrrating sphere at a single current p pulse condition. c. Radiant flux tolerance t is ±12% %. d. Photosynthettic Photon Flux (P PPF), ΦP is the measurement m of Photosynthetica lly Active Radiat ion (PAR) rangin ng from 400 – 70 00nm. e. PPF for Far Red R is measured from 700 – 800n nm. f. Values are fo or reference only.. Broadccom ASMW W-LD00, ASMW-L30 00, ASMW-LL00-DS 2 ASMW-LD00, ASMW-L300, ASMW-LL00 Data Sheet 0.5W 2835 Surface Mount LED Absolute Maximum Ratings Parameters ASMW-LD00 ASMW-L300 DC Forward Current a Peak Forward Current b Power Dissipation 540 ASMW-LL00 mA 300 mA 500 Reverse Voltage Unit 200 740 mW Not designed for reverse bias operation LED Junction Temperature 125 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 11 and Figure 12. b. Duty factor = 10%, frequency = 1KHz. Optical and Electrical Characteristics (TJ = 25°C, IF = 150mA) Thermal Resistance, RθJ-S (°C/W) c Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Typ. Reverse Current (µA) d VR =5V Deep Red − 640 − 650 656 670 1.8 2.25 2.7 27 10 Far Red − − − 720 731 740 1.6 2.16 2.5 27 10 Royal Blue − 456 − 440 451 460 2.9 3.08 3.7 36 10 Dominant Wavelength, λd (nm) a Color Peak Wavelength, λp (nm) Forward Voltage, VF (V) b a. The dominant wavelength, λd is derived from the CIE Chromaticity diagram and represents the perceived color of the device. b. Forward voltage, VF tolerance is ±0.1V. c. Thermal resistance from LED junction to solder point. d. Indicates product final test condition only. Long term reverse bias is not recommended. Broadcom ASMW-LD00, ASMW-L300, ASMW-LL00-DS 3 ASMW-LD00, ASMW-L300, ASMW-LL00 Data Sheet 0.5W 2835 Surface Mount LED Part Numbering System A S M W Code – L x1 0 0 – Description x2 x3 x4 x5 x6 Option 3 Far Red Deep Red x1 Color D L Royal Blue x2 Dice Technology A AlInGaP N InGaN x3 Minimum Radiant Flux Bin x4 Maximum Radiant Flux Bin x5 Color Bin Option 0 Full Distribution x6 Test Option E Test Current = 150mA Refer to Radiant Flux Bin Limits (CAT) table Part Number Example ASMW-LD00-AGJ0E x1 : D ˗̶ Deep Red color x2 : A ˗̶ AlInGaP dice x3 : G ˗̶ Minimum Radiant flux bin G x4 : J ˗̶ Maximum Radiant flux bin J x5 : 0 ˗̶ Full color distribution x6 : E ˗̶ Test Current =150mA Broadcom ASMW-LD00, ASMW-L300, ASMW-LL00-DS 4 ASMW-LD00, ASMW-L300, ASMW-LL00 Data Sheet 0.5W 2835 Surface Mount LED Bin Information Forward Voltage Bin Limits (VF) Radiant Flux Bin Limits (CAT) Bin ID Radiant Flux, Φe (mW) Min. Max. 65 85 G 85 H 110 J Forward Voltage, VF (V) Bin ID Min. Max. H09 1.6 1.7 110 H10 1.7 1.8 140 H11 1.8 1.9 140 180 H12 1.9 2.0 K 180 230 H13 2.0 2.1 L 230 280 H14 2.1 2.2 M 280 330 H15 2.2 2.3 H16 2.3 2.4 H17 2.4 2.5 H18 2.5 2.6 G01 2.6 2.7 G02 2.7 2.8 G03 2.8 2.9 G04 2.9 3.0 G05 3.0 3.1 G06 3.1 3.2 G07 3.2 3.3 G08 3.3 3.4 G09 3.4 3.5 G10 3.5 3.6 G11 3.6 3.7 F Tolerance = ±12% Peak Wavelength Bin Limits (BIN) Deep Red Bin ID - Peak Wavelength(nm) Min. Max. 650 670 Far Red Bin ID - Peak Wavelength(nm) Min. Max. 720 740 Tolerance = ±0.1V Example of bin information on reel and packaging label: Royal Blue Bin ID Peak Wavelength(nm) Min. Max. 1 440 445 2 445 450 3 450 455 4 455 460 CAT : G ˗̶ Radiant flux bin G BIN : - ˗̶ Full distribution VF : H15 ˗̶ VF bin H15 Tolerance = ±1.0nm Broadcom ASMW-LD00, ASMW-L300, ASMW-LL00-DS 5 ASMW-LD00, ASMW-L300, ASMW-LL00 Data Sheet 0.5W 2835 Surface Mount LED Figure 3: Spectral Power Distribution Figure 4: Forward Current vs. Forward Voltage 1.0 350 ROYAL BLUE RELATIVE INTENSITY 0.8 300 FAR RED 0.7 0.6 DEEP RED 0.5 0.4 0.3 0.2 FORWARD CURRENT - mA 0.9 0.1 380 430 480 530 580 630 680 WAVELENGTH - nm 730 780 100 50 1.4 DEEP RED, FAR RED 1.4 ROYAL BLUE RELATIVE INTENSITY 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 50 100 150 MONO PULSE CURRENT - mA 1.6 1.8 200 250 Figure 7: Peak Wavelength Shift vs. Mono Pulse Current 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -60 0.3 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) DEEP RED, FAR RED ROYAL BLUE 2 1 0 -1 -2 -3 -4 0 50 100 150 200 MONO PULSE CURRENT -mA 2.2 2.4 2.6 2.8 3.0 FORWARD VOLTAGE - V 3.2 3.4 3.6 250 -30 0 30 ANGULAR DISPLACEMENT - DEGREE 60 90 Figure 8: Forward Voltage Shift vs. Junction Temperature 4 3 2.0 Figure 6: Radiation Pattern 1.6 RELATIVE RADIANT FLUX (NORMALIZED AT 150 mA) DEEP RED 150 830 Figure 5: Relative Radiant Flux vs. Mono Pulse Current PEAK WAVELENGTH SHIFT - nm (NORMALIZED AT 150mA) 200 0 0.0 Broadcom ROYAL BLUE FAR RED 250 DEEP RED FAR RED 0.2 ROYAL BLUE 0.1 0.0 -0.1 -0.2 -0.3 -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE,TJ - °C 125 ASMW-LD00, ASMW-L300, ASMW-LL00-DS 6 ASMW W-LD00, ASMW-L300, ASMW-LL00 Data D Sheet 0.5W 2835 S Surface Mount LED D Figure 10: Peak Wav velength Shiftt vs. Junction Temperature 140 25 5 120 20 0 PEAK WAVELENGTH SHIFT - nm (NORMALIZED AT 25°C) RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25°C) Figurre 9: Relative Light Output vs. Junction Temperature T 100 80 DEEP RED FAR RED ROYAL BLUE 60 40 20 0 25 50 75 1 100 JUNCTION TE EMPERATURE, TJ - °C -25 125 10 0 5 0 -5 5 150 0 Figurre 11: Maximu um Forward Current vs. Am mbient Temp perature. Dera ated based on TJMAX = 125°C C -25 0 25 50 75 100 J JUNCTION TEMPE ERATURE, TJ -°C 125 Figure 12: Maximum m Forward Current vs. Sold der Point erature. Derate ed based on TJMAX = 125°C Tempe 250 200 FAR RED DEEP RED ROY YAL BLUE 150 -50 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA RO OYAL BLUE -15 5 -50 100 50 250 200 DEEP RED, FAR R RED 150 ROYA AL BLUE 100 50 0 0 0 10 20 0 30 40 50 0 60 70 80 0 90 AMBIENT TEMP PERATURE, TA - °C ° 100 0 110 0 Figurre 13: Pulse Ha andling Capab bility at Ts ≤ 10 00°C (Deep Re ed) 0.28 0.26 0..30 0.24 0.22 0.20 0.18 0.16 1.0E-04 20 3 30 40 50 6 60 70 80 90 SOLD DER POINT TEMPE ERATURE, TS - °C 100 110 0..32 D= 0.01 0.05 0.10 0.25 0.50 1.00 IP - PULSE CURRENT - A 0.30 10 Figure 14: Pulse Han ndling Capability at Ts ≤ 100 0°C (Far Red) 0.32 IP - PULSE CURRENT - A FA AR RED 15 5 -10 0 0 Broadccom DE EEP RED 0..28 0..26 D= 0.01 0.05 0.10 0.25 0.50 1.00 0..24 0..22 0..20 0..18 1.0E-03 1.0 0E-02 1.0E--01 tp - PULSE DURATION D - sec 1.0E+00 0 0..16 1.0E-04 1.0 0E-03 1.0E--02 1.0E-01 tp - PULSE DURATION - sec 1.0E+00 ASMW W-LD00, ASMW-L30 00, ASMW-LL00-DS 7 ASMW W-LD00, ASMW-L300, ASMW-LL00 Data D Sheet 0.5W 2835 S Surface Mount LED D Figurre 15: Pulse Ha andling Capab bility at Ts ≤ 98 8°C (Royal Blue)) Figure 1 16: Pulse Han ndling Capabillity at Ts = 100 0°C (Royal Blue) 0.3 32 0.32 D= 0.01 0.05 0.10 0.25 0.50 1.00 0.28 0.26 0.3 30 IP - PULSE CURRENT - A IP - PULSE CURRENT - A 0.30 0.24 0.22 0.20 0.2 28 0.2 26 0.2 24 D= 0.01 0.05 0.10 0.25 0.50 1.00 0.2 22 0.2 20 0.1 8 0.18 0.16 1.0E-03 1.0E-02 1.0E-01 tp - PULSE DURATION D - sec 1.0E+00 0 0.1 6 1 1.0E-03 1.0E-02 1.0E-01 ATION - sec tp - PULSE DURA 1.0E+00 Figurre 17: Recomm mended Solde ering Land Pa attern 4.50 4 2.49 1.42 2 2.10 2.01 M MAXIMIZE ANODE COPPER PA ETTER HEAT AD AREA FOR BE D DISSIPATION COPPER PAD SOLDER MASK K NOT TE: Broadccom All dimensions are in millimeters (m mm). ASMW W-LD00, ASMW-L30 00, ASMW-LL00-DS 8 ASMW-LD00, ASMW-L300, ASMW-LL00 Data Sheet 0.5W 2835 Surface Mount LED Figure 18: Carrier Tape Dimensions P2 E1 P0 T ∅D0 F W B0 A0 P1 K0 POLARITY MARK USER DIRECTION OF UNREELING F P0 P1 P2 D0 E1 W 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 1.55±0.05 1.75±0.1 8.0±0.2 T B0 K0 A0 0.2±0.05 3.8±0.1 1.05±0.1 3.1±0.1 NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.20mm unless otherwise specified. Figure 19: Reel Dimensions 9.0 178.5 60.0 PRODUCT LABEL USER FEED NOTE: Broadcom All dimensions are in millimeters (mm). ASMW-LD00, ASMW-L300, ASMW-LL00-DS 9 ASMW-LD00, ASMW-L300, ASMW-LL00 Data Sheet 0.5W 2835 Surface Mount LED Precautionary Notes Soldering Handling Precautions  The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.     Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Figure 20: Recommended Lead-Free Reflow Soldering Profile     TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX.  150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. TIME Figure 21: Recommended Board Reflow Direction Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with an outer diameter of 3.5mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  REFLOW DIRECTION Broadcom Before use: ─ An unopened moisture barrier bag (MBB) can be stored at