ASMW-LWG0-NEGFE

ASMW-LWG0-NxxxE 0.5W 2835 Surface Mount LED Data Sheet Description Features The surface mount LEDs use InGaN chip technology with superior package design to enable them to produce higher light output with better flux performance. They can be driven at high current and are able to dissipate the heat more efficiently resulting in better performance with higher reliability.  Available in CCT 3000K, 4000K, 5000K and 6500K per ANSI  CRI ≥80   High reliability with silicone encapsulation Low package profile and large emitting area for better uniformity in linear lighting Moisture Sensitivity Level 3 These LEDs are able to be operated under a wide range of environmental conditions making ideal for various applications including fluorescent replacement, under cabinet lighting, retail display lighting and panel lights. To facilitate easy pick and place assembly, the LEDs are packed in tape and reel. Every reel is shipped in single flux and color bin, to provide close uniformity.  Applications    For lightings and luminaires Channel letter and advertisement board backlighting Office automations, home appliances, industrial equipment − Front panel backlighting − Push button backlighting − Display backlighting − Scanner lighting CAUTION: This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. Broadcom -1- ASMW-LWG0-NxxxE Data Sheet Figure 1 Package Dimensions 0.7 3.5 0.99 2.06 2.8 2.1 (2.33) 0.25 (2.85) ANODE MARK NOTE 1. 2. 3. 4. 5. Dimensions in bracket are for reference only. Tolerance is ±0.20mm unless otherwise specified. Encapsulation = silicone. Terminal finish = silver plating. All dimensions in millimeters (mm). Device Selection Guide (TJ = 25°C, IF = 150mA) Part Number Correlated Color Temperature, CCT (Kelvin) Luminous Flux, ΦV (lm) a, b Typ. Min. Typ. Max. ASMW-LWG0-NDFHE 3000 55 59 70 ASMW-LWG0-NEGFE 4000 60 64 75 ASMW-LWG0-NEGDE 5000 60 64 75 ASMW-LWG0-NEGBE 6500 60 64 75 a. b. Luminous flux, ΦV is the total flux output measured with an integrating sphere at a single current pulse condition. Flux tolerance is ±12%. Broadcom -2- ASMW-LWG0-NxxxE Data Sheet Absolute Maximum Ratings Parameters DC Forward Current a Peak Forward Current b Power Dissipation Reverse Voltage Rating Unit 200 mA 300 mA 760 mW Not designed for reverse bias operation LED Junction Temperature 125 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. b. Derate linearly as shown in Figure 11 and Figure 12. Duty factor = 10%, frequency = 1kHz. Optical and Electrical Characteristics (TJ = 25°C, IF = 150mA) Parameters Min. Typ. Viewing Angle, 2θ½ a − 115 − ° Forward Voltage, VF b 2.8 3.1 3.8 V 80 − − − − 30 − °C/W Color Rendering Index, CRI Thermal Resistance, RθJ-S c a. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. b. Forward voltage, VF tolerance is ±0.1V. c. Thermal resistance from LED junction to solder point. Broadcom -3- Max. Unit ASMW-LWG0-NxxxE Data Sheet Part Numbering System A S M W – L W G 0 – N x1 x2 x3 E Code Description Option x1 Minimum Flux Bin Refer to Flux Bin Limits (CAT) table x2 Maximum Flux Bin x3 Correlated Color Temperature B 6500K D 5000K F 4000K H 3000K Part Number Example ASMW-LWG0-NDFBE x1 : D x2 : F x3 : B − − − Minimum flux bin D Maximum flux bin F 6500K with sub bins 2A, 2B, 2C, 2D Broadcom -4- ASMW-LWG0-NxxxE Data Sheet Bin Information Flux Bin Limits (CAT) Forward Voltage Bin Limits (VF) Luminous Flux, ΦV (lm) Bin ID Min. Max. D 55 60 E 60 Forward Voltage, VF (V) Bin ID Min. Max. VF12 2.8 3.0 65 VF13 3.0 3.2 F 65 70 VF14 3.2 3.4 G 70 75 VF15 3.4 3.6 VF16 3.6 3.8 Tolerance = ±12% Tolerance = ±0.1V Color Bin Limits (BIN) CCT Bin ID 2A 2B 6500K 2C 2D Chromaticity Coordinates x y 0.3048 0.3207 0.3130 0.3290 0.3144 0.3186 0.3068 0.3113 0.3028 0.3304 0.3115 0.3391 0.3130 0.3290 0.3048 0.3207 0.3115 0.3391 0.3205 0.3481 0.3213 0.3373 0.3130 0.3290 0.3130 0.3290 0.3213 0.3373 0.3221 0.3261 0.3144 0.3186 CCT Bin ID 4A 4B 5000K 4C 4D Chromaticity Coordinates x y Broadcom -5- Bin ID Chromaticity Coordinates x y 0.3670 0.3578 0.3702 0.3722 0.3427 0.3825 0.3798 0.3366 0.3369 0.3783 0.3646 0.3376 0.3616 0.3702 0.3722 0.3463 0.3687 0.3736 0.3874 0.3869 0.3958 0.3825 0.3798 0.3371 0.3490 0.3451 0.3554 0.3440 6A 6B 0.3451 0.3554 0.3371 0.3490 0.3463 0.3687 0.3825 0.3798 0.3551 0.3760 0.3869 0.3958 0.3533 0.3620 0.4006 0.4044 0.3451 0.3554 0.3950 0.3875 0.3451 0.3554 0.3783 0.3646 0.3533 0.3620 0.3825 0.3798 0.3515 0.3487 0.3950 0.3875 0.3427 0.3898 0.3716 0.3440 Tolerance = ±0.01 CCT 4000K 6C 6D ASMW-LWG0-NxxxE CCT Data Sheet Bin ID 8A 8B 3000K 8C 8D Chromaticity Coordinates x y 0.4147 0.3814 0.4221 0.3984 0.4342 0.4028 0.4259 0.3853 0.4221 0.3984 0.4299 0.4165 0.4430 0.4212 0.4342 0.4028 0.4342 0.4028 0.4430 0.4212 0.4562 0.4260 0.4465 0.4071 0.4259 0.3853 0.4342 0.4028 0.4465 0.4071 0.4373 0.3893 Tolerance = ±0.01 Example of bin information on reel and packaging label: CAT : D BIN : 2A VF : VF12 − − − Flux bin D Color bin 2A VF bin VF12 y Figure 2 Chromaticity Diagram 0.44 0.43 0.42 0.41 0.40 0.39 0.38 0.37 0.36 0.35 0.34 0.33 0.32 0.31 0.30 6500K 2C 2B 2D 2A 5000K 4C 4B 4D 4A 4000K 6C 6B 6D 6A 3000K 8B 8C 8A 8D 0.29 0.31 0.33 0.35 0.37 0.39 0.41 0.43 0.45 0.47 x Broadcom -6- ASMW-LWG0-NxxxE Data Sheet Figure 3 Spectral Power Distribution Figure 4 Forward Current vs. Forward Voltage 1.0 350 0.9 RELATIVE INTENSITY 0.8 0.7 FORWARD CURRENT - mA 3000K 4000K 6500K 0.6 0.5 0.4 0.3 0.2 200 150 100 0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 0 780 Figure 5 Relative Luminous Intensity vs. Mono Pulse Current 1.6 RELATIVE INTENSITY 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 50 100 150 200 250 MONO PULSE CURRENT - mA 300 1 2 3 FORWARD VOLTAGE - V 4 5 Figure 6 Radiation Pattern 1.8 RELATIVE LUMINOUS FLUX (NORMALIZED AT 150mA) 250 50 0.1 0.0 300 350 Broadcom -7- 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE 60 90 ASMW-LWG0-NxxxE Data Sheet Figure 7 Chromaticity Coordinate Shift vs. Mono Pulse Current 3000K - x 4000K - x 6500K - x 0.005 3000k - y 4000K - y 6500K -y 120 100 RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25°C) CHROMATICITY COORDINATES SHIFT (NORMALIZED AT 150mA) 0.007 Figure 8 Relative Light Output vs. Junction Temperature 0.003 0.001 -0.001 -0.003 -0.005 60 40 20 0 -0.007 0 50 100 150 200 250 MONO PULSE CURRENT - mA 300 -50 350 Figure 9 Forward Voltage Shift vs. Junction Temperature -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 Figure 10 Chromaticity Coordinate Shift vs. Junction Temperature 0.20 0.015 3000K - x 3000K - y 4000K - x 4000K - y 6500K - x 6500K - y CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) 0.15 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) 0.010 0.10 0.005 0.05 0.000 0.00 -0.005 -0.05 -0.010 -0.10 -0.15 80 -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 -0.015 150 Broadcom -8- -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 ASMW-LWG0-NxxxE Data Sheet Figure 11 Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125°C MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 250 200 150 RθJ-A = 70°C/W RθJ-A = 100°C/W RθJ-A = 130°C/W 100 Figure 12 Maximum Forward Current vs. Solder Point Temperature. Derated based on TJMAX = 125°C, RθJ-S = 30°C/W 50 0 250 200 150 100 50 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA - °C 100 110 0 20 40 60 80 SOLDER POINT TEMPERATURE - °C Figure 13 Recommended Soldering Land Pattern 4.50 2.49 1.42 2.10 2.01 COPPER PAD SOLDER MASK NOTE All dimensions are in millimeters (mm). Broadcom -9- MAXIMIZE ANODE COPPER PAD AREA FOR BETTER HEAT DISSIPATION 100 120 ASMW-LWG0-NxxxE Data Sheet Figure 14 Carrier Tape Dimensions E1 P0 P2 T ∅D F W A0 P1 B0 POLARITY MARK USER DIRECTION OF UNREELING F P0 P1 P2 D0 E1 W 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 1.55±0.05 1.75±0.1 8.0±0.2 T B0 K0 A0 0.2±0.05 3.8±0.1 1.05±0.1 3.1±0.1 NOTE All dimensions are in millimeters (mm). Figure 15 Reel Dimensions 9.0 USER FEED DIRECTION NOTE All dimensions are in millimeters (mm). Broadcom - 10 - 178.5 60.0 PRODUCT LABEL ASMW-LWG0-NxxxE Data Sheet Precautionary Notes Handling Precautions Soldering The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.      Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture-sensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: − Soldering iron tip temperature = 315°C max. − Soldering duration = 3sec max. − Number of cycles = 1 only − Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering.     Figure 16 Recommended Lead-Free Reflow Soldering Profile  TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with OD 3.5 mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Handling of Moisture-Sensitive Devices 60 – 120 SEC. 100 SEC. MAX. TIME Figure 17 Recommended Board Reflow Direction This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  REFLOW DIRECTION Broadcom - 11 - Before use: − An unopened moisture barrier bag (MBB) can be stored at