CSMW-LA00-AVX0E

Data Sheet CSMW-Lx00-AxxxE 0.5W 2835 DFN2 Surface Mount LED Overview Features The Broadcom® CSMW-Lx00 surface mount LEDs use AlInGaP chip technology with superior package design to enable them to produce higher light output with better flux performance. They can be driven at high current and are able to dissipate heat more efficiently resulting in better performance with higher reliability.  These LEDs operate under a wide range of environmental conditions, making it ideal for various applications.   To facilitate easy pick and place assembly, the LEDs are packed in tape and reel. Every reel is shipped in single flux and color bin, to provide close uniformity. Applications High reliability package with enhanced silicone resin encapsulation Available in Amber, Red Orange and Red Wide viewing angle at 120° Low package profile and large emitting area for better uniformity in linear lighting Enhanced corrosion resistance Product qualification tests are based on AEC-Q101 guidelines        Specialty and architectural lighting Gaming/ Vending machine backlighting Industrial backlighting e.g. tower light Automotive Exterior Lighting - Brake lights/ CHMSL - Side marker - Truck lighting CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. Broadcom CSMW-Lx00-AxxxE-DS October 30, 2020 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Figure 1: Package Drawing 3.50 (2.95) 2.80 (2.50) 2.10 2.06 0.99 ANODE MARK 0.70 NOTE: 1. 2. 3. 4. 5. All dimensions in millimeters (mm). Tolerance is ±0.20mm unless otherwise specified. Encapsulation = silicone. Terminal finish = silver plating. Dimensions in brackets are for reference only. Device Selection Guide (TJ = 25°C, IF = 150mA) Part Number Color Typ. Max. Typ. Amber 29.0 32.4 38.0 10.5 Red Orange 26.0 30.7 35.0 10.0 23.0 25.0 32.0 8.1 CSMW-LH00-AUW0E CSMW-LR00-ATV0E Red The luminous flux, V is measured at the mechanical axis of the package and it is tested with a single current pulse condition. b. Tolerance is ±12%. c. For reference only. Broadcom Luminous Intensity (cd) c Min. CSMW-LA00-AVX0E a. Luminous Flux, V (lm) a, b CSMW-Lx00-AxxxE-DS 2 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Absolute Maximum Ratings Parameters DC Forward Current a Peak Forward Current b Power Dissipation Reverse Voltage CSMW-Lx00-AxxxE Unit 200 mA 300 mA 580 mW Not designed for reverse bias operation LED Junction Temperature 125 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 10 and Figure 11. b. Duty factor = 10%, frequency = 1kHz. TA =25°C. Optical and Electrical Characteristics (TJ = 25°C, IF = 150mA) Parameters Viewing Angle, 2½ Min. Typ. Max. Unit  120  ° 1.8 2.4 2.9 a Forward Voltage, VF b Amber V Red Orange 1.8 2.3 2.9 Red 1.8 2.1 2.9   10 584.5 590 597.0 Red Orange 611 614 620 Red 620 622 635 Reverse Current, IR at VR = 5V c Dominant Wavelength Amber nm Peak Wavelength nm Amber  592  Red Orange  622  Red  631  Thermal Resistance, RJ-S d  25  a. °C/W ½ is the off-axis angle where the luminous intensity is half of the peak intensity. b. Forward voltage tolerance is ±0.1V. c. Indicates product final test condition. Long term reverse bias is not recommended. d. Thermal resistance from LED junction to solder point. Broadcom A CSMW-Lx00-AxxxE-DS 3 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Part Numbering System C S M W – L x1 0 0 – A x2 x3 Code Description Option x1 Color A x4 x5 Amber H Red Orange R Red x2 Minimum Flux Bin x3 Maximum Flux Bin x4 Color Bins 0 Full Color Distribution x5 Test Option E Test Current = 150mA Refer to Flux Bin Limits (CAT) table Part Number Example CSMW-LA00-AVX0E x1 : A ˗̶ Amber x2 : V ˗̶ Minimum flux bin V x3 : X ˗̶ Maximum flux bin X x4 : 0 ˗̶ Full color distribution x5 : E ˗̶ Test current = 150mA Broadcom CSMW-Lx00-AxxxE-DS 4 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Bin Information Flux Bin Limits (CAT) Color Bin Limits (BIN) Luminous Flux, V (lm) Bin ID Min. Max. T 23 26 U 26 29 V 29 32 W 32 X 35 Amber Bin ID Min. Max. 2 584.5 587.0 35 3 587.0 589.5 38 4 589.5 592.0 5 592.0 594.5 6 594.5 597.0 Tolerance = ±12% Forward Voltage Bin Limits (VF) Red Orange Forward Voltage, VF (V) Bin ID Dominant Wavelength(nm) Min. Max. H11 1.8 1.9 H12 1.9 2.0 H13 2.0 2.1 H14 2.1 2.2 H15 2.2 2.3 H16 2.3 2.4 H17 2.4 2.5 H18 2.5 2.6 G01 2.6 2.7 G02 2.7 2.8 G03 2.8 2.9 Bin ID Dominant Wavelength(nm) Min. Max. 1 611.0 616.0 2 616.0 620.0 Red Bin ID - Dominant Wavelength(nm) Min. Max. 620.0 635.0 Tolerance = ±1.0 nm Tolerance = ±0.1V Example of bin information on reel and packaging label: CAT : W ˗̶ Flux bin W BIN : 2 ˗̶ Color bin 2 VF : H15 ˗̶ VF bin H15 Broadcom CSMW-Lx00-AxxxE-DS 5 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage 350 1.0 AMBER RED ORANGE RED RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 250 200 150 100 50 0.1 0 0.0 380 430 480 530 580 630 WAVELENGTH-nm 680 730 0.0 780 Figure 4: Relative Luminous Flux vs. Mono Pulse Current 1.0 1.5 2.0 2.5 3.0 FORWARD VOLTAGE - V 3.5 4.0 1.0 0.9 1.2 0.8 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX - lm (NORMALIZED AT 150mA) 0.5 Figure 5: Radiation Pattern 1.4 1.0 0.8 0.6 0.4 0.2 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0 50 100 150 200 MONO PULSE CURRENT - mA 250 Figure 6: Dominant Wavelength Shift vs. Mono Pulse Current -90 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREE 90 0.25 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) 1.0 AMBER RED ORANGE RED 0.20 AMBER RED ORANGE RED 1.5 0.5 0.0 -0.5 -1.0 -1.5 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -2.0 0 Broadcom -60 Figure 7: Forward Voltage Shift vs. Junction Temperature 2.0 DOMINANT WAVELENGTH SHIFT - nm (NORMALIZED AT 150mA) AMBER RED ORANGE RED 300 FORWARD CURRENT - mA 0.9 50 100 150 200 MONO PULSE CURRENT - mA 250 -50 -25 0 25 50 75 100 125 150 JUNCTION TEMPERATURE, TJ - °C CSMW-Lx00-AxxxE-DS 6 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Figure 8: Relative Luminous Flux vs. Junction Temperature Figure 9: Dominant Wavelength Shift vs. Junction Temperature 15.0 AMBER RED ORANGE RED 200 100 50 0 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 0.0 -5.0 -10.0 -50 250 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 250 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 5.0 Figure 11: Maximum Forward Current vs. Solder Point Temperature. Derated based on TJMAX = 125°C, RJ-S = 25°C/W Figure 10: Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125°C 200 150 RθJ-A=100°C/W RθJ-A=125°C/W RθJ-A=150°C/W 100 50 0 200 150 100 50 0 0 Broadcom AMBER RED ORANGE RED 10.0 150 -50 DOMINANT WAVELENGTH SHIFT - nm (NORMALIZED AT 25°C) RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25°C) 250 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA - °C 100 110 0 10 20 30 40 50 60 70 80 90 SOLDER POINT TEMPERATURE, TS - °C 100 110 CSMW-Lx00-AxxxE-DS 7 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Figure 12: Recommended Soldering Land Pattern 4.50 2.49 1.42 2.10 2.01 MAXIMIZE ANODE COPPER PAD AREA FOR BETTER HEAT DISSIPATION COPPER PAD SOLDER MASK NOTE: All dimensions are in millimeters (mm). Figure 13: Carrier Tape Dimensions P2 E1 P0 T D0 F W B0 A0 P1 K0 POLARITY MARK USER DIRECTION OF UNREELING F P0 P1 P2 D0 E1 W 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 1.55±0.05 1.75±0.1 8.0±0.2 T B0 K0 A0 0.2±0.05 3.8±0.1 1.05±0.1 3.1±0.1 NOTE: 1. All dimensions in millimeters (mm). Broadcom CSMW-Lx00-AxxxE-DS 8 CSMW-Lx00-AxxxE Data Sheet 0.5W 2835 DFN2 Surface Mount LED Figure 14: Reel Dimensions 9.0 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: All dimensions are in millimeters (mm). Precautionary Notes      Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Broadcom Figure 15: Recommended Lead-Free Reflow Soldering Profile 10 to 30 SEC. TEMPERATURE Soldering 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. TIME CSMW-Lx00-AxxxE-DS 9 CSMW-Lx00-AxxxE Data Sheet Figure 16: Recommended Board Reflow Direction 0.5W 2835 DFN2 Surface Mount LED Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  REFLOW DIRECTION Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.      Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with OD 3.5mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Broadcom   Before use: ─ An unopened moisture barrier bag (MBB) can be stored at