CSMW-LWG0-NRSJE

Data Sheet CSMW-LWG0-NxxxE Mid Power 2835 DFN Surface Mount LED Overview The Broadcom® CSMW-LWG0-NxxxE surface mount LEDs use InGaN chip technology with superior package design to enable them to produce higher light output with better flux performance. They can be driven at high current and are able to dissipate heat more efficiently resulting in better performance with higher reliability. These LEDs operate under a wide range of environmental conditions making ideal for various applications including fluorescent replacement, under cabinet lighting, retail display lighting and panel lights. To facilitate easy pick and place assembly, the LEDs are packed in tape and reel. Every reel is shipped in single flux and color bin, to provide close uniformity. Features      High reliability package with enhanced silicone resin encapsulation Available in 2700K, 3000K, 3500K, 4000K, 4500K, 5000K, 5700K, 6500K and 8000K CCT only Low package profile and large emitting area for better uniformity in linear lighting Enhanced corrosion resistance Product qualification tests are based on AEC-Q101 guidelines Applications     Automotive interior lighting - Compartment light - Cabin light - Reading light Automotive exterior lighting - License plate illumination - Puddle lamp - Reverse light - Side marker light Channel letter and advertisement board backlighting Office automations, home appliances, industrial equipment and indicator lighting CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. Broadcom CSMW-LWG0-NxxxE-DS October 29, 2019 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Figure 1: Package Drawing NOTE: 1. 2. 3. 4. 5. Broadcom All dimensions in millimeters (mm). Tolerance is ±0.20mm unless otherwise specified. Encapsulation = silicone. Terminal finish = silver plating. Dimensions in brackets are for reference only. CSMW-LWG0-NxxxE-DS 2 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Device Selection Guide (TJ = 25°C, IF = 150mA) Correlated Color Temperature, CCT (Kelvin) Part Number Luminous Flux, ΦV (lm) a, b Luminous intensity (mcd) c Typ. Min. Typ. Max. CSMW-LWG0-NSTAE 8000 51.0 55.0 72.0 18.3 CSMW-LWG0-NSTBE 6500 51.0 58.0 72.0 19.3 CSMW-LWG0-NSTCE 5700 51.0 58.0 72.0 19.3 CSMW-LWG0-NSTDE 5000 51.0 59.0 72.0 19.7 CSMW-LWG0-NSTEE 4500 51.0 59.0 72.0 19.7 CSMW-LWG0-NSTFE 4000 51.0 59.0 72.0 19.7 CSMW-LWG0-NRSGE 3500 42.8 53.0 60.5 17.7 CSMW-LWG0-NRSHE 3000 42.8 53.0 60.5 17.7 CSMW-LWG0-NRSJE 2700 42.8 53.0 60.5 17.7 CSMW-LWG0-NSTKE 6500K-8000K 51.0 - 72.0 - CSMW-LWG0-NSTLE 5700K-6500K 51.0 - 72.0 - CSMW-LWG0-NSTME 5000K-5700K 51.0 - 72.0 - CSMW-LWG0-NSTNE 4500K-5000K 51.0 - 72.0 - CSMW-LWG0-NRSQE 3500K-4000K 42.8 - 60.5 - CSMW-LWG0-NRSRE 3000K-3500K 42.8 - 60.5 - CSMW-LWG0-NRSSE 2700K-3000K 42.8 - 60.5 - CSMW-LWG0-NRT0E 4500K-8000K 42.8 - 72.0 - CSMW-LWG0-NRT1E 2700K-4000K 42.8 - 72.0 - a. The luminous flux, ΦV is measured at the mechanical axis of the package and it is tested with a single current pulse condition. b. Tolerance is ±12%. c. For reference only Absolute Maximum Ratings Parameters DC Forward Current CSMW-LWG0-NxxxE a Unit 240 mA Peak Forward Current b 350 mA Power Dissipation 864 mW Reverse Voltage LED Junction Temperature Not designed for reverse bias operation 125 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 14 and Figure 15. b. Duty factor = 10%, frequency = 1kHz. Broadcom CSMW-LWG0-NxxxE-DS 3 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Optical and Electrical Characteristics (TJ = 25°C, IF = 150mA) Parameters Min. Typ. Max. Unit − 120 − ° 2.80 3.22 3.60 V − − 10 μA − 80 − − − 47 − °C/W Viewing Angle, 2θ½ a Forward Voltage, VF b Reverse Current, IR at VR = 5V c Color Rendering Index, CRI Thermal Resistance, RθJ-S a. d θ½ is the off-axis angle where the luminous intensity is half of the peak intensity. b. Forward voltage tolerance is ±0.1V. c. Indicates product final test condition. Long term reverse bias is not recommended. d. Thermal resistance from LED junction to solder point. Performance Characteristics (TJ = 25°C) Forward Current (mA) Relative Luminous Flux (Normalized at 150mA) Luminous Flux, ΦV (lm) Forward Voltage, VF (V) Luminous Efficiency (lm/W) Typ. Typ. Typ. 2700K-3500K 65 0.496 26.3 2.93 138.2 80 0.596 31.6 2.98 132.4 100 0.723 38.3 3.06 125.4 120 0.838 44.4 3.12 118.5 150 1.000 53.0 3.22 109.7 200 1.244 65.9 3.38 97.7 240 1.415 75.0 3.50 89.4 65 0.496 29.3 2.93 153.9 80 0.596 35.2 2.98 147.3 100 0.723 42.7 3.06 139.6 120 0.838 49.5 3.12 131.9 150 1.000 59.0 3.22 122.1 200 1.244 73.4 3.38 108.7 240 1.415 83.5 3.50 99.5 65 0.496 28.8 2.93 151.2 80 0.596 34.6 2.98 144.8 100 0.723 41.9 3.06 137.2 120 0.838 48.6 3.12 129.7 150 1.000 58.0 3.22 120.0 200 1.244 72.2 3.38 106.9 240 1.415 82.1 3.50 97.8 4000K-5000K 5700K-6500K Broadcom CSMW-LWG0-NxxxE-DS 4 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED 8000K 65 0.496 27.3 2.93 143.4 80 0.596 32.8 2.98 137.3 100 0.723 39.8 3.06 130.1 120 0.838 46.1 3.12 123.0 150 1.000 55.0 3.22 113.8 200 1.244 68.4 3.38 101.3 240 1.415 77.8 3.50 92.7 Part Numbering System C S M W – L W G Code Description x1 Minimum Flux Bin x2 Maximum Flux Bin x3 x4 Broadcom 0 – Color Correlated Temperature Test Option N x1 x2 x3 x4 Option Refer to Flux Bin Limits (CAT) table A 8000K B 6500K C 5700K D 5000K E 4500K F 4000K G 3700K H 3000K J 2700K K 6500K-8000K L 5700K-6500K M 5000K-5700K N 4500K-5000K Q 3500K-4000K R 3000K-3500K S 2700K-3000K 0 4500k-8000K 1 2700K-4000K E Test Current = 150mA CSMW-LWG0-NxxxE-DS 5 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Part Number Example CSMW-LWG0-NSTDE x1 : S ˗̶ Minimum flux bin S x2 : T ˗̶ Maximum flux bin T x3 : D ˗̶ CCT 5000K with bin ID 4A, 4B, 4C, 4D x4 : E ˗̶ Test current = 150mA Bin Information Flux Bin Limits (CAT) Luminous Flux, ΦV (lm) Bin ID Min. Max. R 42.8 51.0 S 51.0 60.5 T 60.5 72.0 Tolerance = ±12% Forward Voltage Bin Limits (VF) Forward Voltage, VF (V) Bin ID Min. Max. F05 2.8 3.0 F06 3.0 3.2 F07 3.2 3.4 F08 3.4 3.6 Tolerance = ±0.1V Example of bin information on reel and packaging label: CAT : R ˗̶ Flux bin R BIN : 4A ˗̶ Color bin 4A VF : F06 ˗̶ VF bin F06 Broadcom CSMW-LWG0-NxxxE-DS 6 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Color Bin Limits (BIN) CCT Bin ID 1A 1B 8000K 1C 1D CCT Bin ID 4A 4B 5000K 4C 4D Broadcom Chromaticity Coordinates CCT Bin ID Chromaticity Coordinates CCT Bin ID Chromaticity Coordinates x y x y x y 0.2950 0.2970 0.3048 0.3207 0.3215 0.3350 0.2920 0.3060 0.3130 0.3290 0.3290 0.3417 0.2984 0.3133 0.3144 0.3186 0.3290 0.3300 0.3009 0.3042 0.3068 0.3113 0.3222 0.3243 0.2920 0.3060 0.3028 0.3304 0.3207 0.3462 0.2895 0.3135 0.3115 0.3391 0.3290 0.3538 0.2962 0.3220 0.3130 0.3290 0.3290 0.3417 0.2984 0.3133 0.3048 0.3207 0.3215 0.3350 0.2984 0.3133 0.2962 0.3220 0.3028 0.3304 2A 2B 6500K 2C 0.3115 0.3391 0.3205 0.3481 0.3213 0.3373 3A 3B 5700K 3C 0.3290 0.3538 0.3376 0.3616 0.3371 0.3490 0.3048 0.3207 0.3130 0.3290 0.3290 0.3417 0.2984 0.3133 0.3130 0.3290 0.3290 0.3417 0.3048 0.3207 0.3213 0.3373 0.3371 0.3490 0.3068 0.3113 0.3221 0.3261 0.3366 0.3369 0.3009 0.3042 0.3144 0.3186 0.3290 0.3300 Chromaticity Coordinates 2D CCT Bin ID Chromaticity Coordinates 3D CCT Bin ID Chromaticity Coordinates x y x y 0.3371 0.3451 0.3490 0.3530 0.3597 0.3670 0.3578 0.3554 0.3615 0.3659 0.3702 0.3722 0.3440 0.3427 0.3590 0.3521 0.3825 0.3798 0.3366 0.3369 0.3512 0.3376 0.3616 0.3548 0.3465 0.3783 0.3646 0.3736 0.3702 0.3722 0.3463 0.3687 0.3641 0.3804 0.3736 0.3874 0.3451 0.3554 0.3615 0.3659 0.3371 0.3490 0.3530 0.3597 0.3869 0.3958 0.3825 0.3798 0.3463 0.3687 0.3641 0.3804 0.3825 0.3798 0.3551 0.3760 0.3736 0.3874 0.3533 0.3620 0.3702 0.3722 0.3869 0.3958 0.4006 0.4044 0.3451 0.3554 0.3615 0.3659 0.3950 0.3875 0.3451 0.3554 0.3615 0.3659 0.3783 0.3646 0.3533 0.3620 0.3702 0.3722 0.3825 0.3798 0.3515 0.3487 0.3670 0.3578 0.3950 0.3875 0.3440 0.3427 0.3590 0.3521 0.3898 0.3716 5A 5B 4500K 5C 5D x 6A 6B 4000K 6C 6D y CSMW-LWG0-NxxxE-DS 7 CSMW-LWG0-NxxxE Data Sheet CCT Mid Power 2835 DFN Surface Mount LED Chromaticity Coordinates Bin ID 7A 7B 3500K 7C 7D CCT Chromaticity Coordinates Bin ID CCT Chromaticity Coordinates Bin ID x y x y x y 0.3889 0.3690 0.4147 0.3814 0.4373 0.3893 0.3941 0.3848 0.4221 0.3984 0.4465 0.4071 0.4080 0.3916 0.4342 0.4028 0.4582 0.4099 0.4017 0.3751 0.4259 0.3853 0.4483 0.3919 0.3941 0.3848 0.4221 0.3984 0.4465 0.4071 0.3996 0.4015 0.4299 0.4165 0.4562 0.4260 0.4146 0.4089 0.4430 0.4212 0.4687 0.4289 0.4080 0.3916 0.4342 0.4028 0.4582 0.4099 0.4080 0.3916 0.4146 0.4089 0.4299 0.4165 8A 8B 3000K 8C 0.4342 0.4028 0.4430 0.4212 0.4562 0.4260 9A 9B 2700K 9C 0.4582 0.4099 0.4687 0.4289 0.4813 0.4319 0.4221 0.3984 0.4465 0.4071 0.4700 0.4126 0.4017 0.3751 0.4259 0.3853 0.4483 0.3919 0.4080 0.3916 0.4342 0.4028 0.4582 0.4099 0.4221 0.3984 0.4465 0.4071 0.4700 0.4126 0.4147 0.3814 0.4373 0.3893 0.4593 0.3944 8D 9D Tolerance = ±0.01 Figure 2: Chromaticity Diagram 0.44 2700K 0.43 3000K 0.42 3500K 8C 0.41 0.39 4500K 0.38 5B y 4C 5700K 0.36 0.35 6500K 0.34 8000K 1C 0.32 1B 4D 7D 9A 9D 8A 7A 6D 6A 5D 5A 4A 3B 3D 2C 2B 4B 3C 8D 7B 6C 6B 5C 5000K 0.37 0.31 9C 8B 7C 4000K 0.40 0.33 9B 3A 2D 2A 1D 1A 0.30 0.29 0.28 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 0.49 x Broadcom CSMW-LWG0-NxxxE-DS 8 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Figure 3: Spectral Power Distribution Figure 4: Forward Current vs. Forward Voltage 400 1.0 0.9 RELATIVE INTENSITY FORWARD CURRENT - mA 350 0.8 2700K 0.7 4000K 0.6 6500K 0.5 0.4 0.3 0.2 300 250 200 150 100 50 0.1 0 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 1.6 0.9 1.4 0.8 RELATIVE INTENSITY 1.0 1.2 1.0 0.8 0.6 0.4 3.0 4.0 5.0 0.7 0.6 0.5 0.4 0.3 0.2 0.2 0.1 0.0 0.0 0 40 80 120 160 MONO PULSE CURRENT - mA 200 240 Figure 7: Chromaticity Coordinate Shift vs. Mono Pulse Current – 2700K -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREE 90 Figure 8: Chromaticity Coordinate Shift vs. Mono Pulse Current – 4000K 0.010 CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 150mA) 0.010 CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 150mA) 2.0 Figure 6: Radiation Pattern 1.8 0.008 0.006 0.004 0.002 0.000 -0.002 Cx Cy -0.004 -0.006 -0.008 -0.010 0.008 0.006 0.004 0.002 0.000 Cx -0.002 Cy -0.004 -0.006 -0.008 -0.010 0 Broadcom 1.0 FORWARD VOLTAGE - V Figure 5: Relative Luminous Flux vs. Mono Pulse Current RELATIVE LUMINOUS FLUX - lm (NORMALIZED AT 150mA) 0.0 780 40 80 120 160 MONO PULSE CURRENT - mA 200 240 0 40 80 120 160 MONO PULSE CURRENT - mA 200 240 CSMW-LWG0-NxxxE-DS 9 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Figure 10: Forward Voltage Shift vs. Junction Temperature 0.010 0.25 0.008 0.20 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 150mA) Figure 9: Chromaticity Coordinate Shift vs. Mono Pulse Current – 6500K 0.006 0.004 0.002 0.000 -0.002 Cx Cy -0.004 0.05 0.00 -0.10 -0.008 -0.15 0 40 80 120 160 MONO PULSE CURRENT - mA 200 CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) Cx -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 Figure 12: Chromaticity Coordinate Shift vs. Junction Temperature – 4000K 0.010 0.005 -50 240 Figure 11: Chromaticity Coordinate Shift vs. Junction Temperature – 2700K CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) 0.10 -0.05 -0.006 -0.010 Cy 0.000 0.010 0.005 Cx Cy 0.000 -0.005 -0.005 -0.010 -0.010 -0.015 -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 Figure 13: Chromaticity Coordinate Shift vs. Junction Temperature – 6500K -50 0.010 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 300 Cx 0.005 Cy 0.000 -0.005 -0.010 -0.015 -50 Broadcom -25 Figure 14: Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125°C MAX ALLOWABLE DC CURRENT - mA CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) 0.15 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 150 250 200 150 RθJ-A = 56°C/W RθJ-A = 76°C/W RθJ-A = 96°C/W 100 50 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA - °C 100 110 CSMW-LWG0-NxxxE-DS 10 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Figure 15: Maximum Forward Current vs. Solder Point Temperature. Derated based on TJMAX = 125°C, RθJ-S = 47°C/W Figure 16: Pulse Handling Capability at TS ≤ 80°C 0.36 0.34 250 IP - PULSE CURRENT - A MAX ALLOWABLE DC CURRENT - mA 300 200 150 100 50 D= 0.05 0.10 0.25 0.50 1.00 0.32 0.30 0.28 0.26 0.24 0.22 0 0 20 40 60 80 SOLDER POINT TEMPERATURE, TS - °C 100 120 0.20 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 tp - PULSE DURATION - sec 1.E+01 Figure 17: Pulse Handling Capability at TS = 100°C 0.36 0.34 IP - PULSE CURRENT - A 0.32 0.30 D= 0.05 0.10 0.25 0.50 1.00 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 1.E-04 Broadcom 1.E-03 1.E-02 1.E-01 1.E+00 tp - PULSE DURATION - sec 1.E+01 CSMW-LWG0-NxxxE-DS 11 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Figure 18: Recommended Soldering Land Pattern 4.50 2.49 1.42 2.10 2.01 MAXIMIZE ANODE COPPER PAD AREA FOR BETTER HEAT DISSIPATION COPPER PAD SOLDER MASK NOTE: All dimensions are in millimeters (mm). Figure 19: Carrier Tape Dimensions P2 E1 P0 T ∅D0 F W B0 A0 P1 K0 POLARITY MARK USER DIRECTION OF UNREELING F P0 P1 P2 D0 E1 W 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 1.55±0.05 1.75±0.1 8.0±0.2 T B0 K0 A0 0.2±0.05 3.8±0.1 1.05±0.1 3.1±0.1 NOTE: 1. All dimensions in millimeters (mm). Broadcom CSMW-LWG0-NxxxE-DS 12 CSMW-LWG0-NxxxE Data Sheet Mid Power 2835 DFN Surface Mount LED Figure 20: Reel Dimensions 9.0 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: All dimensions are in millimeters (mm). Precautionary Notes      Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Broadcom Figure 21: Recommended Lead-Free Reflow Soldering Profile 10 to 30 SEC. TEMPERATURE Soldering 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. TIME CSMW-LWG0-NxxxE-DS 13 CSMW-LWG0-NxxxE Data Sheet Figure 22: Recommended Board Reflow Direction Mid Power 2835 DFN Surface Mount LED Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  REFLOW DIRECTION Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.      Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with OD 3.5mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Broadcom   Before use: ─ An unopened moisture barrier bag (MBB) can be stored at