HCPL-261A, HCPL-061A, HCPL-263A, HCPL-063A
HCPL-261N, HCPL-061N, HCPL-263N, HCPL-063N
HCMOS Compatible, High CMR, 10 MBd Optocouplers
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Features
The HCPL-261A family of optically coupled gates shown
on this data sheet provide all the benefits of the industry standard 6N137 family with the added benefit
of HCMOS compatible input current. This allows direct
interface to all common circuit topologies without additional LED buffer or drive components. The AlGaAs
LED used allows lower drive currents and reduces
degradation by using the latest LED technology. On
the single channel parts, an enable output allows the detector to be strobed. The output of the detector IC is an
open collector schottky-clamped transistor. The internal
shield provides a minimum common mode transient immunity of 1000 V/µs for the HCPL-261A family and 15000
V/µs for the HCPL-261N family.
• HCMOS/LSTTL/TTL performance compatible
Functional Diagram
HCPL-261A/261N
HCPL-061A/061N
• Available in 8 pin DIP, SOIC-8 packages
• Safety approval:
– UL recognized per UL1577 3750 V rms for 1 minute
and 5000 V rms for 1 minute (Option 020)
– CSA Approved
– IEC/EN/DIN EN 60747-5-2 approved
1
8
VCC
• Low input current (3.0 mA) HCMOS compatible
version of 6N137 optocoupler
VE
CATHODE 1
2
7
VO1
• Isolated line receiver
6
VO
CATHODE 2
3
6
VO2
• Simplex/multiplex data transmission
5
GND
ANODE 2
4
5
GND
• Computer-peripheral interface
8
VCC
ANODE
2
7
CATHODE
3
NC
4
TRUTH TABLE
(POSITIVE LOGIC)
ENABLE
H
H
L
L
NC
NC
• AC and DC performance specified over industrial
temperature range -40°C to +85°C
ANODE 1
1
LED
ON
OFF
ON
OFF
ON
OFF
• High speed: 10 MBd typical
Applications
HCPL-263A/263N
HCPL-063A/063N
NC
SHIELD
• 1000 V/µs minimum Common Mode Rejection (CMR)
at VCM = 50 V (HCPL-261A family) and 15 kV/µs
minimum CMR at VCM = 1000 V (HCPL-261N family)
OUTPUT
L
H
H
H
L
H
SHIELD
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
• Digital isolation for A/D, D/A conversion
• Switching power supplies
• Instrumentation input/output isolation
• Ground loop elimination
• Pulse transformer replacement
The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is
required.
HCPL-261A Functional Diagram
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
Input
Minimum CMR
8-Pin DIP (300 Mil)
Small-Outline SO-8 (400 Mil)
Widebody
Hermetic
dV/dt
VCM
(V/µs)
(V)
Single
Channel
Package
NA
NA
On-
Current
Output
(mA)
Enable
5
Single
Channel
Package
YES
6N137[1]
NO
YES
5,000
50
NO
YES
1,000
HCPL-2611[1]
NO
1,000
50
YES
HCPL-2602[1]
3,500
300
YES
HCPL-2612[1]
1,000
50
YES
HCPL-261A
NO
1,000
YES
[2]
1,000
HCNW137[1]
HCNW2601[1]
HCPL-0631[1]
HCPL-0611[1]
HCNW2611[1]
HCPL-0661[1]
HCPL-061A
HCPL-263A
NO
Single and
Dual Channel
Packages
HCPL-0630[1]
HCPL-0601[1]
HCPL-4661[1]
HCPL-261N
Dual
Channel
Package
HCPL-0600[1]
HCPL-2631[1]
3
Single
Channel
Package
HCPL-2630[1]
HCPL-2601[1]
10,000
Dual
Channel
Package
HCPL-063A
HCPL-061N
HCPL-263N
HCPL-063N
1,000
50
12.5
[3]
HCPL-193X[1]
HCPL-56XX[1]
HCPL-66XX[1]
Notes:
1. Technical data are on separate Avago publications.
2. 15 kV/µs with VCM = 1 kV can be achieved using Avago application circuit.
3. Enable is available for single channel products only, except for HCPL-193X devices.
Schematic
IF
HCPL-261A/261N
HCPL-061A/061N
HCPL-263A/263N
HCPL-063A/063N
ICC
8
2+
IO
6
VF
VCC
VO
1
ICC
8
IF1
IO1
+
7
VF1
VCC
VO1
–
2
–
3
SHIELD
IE
7
VE
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 16).
5
SHIELD
GND
3
IF2
IO2
–
6
VF2
VO2
+
4
SHIELD
HCPL-261A Schematic a
HCPL-261A Schematic b
5
GND
Ordering Information
HCPL-xxxx is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Part number
HCPL-261A
HCPL-261N
HCPL-263A
HCPL-263N
HCPL-061A
HCPL-061N
HCPL-063A
HCPL-063N
Option
RoHS
Non RoHS
Compliant
Compliant
-000E
-300E
-500E
-020E
-320E
-520E
-060E
-560E
-000E
-300E
-500E
-020E
-320E
-520E
-060E
-360E
-560E
-000E
-300E
-500E
-020E
-320E
-520E
-000E
-300E
-500E
-020E
-320E
-520E
-000E
-500E
-060E
-560E
-000E
-500E
No option
#300
#500
#020
-320
-520
#060
#560
No option
#300
#500
#020
#320
-520
#060
#360
No option
#300
#500
#020
#320
-520
No option
#300
#500
#020
#320
#520
No option
#500
#060
#560
No option
#500
Package
300mil
DIP-8
300mil
DIP-8
300mil
DIP-8
300mil
DIP-8
SO-8
SO-8
Surface
Mount
Gull
Wing
Tape
& Reel
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
UL 5000
Vrms/1
Minute rating
IEC/EN/DIN EN
60747-5-2
Quantity
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
100 per tube
1500 per reel
100 per tube
1500 per reel
100 per tube
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry. Combination of Option 020 and Option 060 is not available.
Example 1:
HCPL-261A-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packaging
with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.
Example 2:
HCPL-263N to order product of 300mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and
RoHS compliant option will use ‘-XXXE‘.
HCPL-261A/261N/263A/263N Outline Drawing
Pin Location (for reference only)
9.40 (0.370)
9.90 (0.390)
TYPE NUMBER
8
7
6
5
OPTION CODE*
A XXXXZ
DATE CODE
YYWW
PIN ONE
1
2
3
0.20 (0.008)
0.33 (0.013)
6.10 (0.240)
6.60 (0.260)
7.36 (0.290)
7.88 (0.310)
5 TYP.
4
1.78 (0.070) MAX.
1.19 (0.047) MAX.
DIMENSIONS IN MILLIMETERS AND (INCHES).
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.76 (0.030)
1.40 (0.056)
* MARKING CODE LETTER FOR OPTION NUMBERS.
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.65 (0.025) MAX.
2.28 (0.090)
2.80 (0.110)
Figure 1. 8-Pin dual in-line package device outline drawing.
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
1.02 (0.040)
5
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
10.9 (0.430)
4
1.27 (0.050)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
0.20 (0.008)
0.33 (0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
2.540
(0.100)
BSC
0.635 ± 0.130
(0.025 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01
xx.xxx = 0.005
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Figure 2. Gull wing surface mount option #300.
2.0 (0.080)
12 NOM.
HCPL-061A/061N/063A/063N Outline Drawing
LAND PATTERN RECOMMENDATION
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
1
2
3
4
1.9 (0.075)
0.406 ± 0.076
(0.016 ± 0.003)
1.270 BSC
(0.050)
0.64 (0.025)
7
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
0.432
(0.017)
45 X
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.305 MIN.
(0.012)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
Figure 3. 8-Pin Small Outline Package Device Drawing.
Solder Reflow Thermal Profile
TEMPERATURE (°C)
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
200
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
2.5 C ± 0.5°C/SEC.
30
SEC.
160°C
150°C
140°C
PEAK
TEMP.
230°C
UL
Recognized under UL 1577, Component Recognition Program, File
E55361.
SOLDERING
TIME
200°C
30
SEC.
3°C + 1°C/–0.5°C
100
Regulatory Information
The HCPL-261A and HCPL-261N
families have been approved by the
following organizations:
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
tp
TEMPERATURE
Tp
TL
Tsmax
260 +0/-5 °C
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
217 °C
RAMP-UP
3 C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
Tsmin
ts
PREHEAT
60 to 180 SEC.
25
tL
60 to 150 SEC.
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
Note: Non-halide flux should be used.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
Insulation and Safety Related Specifications
Parameter
Symbol
8-Pin DIP
(300 Mil)
Value
SO-8
Value
Units
Conditions
Minimum External Air
L(101)
7.1
4.9
mm
Gap (External
Clearance)
Measured from input terminals to
output terminals, shortest distance
through air.
Minimum External
L(102)
7.4
4.8
mm
Tracking (External
Creepage)
Measured from input terminals to
output terminals, shortest distance
path along body.
Minimum Internal Plastic
0.08
0.08
mm
Gap (Internal Clearance)
Through insulation distance, conductor
to conductor, usually the direct
distance between the photoemitter and
photodetector inside the optocoupler
cavity.
Tracking Resistance
(Comparative Tracking
Index)
DIN IEC 112/ VDE 0303 Part 1
CTI
200
200
Volts
Isolation Group
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
Description
Symbol
PDIP Option 060
SO-8 Option 60
Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V rms
for rated mains voltage ≤ 300 V rms
I-IV
for rated mains voltage ≤ 600 V rms
I-III
I-IV
I-III
I-II
Climatic Classification
55/85/21
55/85/21
Pollution Degree (DIN VDE 0110/1.89)
2
2
Maximum Working Insulation Voltage
VIORM
630
566
Vpeak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test
with tm = 1 sec, Partial Discharge < 5 pC
VPR
1181
1063
Vpeak
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and Sample Test,
tm = 60 sec, Partial Discharge < 5 pC
VPR
945
849
Vpeak
VIOTM
6000
4000
Vpeak
Safety Limiting Values
(See below for Thermal Derating Curve Figures)
Case Temperature
Input Current
Output Power
TS
IS,INPUT
PS,OUTPUT
175
230
600
150
150
600
˚C
mA
mW
Insulation Resistance at TS, VIO = 500 V
RS
≥ 109
≥ 109
Ω
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units Note
Storage Temperature
TS
-55
125
°C
Operating Temperature
TA
-40
+85
°C
Average Input Current
IF(AVG)
10
mA
Reverse Input Voltage
VR
3
Volts
Supply Voltage
VCC
-0.5
7
Volts
Enable Input Voltage
VE
-0.5
5.5
Volts
Output Collector Current (Each Channel)
IO
50
mA
Output Power Dissipation (Each Channel)
PO
60
mW
VO
7
Volts
Output Voltage (Each channel)
Lead Solder Temperature
(Through Hole Parts Only)
Solder Reflow Temperature Profile
(Surface Mount Parts Only)
Recommended Operating Conditions
Parameter
Symbol
-0.5
1
2
3
260°C for 10 s, 1.6 mm Below Seating Plane
See Package Outline Drawings section
Min.
Max.
Units
Input Voltage, Low Level
VFL
-3
0.8
V
Input Current, High Level
IFH
3.0
10
mA
Power Supply Voltage
VCC
4.5
5.5
Volts
High Level Enable Voltage
VEH
2.0
VCC
Volts
Low Level Enable Voltage
VEL
0
0.8
Volts
Fan Out (at RL = 1 kΩ)
N
5
TTL Loads
Output Pull-up Resistor
RL
330
4k
Ω
Operating Temperature
TA
-40
85
°C
Electrical Specifications
Over recommended operating temperature (TA = - 40°C to +85°C) unless otherwise specified.
Parameter
Symbol
Min.
Typ.*
Max.
Units Test Conditions
High Level Output
Current
IOH
3.1
100
µA
VCC = 5.5 V, VO = 5.5 V,
VF = 0.8 V, VE = 2.0 V
Low Level Output
VOL
0.4
0.6
V
Voltage
VCC = 5.5 V, IOL = 13 mA
(sinking), IF = 3.0 mA,
VE = 2.0 V
High Level Supply
VE = 0.5 V**
ICCH
7
10
mA
Current
9
15
Dual Channel
Products***
Low Level Supply
ICCL
8
13
mA
Current
12
21
VE = 0.5 V**
IEH
-0.6
-1.6
mA
VCC = 5.5 V, VE = 2.0 V
Low Level Enable
Current**
IEL
-0.9
-1.6
mA
VCC = 5.5 V, VE = 0.5 V
Input Forward
Voltage
VF
1.3
1.6
V
Temperature Co-
efficient of Forward
Voltage
1.0
∆VF /∆TA
-1.25
IF = 4 mA
18
5, 8
4, 18
4
6
4
mV/°C IF = 4 mA
4
4
BVR
3
5
V
IR = 100 µA
Input Capacitance
CIN
60
pF
f = 1 MHz, VF = 0 V
4
VCC = 5.5 V
IF = 3.0 mA
Input Reverse
Breakdown Voltage
*All typical values at TA = 25°C, VCC = 5 V
**Single Channel Products only (HCPL-261A/261N/061A/061N)
***Dual Channel Products only (HCPL-263A/263N/063A/063N)
Note
VCC = 5.5 V
IF = 0 mA
Dual Channel
Products***
High Level Enable
Current**
Fig.
Switching Specifications
Over recommended operating temperature (TA = -40°C to +85°C) unless otherwise specified.
Parameter
Symbol
Min.
Typ.* Max. Units Test Conditions
Fig.
Note
7, 10
18
Propagation Delay
tPLH
52
100
ns
Time to High Output
Level
IF = 3.5 mA
VCC = 5.0 V,
VE = Open,
ns CL = 15 pF,
RL = 350 Ω
9, 11,
12
4, 9,
18
Propagation Delay
tPHL
53
100
Time to Low Output
Level
9, 11,
12
4, 10,
18
Pulse Width Distortion
45
ns
9, 13
17, 18
60
ns
24
11, 18
Input Current Threshold
ITHL
1.5
3.0
mA
High to Low
PWD
|tPHL - tPLH|
11
VCC = 5.5 V, VO = 0.6 V,
IO >13 mA (Sinking)
Propagation Delay Skew
tPSK
Output Rise Time
tR
42
ns
9, 14
4, 18
Output Fall Time
tF
12
ns
9, 14
4, 18
15,
16
12
15,
16
12
Propagation Delay
tEHL
19
ns
Time of Enable
from VEH to VEL
IF = 3.5 mA
VCC = 5.0 V,
VEL = 0 V, VEH = 3 V,
CL = 15 pF,
Propagation Delay
tELH
30
ns
Time of Enable RL = 350 Ω
from VEL to VEH
*All typical values at TA = 25°C, VCC = 5 V.
Common Mode Transient Immunity Specifications, All values at TA = 25°C
Parameter
Device
Symbol Min. Typ. Max. Units
Output High
Level Common
Mode Transient
Immunity
Test Conditions
HCPL-261A
|CMH|
1
5
kV/µs VCM = 50 V
HCPL-061A
HCPL-263A
HCPL-063A
4, 13,
15, 18
HCPL-263N
15
25
kV/µs
HCPL-063N
Using Avago
20
App Circuit
4, 13,
15
HCPL-261A
|CML|
1
5
kV/µs VCM = 50 V
HCPL-061A
HCPL-263A
HCPL-063A
VCC = 5.0 V,
17
RL = 350 Ω,
IF = 3.5 mA,
VO(MAX) = 0.8 V
TA = 25°C
4, 14,
15, 18
Using Avago
20
App Circuit
4, 14,
15
HCPL-261N
HCPL-061N
HCPL-263N
15
25
kV/µs
HCPL-063N
5
kV/µs VCM = 1000 V
VCC = 5.0 V,
17
RL = 350 Ω,
IF = 0 mA,
TA = 25°C
VO(MIN) = 2 V
HCPL-261N
HCPL-061N
1
5
Note
Output Low
Level Common
Mode Transient
Immunity
1
Fig.
kV/µs VCM = 1000 V
Package Characteristics
All Typicals at TA = 25°C
Parameter
Sym.
Package*
Min.
Typ.
Max.
Units
Test Conditions
Fig.
Note
Input-Output
VISO
3750
V rms
Momentary With-
OPT 020† 5000
stand Voltage**
RH ≤ 50%,
t = 1 min.,
TA = 25°C
5, 7
Input-Output
Resistance
Ω
VI-O = 500 Vdc
4, 8
Input-Output
CI-O
0.6
pF
Capacitance
f = 1 MHz,
TA = 25°C
4, 8
Input-Input
II-I
Dual Channel
0.005
µA
Insulation
Leakage Current
RH ≤ 45%,
t = 5 s,
VI-I = 500 V
19
Resistance
(Input-Input)
RI-O
10
12
5, 6
RI-I
Dual Channel
1011
Ω
19
Capacitance
CI-I
(Input-Input)
Dual 8-pin DIP
0.03
pF
19
Dual SO-8
f = 1 MHz
0.25
*Ratings apply to all devices except otherwise noted in the Package column.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”
†For 8-pin DIP package devices (HCPL-261A/261N/263A/263N) only.
Notes:
1. Peaking circuits may be used which produce transient input currents up to 30 mA, 50 ns maximum pulse width, provided the average current
does not exceed 10 mA.
2. 1 minute maximum.
3. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package.
4. Each channel.
5. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
6. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 VRMS for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in the
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table, if applicable.
7. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 VRMS for 1 second (leakage detection current limit, II-O ≤ 5 µA).
8. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together.
9. The tPLH propagation delay is measured from the 1.75 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of
the output pulse.
10. The tPHL propagation delay is measured from the 1.75 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of
the output pulse.
11. Propagation delay skew (tPSK) is equal to the worst case difference in tPLH and/or tPHL that will be seen between any two units under the same
test conditions and operating temperature.
12. Single channel products only (HCPL-261A/261N/061A/061N).
13. Common mode transient immunity in a Logic High level is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that
the output will remain in a Logic High state (i.e., Vo > 2.0 V).
14. Common mode transient immunity in a Logic Low level is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that
the output will remain in a Logic Low state (i.e., VO < 0.8 V).
15. For sinusoidal voltages
(|dVCM /dt|)max = πfCM VCM(P-P).
16. Bypassing of the power supply line is required with a 0.1 µF ceramic disc capacitor adjacent to each optocoupler as shown in Figure 19. Total
lead length between both ends of the capacitor and the isolator pins should not exceed 10 mm.
17. Pulse Width Distortion (PWD) is defined as the difference between tPLH and tPHL for any given device.
18. No external pull up is required for a high logic state on the enable input of a single channel product. If the VE pin is not used, tying VE to VCC
will result in improved CMR performance.
19. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel parts only.
10
VCC = 5.5 V
VO = 5.5 V
VE = 2 V
VF = 0.8 V
10
5
0
-60 -40 -20
0
20
40
60
80 100
TA – TEMPERATURE – C
VOL – LOW LEVEL OUTPUT VOLTAGE – V
VO – OUTPUT VOLTAGE – V
RL = 350 Ω
RL = 1 kΩ
RL = 4 kW
1.0
0
0.5
1.0
1.5
40
20
0
-60 -40 -20
2.0
80 100
TA = 40 C
TA = 25 C
0.1
0.01
1.0
1.1
1.2
IF
+
VF
–
1.3
1.4
1.5
VF – FORWARD VOLTAGE – V
Figure 6. Typical diode input forward current
characteristic.
HCPL-261A fig 6
VCC = 5.5 V
VE = 2 V
IF = 3.0 mA
0.5
IO = 16 mA
IO = 12.8 mA
0.4
0.3
IO = 9.6 mA
IO = 6.4 mA
0.2
-60 -40 -20 0 20 40
HCPL-261A/261N
60
80 100
+5 V
1
VCC 8
2
7
3
6
4
5
0.1 µF
BYPASS
RL
*CL
RM
60
TA = 85 C
1.0
Figure 8. Typical low level output voltage vs.
temperature.
HCPL-261A fig 8
HCPL-261A fig 7
INPUT
MONITORING
NODE
40
10.0
TA – TEMPERATURE – C
Figure 7. Typical output voltage vs. forward
input current.
IF
20
0.6
IF – FORWARD INPUT CURRENT – mA
PULSE GEN.
Z O = 50 Ω
t f = t r = 5 ns
0
HCPL-261A fig 5
2.0
0
60
Figure 5. Low level output current vs. temperature.
5.0
3.0
VCC = 5 V
VE = 2 V
VOL = 0.6 V
IF = 3.5 mA
TA – TEMPERATURE – C
Figure 4. Typical high level output current vs.
temperature.
HCPL-261A fig 4
4.0
100.0
80
IF – INPUT FORWARD CURRENT – mA
IOL – LOW LEVEL OUTPUT CURRENT – mA
IOH – HIGH LEVEL OUTPUT CURRENT – µA
15
GND
OUTPUT VO
MONITORING
NODE
*CL IS APPROXIMATELY 15 pF WHICH INCLUDES
PROBE AND STRAY WIRING CAPACITANCE.
I F = 3.5 mA
INPUT
IF
90%
I F = 1.75 mA
t PHL
1.5 V
trise
tfall
Figure 9. Test circuit for tPHL and tPLH.
11
HCPL-261A fig 9
VOH
10%
10%
t PLH
OUTPUT
VO
90%
HCPL-261A fig 9b (new)
VOL
1.0
0.5
RL = 350 Ω
RL = 1 kΩ
RL = 4 kΩ
VCC = 5 V
VO = 0.6 V
0
-60 -40 -20
0
20
40
60
80 100
20
30
20
RL = 1 kΩ
RL = 350 Ω
0
-60 -40 -20
0
20
40
60
80 100
TA – TEMPERATURE – C
Figure 13. Typical pulse width distortion vs.
temperature.
HCPL-261A fig 13
TPLH
RL = 350 kΩ
0
VCC = 5 V
IF = 3.5 mA
20
40
60
80 100
HCPL-261A fig 11
tr, tf – RISE, FALL TIME – ns
VCC = 5 V
IF = 3.5 mA
40
TPHL
RL = 350 Ω, 1 kΩ, 4 kΩ
40
160
RL = 4 kΩ
50
TPLH
RL = 1 kΩ
Figure 11. Typical propagation delay vs. temperature.
60
PWD – ns
60
TA – TEMPERATURE – C
Figure 10. Typical input threshold current vs.
temperature. HCPL-261A fig 10
12
80
0
-60 -40 -20
TA – TEMPERATURE – C
10
100
120
TPLH
RL = 4 kΩ
140
VCC = 5 V
IF = 3.5 mA
trise
tfall
RL = 4 kΩ
120
60
RL = 1 kΩ
40
RL = 350 Ω
20
0
-60 -40 -20
RL = 350 Ω, 1 kΩ, 4 kΩ
0 20 40 60 80 100
TA – TEMPERATURE – C
Figure 14. Typical rise and fall time vs. temperature.
HCPL-261A fig 14
tp – PROPAGATION DELAY – ns
1.5
120
tp – PROPAGATION DELAY – ns
ITH – INPUT THRESHOLD CURRENT – mA
2.0
100
TPLH
RL = 4 kΩ
80
TPLH
RL = 1 kΩ
60
TPLH
RL = 350 Ω
TPHL
RL = 350 Ω, 1 kΩ, 4 kΩ
40
20
0
VCC = 5 V
TA = 25 C
0
2
4
6
8
10
12
IF – PULSE INPUT CURRENT – mA
Figure 12. Typical propagation delay vs. pulse
input current.
HCPL-261A fig 12
PULSE GEN.
Z O = 50 Ω
t f = t r = 5 ns
INPUT VE
MONITORING NODE
HCPL-261A/261N
VCC 8
2
7
3
6
0.1 µF
BYPASS
RL
OUTPUT VO
MONITORING
NODE
*C L
4
5
GND
*CL IS APPROXIMATELY 15 pF WHICH INCLUDES
PROBE AND STRAY WIRING CAPACITANCE.
3.0 V
INPUT
VE
1.5 V
t EHL
t ELH
OUTPUT
VO
1.5 V
tE – ENABLE PROPAGATION DELAY – ns
3.5 mA
IF
+5 V
1
120
90
VCC = 5 V
VEH = 3 V
VEL = 0 V
IF = 3.5 mA
tELH, RL = 4 kΩ
60
tELH, RL = 1 kΩ
30
tELH, RL = 350 Ω
tEHL, RL = 350 Ω, 1k Ω, 4 kΩ
0
-60 -40 -20 0 20 40 60 80 100
TA – TEMPERATURE – C
Figure 15. Test circuit for tEHL and tELH.
Figure 16. Typical enable propagation delay vs. temperature.
HCPL-261A/-261N/-061A/-061N
Only.
HCPL-261A fig
16
HCPL-261A fig 15
HCPL-261A/261N
IF
A
B
VFF
VCC 8
2
7
3
6
VCM
VO
+
350 Ω
OUTPUT VO
MONITORING
NODE
_
VCM (PEAK)
0V
5V
SWITCH AT A: IF = 0 mA
SWITCH AT B: IF = 3.5 mA
VO
0.1 µF
BYPASS
GND 5
4
PULSE GEN.
Z O = 50 Ω
+5 V
CM H
VO (min.)
VO (max.)
0.5 V
CM L
OUTPUT POWER – PS, INPUT CURRENT – IS
V CM
1
800
HCPL-261A/261N OPTION 060 ONLY
PS (mW)
700
IS (mA)
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
TS – CASE TEMPERATURE – C
Figure 17. Test circuit for common mode transient immunity and typical waveforms.
HCPL-261A Fig 17
13
Figure 18. Thermal derating curve, dependence of safety limiting
value with case temperature per IEC/EN/DIN EN 60747-5-2.
HCPL-261A fig 18
Application Information
SINGLE CHANNEL PRODUCTS
GND BUS (BACK)
Common-Mode Rejection for HCPL261A/HCPL-261N Families:
VCC BUS (FRONT)
Figure 20 shows the recommended
drive circuit for the HCPL-261N/261A for optimal common-mode
rejection performance. Two main
points to note are:
N.C.
ENABLE
(IF USED)
0.1µF
OUTPUT 1
N.C.
1. The enable pin is tied to VCC rather
than floating (this applies to
single-channel parts only).
N.C.
ENABLE
(IF USED)
0.1µF
N.C.
2. Two LED-current setting resistors
are used instead of one. This is
to balance ILED variation during
common-mode transients.
OUTPUT 2
If the enable pin is left floating, it is
possible for common-mode transients to couple to the enable pin,
resulting in common-mode failure.
This failure mechanism only occurs
when the LED is on and the output
is in the Low State. It is identified as
occurring when the transient output
voltage rises above 0.8 V. Therefore,
the enable pin should be connected
to either VCC or logic-level high for
best common-mode performance
with the output low (CMRL). This
failure mechanism is only present
in single-channel parts (HCPL-261N,
-261A, ‑061N, -061A) which have the
enable function.
10 mm MAX. (SEE NOTE 16)
DUAL CHANNEL PRODUCTS
GND BUS (BACK)
VCC BUS (FRONT)
OUTPUT 1
0.1µF
OUTPUT 2
10 mm MAX. (SEE NOTE 16)
Figure 19. Recommended printed circuit board layout.
*
VCC
357 Ω
(MAX.)
357 Ω
(MAX.)
74LS04
OR ANY TOTEM-POLE
OUTPUT LOGIC GATE
HCPL-261A/261N
1
8
2
7
3
6
VO
5
GND
4
*
SHIELD
GND1
VCC+
0.01 µF
350 Ω
GND2
* HIGHER CMR MAY BE OBTAINABLE BY CONNECTING PINS 1, 4 TO INPUT GROUND (GND1).
*Higher CMR may be obtainable by connecting pins 1, 4 to input ground (Gnd1).
Figure 20. Recommended drive circuit for HCPL-261A/-261N families for high-CMR (similar for HCPL263A/-263N).
HCPL-261A fig 19
14
Also, common-mode transients can
capacitively couple from the LED anode (or cathode) to the output-side
ground causing current to be shunted away from the LED (which can be
bad if the LED is on) or conversely
cause current to be injected into the
LED (bad if the LED is meant to be
off ). Figure 21 shows the parasitic
capacitances which exists between
LED anode/cathode and output
ground (CLA and CLC). Also shown in
Figure 21 on the input side is an ACequivalent circuit.
CMR with Other Drive Circuits
Table 1 indicates the directions of ILP and ILN flow depending on the direction of the common-mode transient.
CMR performance with drive circuits other than that
shown in Figure 20 may be enhanced by following these
guidelines:
For transients occurring when the LED is on, commonmode rejection (CMRL, since the output is in the “low”
state) depends upon the amount of LED current drive (IF).
For conditions where IF is close to the switching threshold (ITH), CMRL also depends on the extent which ILP and ILN
balance each other. In other words, any condition where
common-mode transients cause a momentary decrease
in IF (i.e. when dVCM /dt>0 and |IFP| > |IFN|, referring to Table
1) will cause common-mode failure for transients which
are fast enough.
1. Use of drive circuits where current is shunted from
the LED in the LED “off” state (as shown in Figures 22
and 23). This is beneficial for good CMRH.
2. Use of IFH > 3.5 mA. This is good for high CMRL.
Using any one of the drive circuits in Figures 22-24 with
IF = 10 mA will result in a typical CMR of 8 kV/µs for the
HCPL-261N family, as long as the PC board layout practices are followed. Figure 22 shows a circuit which can
be used with any totem-pole-output TTL/LSTTL/HCMOS
logic gate. The buffer PNP transistor allows the circuit to
be used with logic devices which have low current-sinking capability. It also helps maintain the driving-gate
power-supply current at a constant level to minimize
ground shifting for other devices connected to the input-supply ground.
Likewise for common-mode transients which occur
when the LED is off (i.e. CMRH, since the output is “high”),
if an imbalance between ILP and ILN results in a transient
IF equal to or greater than the switching threshold of the
optocoupler, the transient “signal” may cause the output
to spike below 2 V (which constitutes a CMRH failure).
By using the recommended circuit in Figure 20, good
CMR can be achieved. (In the case of the -261N families,
a minimum CMR of 15 kV/µs is guaranteed using this circuit.) The balanced ILED-setting resistors help equalize ILP
and ILN to reduce the amount by which ILED is modulated
from transient coupling through CLA and CLC.
When using an open-collector TTL or open-drain CMOS
logic gate, the circuit in Figure 23 may be used. When
using a CMOS gate to drive the optocoupler, the circuit
shown in Figure 24 may be used. The diode in parallel
with the RLED speeds the turn-off of the optocoupler
LED.
VCC
1
1/2 RLED
1/2 RLED
8
2
7
VCC+
0.01 µF
350 Ω
ILP
3
4
CLA
ILN
5
SHIELD
+
VCM
6
VO
15 pF
CLC
HCPL-261X
420 Ω
(MAX)
74L504
(ANY
TTL/CMOS
GATE)
2N3906
(ANY PNP)
2
LED
3
GND
4
–
Figure 21. AC equivalent circuit for HCPL-261X.
Figure 22. TTL interface circuit for the HCPL-261A/-261N families.
HCPL-�261A fig 20
HCPL-�261A fig 21
15
1
VCC
VCC
HCPL-261X
820 Ω
1
HCPL-261A/261N
1N4148
2
74HC00
(OR ANY
OPEN-COLLECTOR/
OPEN-DRAIN
LOGIC GATE)
LED
3
74HC04
(OR ANY
TOTEM-POLE
OUTPUT LOGIC
GATE)
750 Ω
HCPL-�261A fig 22
LED
4
Figure 24. CMOS gate drive circuit for HCPL-261A/-261N families.
Table 1. Effects of Common Mode Pulse Direction on Transient ILED
If dVCM/dt Is:
then ILP Flows:
and ILN Flows:
positive (>0)
away from LED
away from LED
anode through CLA
cathode through CLC
negative ( |ILN|,
LED IF Current
Is Momentarily:
decreased
increased
nization of signals on parallel data lines is a concern. If
the parallel data is being sent through a group of opto
couplers, differences in propagation delays will cause
the data to arrive at the outputs of the optocouplers at
different times. If this difference in propagation delay
is large enough it will determine the maximum rate at
which parallel data can be sent through the optocouplers.
Propagation delay skew is defined as the difference between the minimum and maximum propagation delays,
either tPLH or tPHL, for any given group of optocouplers
which are operating under the same conditions (i.e., the
same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 25, if the inputs of a group of optocouplers are switched either ON
or OFF at the same time, tPSK is the difference between
the shortest propagation delay, either tPLH or tPHL, and the
longest propagation delay, either tPLH or tPHL.
As mentioned earlier, tPSK can determine the maximum
parallel data transmission rate. Figure 26 is the timing
diagram of a typical parallel data application with both
the clock and the data lines being sent through optocouplers.
The figure shows data and clock signals at the inputs and
outputs of the optocouplers. To obtain the maximum
data transmission rate, both edges of the clock signal are
being used to clock the data; if only one edge were used,
the clock signal would need to be twice as fast.
Propagation delay skew represents the uncertainty of
where an edge might be after being sent through an optocoupler. Figure 26 shows that there will be uncertainty
in both the data and the clock lines. It is important that
these two areas of uncertainty not overlap, otherwise
the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start
IF
to change before the clock signal has arrived. From these
considerations, the absolute minimum pulse width that
can be sent through optocouplers in a parallel application is twice tPSK. A cautious design should use a slightly
longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem.
The tPSK specified optocouplers offer the advantages of
guaranteed specifications for propagation delays, pulsewidth distortion, and propagation delay skew over the
recommended temperature, input current, and power
supply ranges.
50%
1.5 V
VO
TPHL
IF
50%
VO
TPLH
1.5 V
t PSK
Figure 25. Illustration of propagation delay skew – tPSK.
DATA
INPUTS
HCPL-261A fig 24
CLOCK
DATA
OUTPUTS
t PSK
CLOCK
t PSK
Figure 26. Parallel data transmission example.
HCPL-2602 fig 17
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0561EN
AV02-0391 - December 6, 2007
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