HCPL-0720/7720/0721/7721
40 ns Propagation Delay, CMOS Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Features
Available in either an 8-pin DIP or SO-8 package style
respectively, the HCPL-772X or HCPL-072X optocouplers
utilize the latest CMOS IC technology to achieve outstanding performance with very low power consumption. The HCPL-772X/072X require only two bypass capacitors for complete CMOS compatability.
• +5 V CMOS compatibility
• 20 ns maximum prop. delay skew
• High speed: 25 MBd
Basic building blocks of the HCPL-772X/072X are a CMOS
LED driver IC, a high speed LED and a CMOS detector
IC. A CMOS logic input signal controls the LED driver IC
which supplies current to the LED. The detector IC incorporates an integrated photodiode, a high-speed transimpedance amplifier, and a voltage comparator with an
output driver.
Functional Diagram
**VDD1
1
VI
2
*
3
8
IO
VDD2**
7
NC*
6
VO
4
SHIELD
5
GND2
VI, INPUT
H
L
LED1
VO, OUTPUT
• Digital
fieldbus
isolation: CC-Link, DeviceNet, ProfiH
bus, SDS
L
• AC plasma display panel level shifting
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
OFF
ON
TRUTH TABLE
POSITIVE LOGIC
LED1
Vo OUTPUT
H
OFF
H
L
ON
L
Applications
* Pin 3 is the anode of the internal LED and must be left unconnected
for guaranteed data sheet performance. Pin 7 is not connected
internally.
** A 0.1 µF bypass capacitor must be connected between pins 1 and
4, and 5 and 8.
VI
TRUTH TABLE
(POSITIVE LOGIC)
LED1
GND1
• 40 ns max. prop. delay
• 10 kV/µs minimum common mode rejection
• –40 to 85°C temperature range
• Safety and regulatory approvals
UL recognized
– 3750 Vrms for 1 min. per UL 1577
– 5000 Vrms for 1 min. per UL 1577
(for HCPL-772X option 020)
CSA component acceptance notice #5
IEC/EN/DIN EN 60747-5-2
– VIORM = 630 Vpeak for HCPL-772X option 060
– VIORM = 560 Vpeak for HCPL-072X option 060
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
8-Pin DIP
(300 Mil)
Small Outline
SO-8
Data Rate
PWD
HCPL-7721
HCPL-0721
25 MB
6 ns
HCPL-7720
HCPL-0720
25 MB
8 ns
Ordering Information
HCPL-0720, HCPL-0721, HCPL-7720 and HCPL-7721 are UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part
RoHS
non RoHS
Number Compliant Compliant Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000 Vrms/
1 Minute rating
IEC/EN/DIN
EN 60747-5-2 Quantity
-000E
no option
50 per tube
-300E
#300
X
X
50 per tube
-500E
#500
X
X
X
1000 per reel
HCPL-7720 -020E
-020
300 mil
X
50 per tube
HCPL-7721 -320E
-320
DIP-8
X
X
X
50 per tube
-520E
-520
X
X
X
X
1000 per reel
-060E
#060
X
50 per tube
-360E
#360
X
X
X
50 per tube
-560E
#560
X
X
X
X
1000 per reel
-000E
no option
100 per tube
HCPL-0720 -500E
#500
SO-8
X
X
X
1500 per reel
HCPL-0721 -060E
#060
X
100 per tube
#560
X
X
X
X
1500 per reel
-560E
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-7720-560E to order product of Gull Wing Surface Mount package in Tape and Reel packaging with
IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant.
Example 2:
HCPL-0721 to order product of Small Outline SO-8 package in Tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15, 2001 and
RoHS compliant will use ‘–XXXE.’
Package Outline Drawing
HCPL-772X 8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
7.62 ± 0.25
(0.300 ± 0.010)
5
OPTION 060 CODE*
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
A XXXXV
YYWW
1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*OPTION 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Package Outline Drawing
HCPL-772X Package with Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
6
7
8
1.016 (0.040)
5
6.350 ± 0.25
(0.250 ± 0.010)
1
3
2
10.9 (0.430)
4
1.27 (0.050)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.0 (0.080)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.25
(0.025 ± 0.010)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Package Outline Drawing
HCPL-072X Outline Drawing (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
7
6
5
XXXV
YWW
3.937 ± 0.127
(0.155 ± 0.005)
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
PIN ONE 1
2
3
4
0.406 ± 0.076
(0.016 ± 0.003)
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7°
1.524
(0.060)
45° X
0.432
(0.017)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.305 MIN.
(0.012)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
Solder Reflow Thermal Profile
300
TEMPERATURE (°C)
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
200
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
2.5°C ± 0.5°C/SEC.
30
SEC.
160°C
150°C
140°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
30
SEC.
3°C + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
TIME (SECONDS)
Note: Non-halide flux should be used.
Pb-Free IR Profile
tp
Tp
TEMPERATURE
TL
Tsmax
260 +0/-5 °C
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
Tsmin
ts
PREHEAT
60 to 180 SEC.
25
tL
60 to 150 SEC.
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01. (Option 060 only)
250
Insulation and Safety Related Specifications
Value
Parameter
Symbol
772X
072X
Units
Conditions
Minimum External Air
Gap (Clearance)
L(I01)
7.1
4.9
mm
Measured from input terminals to output
terminals, shortest distance through air.
Minimum External
Tracking (Creepage)
L(I02)
7.4
4.8
mm
Measured from input terminals to output
terminals, shortest distance path along body.
Minimum Internal Plastic
Gap (Internal Clearance)
0.08
0.08
mm
Insulation thickness between emitter and
detector; also known as distance through
insulation.
Tracking Resistance
(Comparative Tracking
Index)
CTI
≥175
≥175
Volts
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equipment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on factors such as pollution degree and insulation level.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (Option 060)
Description
Symbol
Installation classification per DIN VDE 0110/1.89, Table 1
HCPL-772X
Option 060
HCPL-072X
Option 060
Units
for rated mains voltage ≤150 V rms
for rated mains voltage ≤300 V rms
for rated mains voltage ≤450 V rms
I-IV
I-IV
I-III
I-IV
I-III
Climatic Classification
55/85/21
55/85/21
Pollution Degree (DIN VDE 0110/1.89)
2
2
Maximum Working Insulation Voltage
VIORM
630
560
V peak
Input to Output Test Voltage, Method b†
VIORM x 1.875 = VPR, 100% Production
Test with tm = 1 sec, Partial Discharge < 5 pC
VPR
1181
1050
V peak
Input to Output Test Voltage, Method a†
VIORM x 1.5 = VPR, Type and Sample Test,
tm = 60 sec, Partial Discharge < 5 pC
VPR
945
840
V peak
Highest Allowable Overvoltage†
(Transient Overvoltage, tini = 10 sec)
VIOTM
6000
4000
V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Thermal Derating curve, Figure 11.)
Case Temperature
Input Current
Output Power
TS
IS,INPUT
PS,OUTPUT
175
230
600
150
150
600
°C
mA
mW
Insulation Resistance at TS, V10 = 500 V
RIO
≥109
≥109
Ω
† Refer to the front of the optocoupler section of the Isolation and Control Component Designer’s Catalog, under Product Safety Regulations
section IEC/EN/DIN EN 60747-5-2, for a detailed description.
Note:
These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be ensured
by means of protective circuits.
The surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
–55
125
°C
Ambient Operating Temperature[1]
TA
–40
+85
°C
Supply Voltages
VDD1, VDD2
0
6.0
Volts
Input Voltage
VI
–0.5
VDD1 +0.5
Volts
Output Voltage
VO
–0.5
VDD2 +0.5
Volts
Average Output Current
IO
10
mA
Lead Solder Temperature
260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Solder Reflow Temperature Profile Section
Recommended Operating Conditions
Parameter
Symbol
Ambient Operating Temperature
TA
–40
+85
°C
Supply Voltages
VDD1, VDD2
4.5
5.5
V
Logic High Input Voltage
VIH
2.0
VDD1
V
Logic Low Input Voltage
VIL
0.0
0.8
V
Input Signal Rise and Fall Times
tr, tf
1.0
ms
Min.
Max.
Units
Figure
Figure
1, 2
Electrical Specifications
Test conditions that are not specified can be anywhere within the recommended operating range.
All typical specifications are at TA = +25°C, VDD1 = VDD2 = +5 V.
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Parameter
DC Specifications
Logic Low Input
IDD1L
6.0
10.0
mA
VI = 0 V
Supply Current
Logic High Input
Supply Current
Output Supply Current
Input Current
Logic High Output
Voltage
Logic Low Output
Voltage
Switching Specifications
Propagation Delay Time
to Logic Low Output
Propagation Delay Time
to Logic High Output
Pulse Width
Data Rate
Pulse Width Distortion
|tPHL - tPLH|
Propagation Delay Skew
Output Rise Time
(10 - 90%)
Output Fall Time
(90 - 10%)
Common Mode
Transient Immunity at
Logic High Output
Common Mode
Transient Immunity at
Logic Low Output
Input Dynamic Power
Dissipation
Capacitance
Output Dynamic Power
Dissipation
Capacitance
IDD1H
1.5
3.0
mA
IDD2L
IDD2H
II
VOH
VOL
5.5
7.0
5.0
4.8
0
mA
Fig.
Note
2
VI = VDD1
0.5
9.0
9.0
10
0.1
0.1
1.0
tPHL
tPLH
20
23
40
40
ns
CL = 15 pF
CMOS Signal Levels
3, 6
PW
PWD
tPSK
tR
tF
|CMH|
|CML|
40
7721/0721
7720/0720
10
10
3
3
9
8
20
20
25
6
8
20
MBd
ns
ns
ns
ns
kV/µs
7
4
5
VI = VDD1, VO >
0.8 VDD1,
VCM = 1000 V
VI = 0 V, VO > 0.8 V,
VCM = 1000 V
CPD1
60
pF
CPD2
10
–10
4.4
4.0
µA
V
V
V
IO = -20 µA, VI = VIH
IO = -4 mA, VI = VIH
IO = 20 µA, VI = VIL
IO = 400 µA, VI = VIL
IO = 4 mA, VI = VIL
1, 2
3
6
7
Package Characteristics
Parameter
Input-Output Momentary
Withstand Voltage
Resistance
(Input-Output)
Capacitance
(Input-Output)
Input Capacitance
Input IC Junction-to-Case
Thermal Resistance
Output IC Junction-to-Case
Thermal Resistance
Package Power Dissipation
Min.
Typ.
Max.
Units
Test Conditions
Fig.
Note
072X
VISO
772X
Option 020
RI-O
Symbol
3750
3750
5000
1012
Vrms
Ω
RH ≤50%,
t = 1 min.,
TA = 25°C
VI-O = 500 Vdc
8, 9,
10
8
CI-O
0.6
pF
f = 1 MHz
CI
-772X
θjci
-072X
-772X
θjco
-072X
PPD
3.0
145
160
140
135
°C/W
Thermocouple
located at center
underside of package
150
mW
11
Notes:
1. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not
guarantee functionality.
2. The LED is ON when VI is low and OFF when VI is high.
3. tPHL propagation delay is measured from the 50% level on the falling edge of the VI signal to the 50% level of the falling edge of the VO signal.
tPLH propagation delay is measured from the 50% level on the rising edge of the VI signal to the 50% level of the rising edge of the VO signal.
4. PWD is defined as |tPHL - tPLH|. %PWD (percent pulse width distortion) is equal to the PWD divided by pulse width.
5. tPSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at any given temperature within
the recommended operating conditions.
6. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common
mode voltage slew rate that can be sustained while maintaining
VO < 0.8 V. The common mode voltage slew rates apply to both rising
and falling common mode voltage edges.
7. Unloaded dynamic power dissipation is calculated as follows: CPD * VDD2 * f + IDD * VDD, where f is switching frequency in MHz.
8. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together.
9. In accordance with UL1577, each HCPL-072X is proof tested by applying an insulation test voltage ≥4500 VRMS for 1 second (leakage detection
current limit, II-O ≤5 µA). Each HCPL-772X is proof tested by applying an insulation test voltage ≥4500 Vrms for 1 second (leakage detection
current limit. II-O ≤ 5 µA.)
10. The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to your equipment level safety specification or Avago Application Note 1074 entitled
“Optocoupler Input-Output Endurance Voltage.”
11. CI is the capacitance measured at pin 2 (VI).
2.2
5
0 °C
25 °C
85 °C
2
1.9
1.8
1
1.7
0
1
2
3
4
5
VI (V)
Figure 1. Typical output voltage vs. input voltage.
HCPL-0710 fig 1
27
TPLH, TPHL (ns)
3
0
29
0 °C
25 °C
85 °C
2.0
VITH (V)
4
VO (V)
2.1
1.6
4.5
25
TPLH
23
TPHL
21
19
17
4.75
5
5.25
5.5
VDD1 (V)
Figure 2. Typical input voltage switching threshold vs. input supply voltage.
HCPL-0710 fig 2
15
0
10
20 30
40
50
60 70
80
TA (C)
Figure 3. Typical propagation delays vs. temperature.
HCPL-0710 fig 3
4
7
11
6
3
2
TF (ns)
TR (ns)
PWD (ns)
10
4
9
1
0
3
0
20
40
60
8
80
0
20
40
TA (C)
29
6
27
5
PWD (ns)
21
TPLH
19
15
15
20
25
30
35
40
45
3
2
0
15
50
20
25
HCPL-0710 fig 7
STANDARD 8 PIN DIP PRODUCT
800
PS (mW)
IS (mA)
700
600
500
400
300
(230)
200
100
0
0
25
50
75 100 125 150 175 200
TA – CASE TEMPERATURE – °C
35
40
45
HCPL-0710 fig 8
SURFACE MOUNT SO8 PRODUCT
800
PS (mW)
IS (mA)
700
600
500
400
300
200
(150)
100
0
0
25
50
75 100 125 150 175 200
TA – CASE TEMPERATURE – °C
Figure 9. Thermal derating curve, dependence of safety limiting value with case temperature per
IEC/EN/DIN EN 60747-5-2.
Option 060 fig 1
50
Figure 8. Typical pulse width distortion vs.
output load capacitance.
OUTPUT POWER – PS, INPUT CURRENT – IS
Figure 7. Typical propagation delays vs. output
load capacitance.
30
CI (pF)
CI (pF)
40
60
HCPL-0710 fig 6
1
17
20
Figure 6. Typical fall time vs. temperature.
4
TPHL
23
0
TA (C)
HCPL-0710 fig 5
25
10
2
80
Figure 5. Typical rise time vs. temperature.
HCPL-0710 fig 4
TPLH, TPHL (ns)
60
TA (C)
Figure 4. Typical pulse width distortion vs.
temperature.
OUTPUT POWER – PS, INPUT CURRENT – IS
5
80
Application Information
Bypassing and PC Board Layout
The HCPL-772X/072X optocouplers are extremely easy
to use. No external interface circuitry is required because
the HCPL-772X/072X use high-speed CMOS IC technology allowing CMOS logic to be connected directly to the
inputs and outputs.
As shown in Figure 10, the only external components
VDD1
VDD2
8
1
required for proper operation are two bypass capacitors. Capacitor values should be between 0.01 µF and
0.1 µF. For each capacitor, the total lead length between
both ends of the capacitor and the power-supply pins
should not exceed 20 mm. Figure 11 illustrates the recommended printed circuit board layout for the HPCL772X/072X.
C1
C2
VI
NC 3
GND1
7 NC
72X
YWW
2
6
VO
5
4
GND2
C1, C2 = 0.01 µF TO 0.1 µF
Figure 10. Recommended printed circuit board layout.
VDD1
VDD2
72X
YWW
VI
C1
HCPL-0710 fig 11
C2
VO
GND1
GND2
C1, C2 = 0.01 µF TO 0.1 µF
Figure 11. Recommended printed circuit board layout.
Propagation Delay, Pulse-Width Distortion and Propagation Delay
Skew
HCPL-0710 fig 12
Propagation Delay is a figure of merit which describes
how quickly a logic signal propagates through a system. The propagation delay from low to high (tPLH) is the
amount of time required for an input signal to propagate to the output, causing the output to change from
INPUT
VI
5 V CMOS
50%
tPLH
OUTPUT
VO
low to high. Similarly, the propagation delay from high
to low (tPHL) is the amount of time required for the input
signal to propagate to the output, causing the output to
change from high to low. See Figure 12.
0V
tPHL
90%
90%
10%
10%
Figure 12.
11
HCPL-0710 fig 13
VOH
2.5 V CMOS
VOL
Pulse-width distortion (PWD) is the difference between
tPHL and tPLH and often determines the maximum data
rate capability of a transmission system. PWD can be
expressed in percent by dividing the PWD (in ns) by the
minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20 - 30% of the minimum pulse
width is tolerable.
Propagation delay skew, tPSK, is an important parameter
to consider in parallel data applications where synchronization of signals on parallel data lines is a concern. If
the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the
data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delay is large
enough it will determine the maximum rate at which
parallel data can be sent through the optocouplers.
VI
Propagation delay skew is defined as the difference between the minimum and maximum propagation delays,
either tPLH or tPHL, for any given group of optocouplers
which are operating under the same conditions (i.e., the
same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 13, if the inputs of a group of optocouplers are switched either ON
or OFF at the same time, tPSK is the difference between
the shortest propagation delay, either tPLH or tPHL, and
the longest propagation delay, either tPLH or tPHL.
As mentioned earlier, tPSK can determine the maximum
parallel data transmission rate. Figure 14 is the timing
diagram of a typical parallel data application with both
the clock and data lines being sent through the optocouplers. The figure shows data and clock signals at the
inputs and outputs of the optocouplers. In this case the
data is assumed to be clocked off of the rising edge of
the clock.
DATA
50%
INPUTS
VO
2.5 V,
CMOS
CLOCK
tPSK
VI
DATA
50%
OUTPUTS
tPSK
CLOCK
2.5 V,
CMOS
VO
Figure 13. Propagation delay skew waveform.
HCPL-0710 fig 14
Propagation delay skew represents the uncertainty of
where an edge might be after being sent through an optocoupler. Figure 14 shows that there will be uncertainty
in both the data and clock lines. It is important that these
two areas of uncertainty not overlap, otherwise the clock
signal might arrive before all of the data outputs have
settled, or some of the data outputs may start to change
before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent
through optocouplers in a parallel application is twice tPSK.
12
tPSK
Figure 14. Parallel data transmission example.
HCPL-0710 fig 15
A cautious design should use a slightly longer pulse
width to ensure that any additional uncertainty in the
rest of the circuit does not cause a problem.
The HCPL-772X/072X optocouplers offer the advantage
of guaranteed specifications for propagation delays,
pulse-width distortion, and propagation delay skew
over the recommended temperature and power supply
ranges.
Digital Field Bus Communication Networks
To date, despite its many drawbacks, the 4 - 20 mA analog current loop has been the most widely accepted
standard for implementing process control systems. In
today’s manufacturing environment, however, automated systems are expected to help manage the process,
not merely monitor it. With the advent of digital field bus
communication networks such as CC-Link, DeviceNet,
PROFIBUS, and Smart Distributed Systems (SDS), gone
are the days of constrained information. Controllers can
now receive multiple readings from field devices (sensors, actuators, etc.) in addition to diagnostic information.
The physical model for each of these digital field bus
communication networks is very similar as shown in
Figure 15. Each includes one or more buses, an interface
unit, optical isolation, transceiver, and sensing and/or actuating devices.
CONTROLLER
BUS
INTERFACE
OPTICAL
ISOLATION
TRANSCEIVER
FIELD BUS
TRANSCEIVER
TRANSCEIVER
TRANSCEIVER
TRANSCEIVER
OPTICAL
ISOLATION
OPTICAL
ISOLATION
OPTICAL
ISOLATION
OPTICAL
ISOLATION
BUS
INTERFACE
BUS
INTERFACE
BUS
INTERFACE
BUS
INTERFACE
XXXXXX
YYY
DEVICE
CONFIGURATION
MOTOR
STARTER
MOTOR
CONTROLLER
HCPL-0710 fig 16
Figure 15. Typical field bus communication
physical model.
13
SENSOR
Optical Isolation for Field Bus Networks
To recognize the full benefits of these networks, each
recommends providing galvanic isolation using Avago
optocouplers. Since network communication is bi-directional (involving receiving data from and transmitting
data onto the network), two Avago optocouplers are
needed. By providing galvanic isolation, data integrity is
retained via noise reduction and the elimination of false
signals. In addition, the network receives maximum protection from power system faults and ground loops.
Within an isolated node, such as the DeviceNet Node
shown in Figure 16, some of the node’s components are
referenced to a ground other than V- of the network.
These components could include such things as devices
with serial ports, parallel ports, RS232 and RS485 type
ports. As shown in Figure 16, power from the network is
used only for the transceiver and input (network) side of
the optocouplers.
Isolation of nodes connected to any of the three types of
digital field bus networks is best achieved by using the
HCPL-772X/072X optocouplers. For each network, the
HCPL-772X/072X satisify the critical propagation delay
and pulse width distortion requirements over the temperature range of 0°C to +85°C, and power supply voltage range of 4.5 V to 5.5 V.
AC LINE
NODE/APP SPECIFIC
uP/CAN
HCPL
772x/072x
LOCAL
NODE
SUPPLY
GALVANIC
ISOLATION
BOUNDARY
HCPL
772x/072x
5 V REG.
TRANSCEIVER
DRAIN/SHIELD
V+ (SIGNAL)
V– (SIGNAL)
V+ (POWER)
V– (POWER)
SIGNAL
POWER
NETWORK
POWER
SUPPLY
Figure 16. Typical DeviceNet Node.
HCPL-0710 fig 17
14
Implementing CC-Link with the HCPL‑772X/072X
Power Supplies and Bypassing
CC-Link (Control and Communication Link) is developed
to merge control and information in the low-level network (field network) by PCs, thereby making the multivendor environment a reality. It has data control and
message-exchange function, as well as bit control function, and operates at the speed up to 10 Mbps.
The recommended CC-Link circuit is shown in Figure
17. Since the HCPL-772X/072X are fully compatible with
CMOS logic level signals, the optocoupler is connected
directly to the transceiver. Two bypass capacitors (with
values between 0.01 µF and 0.1 µF) are required and
should be located as close as possible to the input and
output power supply pins of the HCPL-772X/072X. For
each capacitor, the total lead length between both ends
of capacitor and the power supply pins should not exceed 20 mm. The bypass capacitors are required because of the high speed digital nature of the signals inside the optocoupler.
FIL
DA
VCC
VCC
A
DB
B
DG
Y
Z
SLD
VDD2
(5 V)
SN75ALS181NS
HCPL-7720#500
VDD1
R
VI
0.1 µ
RE
DE
GND1
VDD1
(5 V)
VDD2
10 K
VO
0.1 µ
GND
GND2
D
GND
GND
RD1
GND1
HCPL-7720#500
VDD2
0.1 µ
VO
GND
VDD1
VI
0.1 µ
GND
SD
FG
HCPL-2611#560
VOE
VDD
1K
HC14
0.1 µ
VO
GND
10 K
NC
+
–
NC
390
HC14
MPU
BOARD
OUTPUT
HCPL-2611#560
VOE
VDD
1K
HC14
10 K
Figure 17. Recommended CC-Link application circuit.
15
0.1 µ
VO
GND
NC
+
–
NC
390
SDGATEON
HC14
Implementing DeviceNet and SDS with the HCPL‑772X/072X
Isolated Node Powered by the Network
With transmission rates up to 1 Mbit/s, both DeviceNet
and SDS are based upon the same broadcast-oriented,
communications protocol — the Controller Area Network
(CAN). Three types of isolated nodes are recommended
for use on these networks: Isolated Node Powered by
the Network (Figure 18), Isolated Node with Transceiver
Powered by the Network (Figure 19), and Isolated Node
Providing Power to the Network (Figure 20).
This type of node is very flexible and as can be seen in
Figure 18, is regarded as “isolated” because not all of its
components have the same ground reference. Yet, all
components are still powered by the network. This node
contains two regulators: one is isolated and powers the
CAN controller, node-specific application and isolated
(node) side of the two optocouplers while the other is
non-isolated. The non-isolated regulator supplies the
transceiver and the non-isolated (network) half of the
two optocouplers.
NODE/APP SPECIFIC
uP/CAN
HCPL
772x/072x
ISOLATED
SWITCHING
POWER
SUPPLY
HCPL
772x/072x
GALVANIC
ISOLATION
BOUNDARY
REG.
TRANSCEIVER
DRAIN/SHIELD
V+ (SIGNAL)
V– (SIGNAL)
V+ (POWER)
V– (POWER)
SIGNAL
POWER
NETWORK
POWER
SUPPLY
Figure 18. Isolated node powered by the network.
HCPL-0710 fig 18
Isolated Node with Transceiver Powered by the Network
*Bus V+ Sensing
Figure 19 shows a node powered by both the network
and another source. In this case, the transceiver and isolated (network) side of the two optocouplers are powered by the network. The rest of the node is powered by
the AC line which is very beneficial when an application
requires a significant amount of power. This method is
also desirable as it does not heavily load the network.
It is suggested that the Bus V+ sense block shown in Figure 19 be implemented. A locally powered node with an
un-powered isolated Physical Layer will accumulate errors and become bus-off if it attempts to transmit. The
Bus V+ sense signal would be used to change the BOI attribute of the DeviceNet Object to the “auto-reset” (01)
value. Refer to Volume 1, Section 5.5.3. This would cause
the node to continually reset until bus power was detected. Once power was detected, the BOI attribute would
be returned to the “hold in bus-off” (00) value. The BOI
attribute should not be left in the “auto-reset” (01) value
since this defeats the jabber protection capability of the
CAN error confinement. Any inexpensive low frequency
optical isolator can be used to implement this feature.
More importantly, the unique “dual-inverting” design of
the HCPL-772X/072X ensure the network will not “lockup” if either AC line power to the node is lost or the node
powered-off. Specifically, when input power (VDD1) to the
HCPL-772X/072X located in the transmit path is eliminated, a RECESSIVE bus state is ensured as the HCPL‑772X/
072X output voltage (VO) go HIGH.
16
AC LINE
NON ISO
5V
NODE/APP SPECIFIC
uP/CAN
HCPL
772x/072x
HCPL
772x/072x
*HCPL
772x/072x
GALVANIC
ISOLATION
BOUNDARY
REG.
TRANSCEIVER
DRAIN/SHIELD
V+ (SIGNAL)
V– (SIGNAL)
V+ (POWER)
V– (POWER)
SIGNAL
POWER
NETWORK
POWER
SUPPLY
* OPTIONAL FOR BUS V + SENSE
Figure 19. Isolated node with transceiver powered by the network.
HCPL-0710 fig 19
Isolated Node Providing Power to the Network
Figure 20 shows a node providing power to the network.
The AC line powers a regulator which provides five (5)
volts locally. The AC line also powers a 24 volt isolated
supply, which powers the network, and another five-volt
regulator, which, in turn, powers the transceiver and isolated (network) side of the two optocouplers. This method is recommended when there are a limited number of
devices on the network that don’t require much power,
thus eliminating the need for separate power supplies.
More importantly, the unique “dual-inverting” design of
the HCPL-772X/072X ensure the network will not “lockup” if either AC line power to the node is lost or the node
powered-off. Specifically, when input power (VDD1) to the
HCPL-772X/072X located in the transmit path is eliminated, a RECESSIVE bus state is ensured as the HCPL‑772X/
072X output voltage (VO) go HIGH.
AC LINE
DEVICENET NODE
NODE/APP SPECIFIC
5 V REG.
uP/CAN
HCPL
772x/072x
ISOLATED
SWITCHING
POWER
SUPPLY
HCPL
772x/072x
GALVANIC
ISOLATION
BOUNDARY
5 V REG.
TRANSCEIVER
DRAIN/SHIELD
V+ (SIGNAL)
V– (SIGNAL)
V+ (POWER)
V– (POWER)
SIGNAL
POWER
Figure 20. Isolated node providing power to the network.
17
HCPL-0710 fig 20
Power Supplies and Bypassing
The recommended DeviceNet application circuit is
shown in Figure 21. Since the HCPL-772X/072X are fully
compatible with CMOS logic level signals, the optocoup
ler is connected directly to the CAN transceiver. Two bypass capacitors (with values between 0.01 and 0.1 µF)
are required and should be located as close as possible
GALVANIC
ISOLATION
BOUNDARY
ISO 5 V
1 VDD1
TX0
2 VIN
0.01 µF
3
5V
VDD2 8
HCPL-772x
HCPL-072x VO 6
TxD
0.01 µF
6 VO
7
GND2 5
+
5 V+
4 CAN+
3 SHIELD
82C250
C4
0.01 µF
2 CAN–
CANL
REF
GND
GND1 4
1 V–
VREF
RXD
0.01
µF
3
D1
30 V
C1
0.01 µF
500 V
HCPL-772x
HCPL-072x VIN 2
8 VDD2
ISO 5 V
+
VCC
Rs
5 GND2
LINEAR OR
SWITCHING
REGULATOR
CANH
GND
RX0
+
0.01
µF
7
4 GND1
to the input and output power-supply pins of the HCPL772X/072X. For each capacitor, the total lead length between both ends of the capacitor and the power supply
pins should not exceed 20 mm. The bypass capacitors
are required because of the high-speed digital nature of
the signals inside the optocoupler.
VDD1 1
5V
Figure 21. Recommended DeviceNet application circuit.
Implementing PROFIBUS with the HCPL-772X/072X
HCPL-0710 fig 21
An acronym for Process Fieldbus, PROFIBUS is essentially
a twisted-pair serial link very similar to RS-485 capable
of achieving high-speed communication up to 12 MBd.
As shown in Figure 22, a PROFIBUS Controller (PBC) establishes the connection of a field automation unit (control or central processing station) or a field device to
the transmission medium. The PBC consists of the line
transceiver, optical isolation, frame character transmitter/receiver (UART), and the FDL/APP processor with the
interface to the PROFIBUS user.
PROFIBUS USER:
CONTROL STATION
(CENTRAL PROCESSING)
OR FIELD DEVICE
USER INTERFACE
FDL/APP
PROCESSOR
UART
PBC
OPTICAL ISOLATION
TRANSCEIVER
MEDIUM
Figure 22. PROFIBUS Controller (PBC).
18
HCPL-0710 fig 22
R1
1M
Power Supplies and Bypassing
The recommended PROFIBUS application circuit is shown
in Figure 23. Since the HCPL-772X/072X are fully compatible with CMOS logic level signals, the optocoupler is
connected directly to the transceiver. Two bypass capacitors (with values between 0.01 and 0.1 µF) are required
and should be located as close as possible to the input
and output power-supply pins of the HCPL-772X/072X.
For each capacitor, the total lead length between both
ends of the capacitor and the power supply pins should
not exceed 20 mm. The bypass capacitors are required
because of the high-speed digital nature of the signals
inside the optocoupler.
Being very similar to multi-station RS485 systems, the
HCPL-061N optocoupler provides a transmit disable
function which is necessary to make the bus free after
each master/slave transmission cycle. Specifically, the
HCPL-061N disables the transmitter of the line driver by
putting it into a high state mode. In addition, the HCPL061N switches the RX/TX driver IC into the listen mode.
The HCPL-061N offers HCMOS compatibility and the
high CMR performance (1 kV/µs at VCM = 1000 V) essential in industrial communication interfaces.
GALVANIC
ISOLATION
BOUNDARY
5V
ISO 5 V
8 VDD2
VDD1 1
VIN 2
7
0.01 µF
HCPL-772x
6 VO HCPL-072x
Rx
ISO 5 V
5 GND2
1
0.01
µF
3
GND1 4
5V
ISO 5 V
2 VIN
Tx
4 GND1
B
0.01 µF
GND2 5
Tx ENABLE
1, 0 kΩ
2 ANODE
VE 7
3 CATHODE
VO 6
4
0.01
µF
680 Ω
GND 5
HCPL-061N
Figure 23. Recommended PROFIBUS application circuit.
HCPL-0710 fig 23
For product information and a complete list of distributors, please go to our website:
SHIELD
–
GND
5
VCC 8
1
7
DE
ISO 5 V
5V
+
RT
HCPL-772x
HCPL-072x VO 6
3
0.01 µF
0.01
µF
7
D
2 RE
VDD2 8
A 6
SN75176B
4
3
1 VDD1
R
0.01
µF
8
VCC
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0565EN
AV02-0876EN - June 10, 2008
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