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HCPL-315J-000E

HCPL-315J-000E

  • 厂商:

    AVAGO(博通)

  • 封装:

    SOIC16_12Pin

  • 描述:

    600mA Gate Driver Optical Coupling 5000Vrms 2 Channel 16-SO

  • 数据手册
  • 价格&库存
HCPL-315J-000E 数据手册
HCPL-3150 (Single Channel), HCPL-315J (Dual Channel) 0.5 Amp Output Current IGBT Gate Drive Optocoupler Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features The HCPL-315X consists of an LED optically coupled to an integrated circuit with a power output stage. This optocoupler is ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applica­tions. The high operating voltage range of the output stage pro­vides the drive voltages required by gate controlled devices. The voltage and current supplied by this optocoupler makes it ideally suited for directly driving IGBTs with ratings up to 1200 V/50 A. For IGBTs with higher ratings, the HCPL-3150/315J can be used to drive a discrete power stage which drives the IGBT gate. • 0.6A maximum peak output current Applications • Wide operating VCC range: 15 to 30 volts • Industrial inverters • Safety and regulatory approval: UL recognized (UL1577), 3750 Vrms/1 min. IEC/EN/DIN EN 60747-5-2 approved VIORM = 630 Vpeak (HCPL-3150 option 060 only) VIORM = 891 Vpeak (HCPL-315J) CSA certified Functional Diagram 8 7 VCC VO CATHODE 3 6 VO N/C 4 5 VEE SHIELD HCPL-3150 • Under Voltage Lock-Out protection (UVLO) with hysteresis • HCPL-315J: channel one to channel two output isolation = 1500 Vrms/1 min. • Uninterruptable Power Supplies (UPS) 2 • ICC = 5 mA maximum supply current • Industrial temperature range: -40°C to 100°C • Switch Mode Power Supplies (SMPS) ANODE • 1.0 V maximum low level output voltage (VOL) eliminates need for negative gate drive • +/– 0.35 µs maximum delay between devices/channels • AC and brushless dc motor drives 1 • 15 kV/µs minimum Common Mode Rejection (CMR) at VCM = 1500 V • 0.5 µs maximum propagation delay • Isolated IGBT/MOSFET gate drive N/C • 0.5 A minimum peak output current N/C 1 16 VCC ANODE 2 15 VO CATHODE 3 ANODE 6 11 VCC CATHODE 7 10 VO N/C 8 SHIELD SHIELD 14 VEE 9 TRUTH TABLE VCC - VEE “Positive Going” LED (i.e., Turn-On) OFF 0 - 30 V ON 0 - 11 V ON 11 - 13.5 V ON 13.5 - 30 V VCC - VEE “Negative-Going” (i.e., Turn-Off) 0 - 30 V 0 - 9.5 V 9.5 - 12 V 12 - 30 V VEE HCPL-315J A 0.1 µF bypass capacitor must be connected between the VCC and VEE pins for each channel. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. VO LOW LOW TRANSITION HIGH Selection Guide: Invertor Gate Drive Optoisolators Package Type Part Number Number of Channels Widebody (400 mil) 8-Pin DIP (300 mil) Small Outline SO-16 HCPL-3150 HCPL-3120 HCPL-J312 HCPL-J314 HCNW-3120 HCPL-315J HCPL-316J HCPL-314J 1 1 1 1 1 2 1 2 IEC/EN/DIN EN 60747-5-2 Approvals VIORM 630 Vpeak Option 060 VIORM 891Vpeak VIORM 1414 Vpeak VIORM 891 Vpeak UL Approval 3750 Vrms/1 min. 3750 Vrms/1 min. 5000 Vrms/1min. 3750 Vrms/1 min. Output Peak Current 0.5A 2A CMR (minimum) UVLO 2A 0.4A 2A 0.5A 2A 0.4A 15 kV/µs 10 kV/µs 15 kV/µs 10 kV/µs Yes No Yes No Fault Status No Yes No Ordering Information HCPL-3150 and HCPL-315J are UL Recognized with 3750 Vrms for 1 minute per UL1577. Option Part Number HCPL-3150 HCPL-315J RoHS Compliant Non RoHS Compliant -000E No option -300E #300 -500E #500 -060E #060 -360E #360 x x -560E #560 x x -000E No option -500E #500 Package Surface Mount Gull Wing Tape & Reel IEC/EN/DIN EN 60747-5-2 Quantity 50 per tube 300 mil DIP-8 SO-16 x x x x 50 per tube x x x x x 1000 per reel x 50 per tube x 50 per tube x 1000 per reel x 45 per tube x 850 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example 1: HCPL-3150-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant. Example 2: HCPL-3150 to order product of 300 mil DIP package in tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS compliant option will use ‘-XXXE’.  Package Outline Drawings Standard DIP Package 9.40 (0.370) 9.90 (0.390) 8 7 6 5 OPTION CODE* A 3150 Z YYWW PIN ONE 1 2 3 0.20 (0.008) 0.33 (0.013) 6.10 (0.240) 6.60 (0.260) DATE CODE 7.36 (0.290) 7.88 (0.310) 5° TYP. 4 1.78 (0.070) MAX. 1.19 (0.047) MAX. 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. DIMENSIONS PIN IN MILLIMETERS AND (INCHES). DIAGRAM PIN ONE 0.51 (0.020) MIN. 2.92 (0.115) MIN. 0.76 (0.030) 1.40 (0.055) 0.65 (0.025) MAX. * MARKING1 CODE VDD1LETTER VDD2FOR 8 OPTION NUMBERS. "V" = OPTION 060. OPTION NUMBERS AND 500 2 VIN+ 300 VOUT+ 7 NOT MARKED. NOTE: FLOATING IS 0.25 mm (10 mils) MAX. 3 V LEAD V PROTRUSION 6 IN– 2.28 (0.090) 2.80 (0.110) 4 OUT– GND1 GND2 5 Package Outline Drawings Gull-Wing Surface-Mount Option 300 LAND PATTERN RECOMMENDATION 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 OPTION CODE* 5 A 3150 Z 6.350 ± 0.25 (0.250 ± 0.010) YYWW MOLDED 1 2 3 1.016 (0.040) 10.9 (0.430) 4 1.27 (0.050) 9.65 ± 0.25 (0.380 ± 0.010) 1.780 (0.070) MAX. 1.19 (0.047) MAX. 7.62 ± 0.25 (0.300 ± 0.010) 0.20 (0.008) 0.33 (0.013) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 2.540 (0.100) BSC 0.635 ± 0.130 (0.025 ± 0.005) DIMENSIONS IN MILLIMETERS (INCHES). TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01 xx.xxx = 0.005 LEAD COPLANARITY MAXIMUM: 0.102 (0.004) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.  2.0 (0.080) 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. *MARKING CODE LETTER FOR OPTION NUMBERS. "V" = OPTION 060. OPTION NUMBERS 300 AND 500 NOT MARKED. 16 - Lead Surface Mount 11 10 9 VO2 VCC2 VO1 10.36 ± 0.20 (0.408 ± 0.008) GND1 VCC1 16 15 14 GND2 LAND PATTERN RECOMMENDATION (0.295 ± 0.004) 7.49 ± 0.10 NC VIN1 V1 VIN2 V2 NC HCPL-315J 1 2 3 6 7 8 (0.458) 11.63 (0.085) 2.16 (0.025) 0.64 (0.004 – 0.011) 0.10 – 0.30 STANDOFF VIEW FROM PIN 16 0 - 8° 9° (0.025 MIN.) 0.64 VIEW FROM PIN 1 (0.138 ± 0.005) 3.51 ± 0.13 (0.018) (0.050) 0.457 1.27 (0.406 ± 0.007) 10.31 ± 0.18  (0.345 ± 0.008) 8.76 ± 0.20 (0.0091 – 0.0125) 0.23 – 0.32 (0.408 ± 0.008) 10.36 ± 0.20 ALL LEADS TO BE COPLANAR ± (0.002 INCHES) 0.05 mm. DIMENSIONS IN (INCHES) AND MILLIMETERS. NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Solder Reflow Thermal Profile 300 TEMPERATURE (°C) PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. 200 PEAK TEMP. 245°C PEAK TEMP. 240°C 2.5°C ± 0.5°C/SEC. SOLDERING TIME 200°C 30 SEC. 160°C 150°C 140°C PEAK TEMP. 230°C 30 SEC. 3°C + 1°C/–0.5°C 100 PREHEATING TIME 150°C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 200 250 TIME (SECONDS) Note: Non-halide flux should be used. Recommended Pb-Free IR Profile tp Tp TEMPERATURE TL Tsmax 260 +0/-5 °C TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE 20-40 SEC. 217 °C RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C RAMP-DOWN 6 °C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. 25 tL 60 to 150 SEC. t 25 °C to PEAK TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C Note: Non-halide flux should be used. Regulatory Information The HCPL-3150 and HCPL-315J have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324.  IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. (Option 060 and HCPL-315J only) IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Description Symbol HCPL-3150#060 HCPL-315J I - IV I - III I - IV I - IV I - III 55/100/21 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 2 Maximum Working Insulation Voltage VIORM 630 891 Vpeak Vpeak Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 150 Vrms   for rated mains voltage ≤ 300 Vrms   for rated mains voltage ≤ 600 Vrms Climatic Classification Unit Input to Output Test Voltage, Method b*   VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial discharge < 5 pC VPR 1181 1670 Input to Output Test Voltage, Method a*   VIORM x 1.5 = VPR, Type and Sample Test, tm = 60 sec, VPR   Partial discharge < 5 pC 945 1336 Vpeak VIOTM 6000 6000 Vpeak 175 IS, INPUT PS, OUTPUT 175 230 600 °C 400 1200 mA mW RS ≥ 109 ≥ 109 Ω Highest Allowable Overvoltage* (Transient Overvoltage tini = 10 sec) Safety-Limiting Values – Maximum Values Allowed in the Event of a Failure, Also See Figure 37, Thermal Derating Curve.   Case Temperature TS   Input Current   Output Power Insulation Resistance at TS, VIO = 500 V *Refer to the front of the optocoupler section of the current Catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed description of Method a and Method b partial discharge test profiles. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.  Insulation and Safety Related Specifications Parameter Symbol HCPL-3150 HCPL-315J Units Conditions Minimum External Air Gap (External Clearance) L(101) 7.1 8.3 mm Measured from input terminals to output terminals, shortest distance through air. Minimum External Tracking (External Creepage) L(102) 7.4 8.3 mm Measured from input terminals to output erminals, shortest distance path along body. Minimum Internal Plastic Gap (Internal Clearance) 0.08 ≥0.5 mm Through insulation distance conductor to conductor. CTI ≥175 ≥175 Volts DIN IEC 112/VDE 0303 Part 1 IIIa IIIa Tracking Resistance (Comparative Tracking Index) Isolation Group Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance wtih CECC 00802. Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS -55 125 °C Operating Temperature TA -40 100 °C Average Input Current IF(AVG) 25 mA Peak Transient Input Current ( 5 V 21 VFHL 0.8 V VF 1.2 1.5 1.8 V HCPL-3150 IF = 10 mA 16 1.6 1.95 HCPL-315J ∆VF/∆TA -1.6 Current Low to High Threshold Input VF = -3.0 to +0.8 V 9, 15, Voltage High to Low Input Forward Voltage Temperature mV/°C IF = 10 mA Coefficient of Forward Voltage Input Reverse BVR 5 V HCPL-3150 IR = 10 µA Breakdown Voltage 3 HCPL-315J IR = 10 µA Input Capacitance CIN 70 pF f = 1 MHz, VF = 0 V UVLO Threshold VUVLO+ 11.0 12.3 13.5 V VO > 5 V, 22, VUVLO- 9.5 10.7 12.0 IF = 10 mA 36 UVLOHYS 1.6 V UVLO Hysteresis *All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted.  Note 6, 7 Switching Specifications (AC) Over recommended operating conditions (TA = -40 to 100°C, IF(ON) = 7 to 16 mA, VF(OFF) = -3.6 to 0.8 V, VCC = 15 to 30 V, VEE = Ground, each channel) unless otherwise specified. Parameter Symbol Min. Typ.* Max. Units tPLH 0.10 0.30 0.50 µs Time to High Output Level tPHL 0.10 PWD Propagation Delay PDD Difference Between (tPHL - tPLH) Propagation Delay Propagation Delay Test Conditions Fig. Note Rg = 47 Ω, 10, 11, 14 Cg = 3 nF, 12, 13, f = 10 kHz, 14, 23 Duty Cycle = 50% 0.3 0.50 µs 0.3 µs 15 -0.35 0.35 µs 34, 36 10 23 VO > 5 V, 22 Time to Low Output Level Pulse Width Distortion Any Two Parts or Channels Rise Time t r 0.1 µs Fall Time tf 0.1 µs tUVLO ON 0.8 µs tUVLO OFF 0.6 µs IF = 10 mA TA = 25°C, UVLO Turn On Delay UVLO Turn Off Delay Output High Level IF = 10 mA VO < 5 V, |CMH| 15 30 kV/µs Common Mode IF = 10 to 16 mA, Transient VCM = 1500 V, Immunity VCC = 30 V TA = 25°C, Output Low Level |CML| 15 30 kV/µs Common Mode VCM = 1500 V, Transient VF = 0 V, Immunity VCC = 30 V  24 11, 12 11, 13 Package Characteristics (each channel, unless otherwise specified) Parameter Symbol Device Min. Typ.* Max. Units Test Conditions Input-Output Momentary Withstand Voltage** VISO HCPL-3150 HCPL-315J 3750 3750 Vrms RH < 50%, t = 1 min., TA = 25°C 8, 9 Output-Output Momentary Withstand Voltage** VO-O HCPL-315J 1500 Vrms RH < 50% t = 1 min., TA = 25°C 17 Resistance (Input - Output) RI-O 1012 Ω VI-O = 500 VDC 9 Capacitance CI-O (Input - Output) HCPL-3150 HCPL-315J 0.6 1.3 pF f = 1 MHz LED-to-Case θLC Thermal Resistance HCPL-3150 391 °C/W 28 18 LED-to-Detector Thermal Resistance θLD HCPL-3150 439 °C/W Detector-to-Case Thermal Resistance θDC HCPL-3150 119 °C/W Thermocouple located at center underside of package Fig. Note *All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted. **The Input-Output/Output-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output/output-output continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” Notes: 1. Derate linearly above 70°C free-air temperature at a rate of 0.3 mA/°C. 2. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with IO peak minimum = 0.5 A. See Applications section for additional details on limiting IOH peak. 3. Derate linearly above 70°C free-air temperature at a rate of 4.8 mW/°C. 4. Derate linearly above 70°C free-air temperature at a rate of 5.4 mW/°C. The maximum LED junction tempera­ture should not exceed 125°C. 5. Maximum pulse width = 50 µs, maximum duty cycle = 0.5%. 6. In this test VOH is measured with a dc load current. When driving capacitive loads VOH will approach VCC as IOH approaches zero amps. 7. Maximum pulse width = 1 ms, maximum duty cycle = 20%. 8. In accordance with UL1577, each HCPL-3150 optocoupler is proof tested by applying an insulation test voltage ≥4500 Vrms (≥ 5000 Vrms for the HCPL-315J) for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table, if applicable. 9. Device considered a two-terminal device: pins on input side shorted together and pins on output side shorted together. 10. The difference between tPHL and tPLH between any two parts or channels under the same test condition. 11. Pins 1 and 4 (HCPL-3150) and pins 3 and 4 (HCPL-315J) need to be connected to LED common. 12. Common mode transient immunity in the high state is the maximum tolerable |dVCM /dt| of the common mode pulse, VCM, to assure that the output will remain in the high state (i.e., VO > 15.0 V ). 13. Common mode transient immunity in a low state is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that the output will remain in a low state (i.e., VO  5 V + VCC = 15 – to 30 V IF = 10 mA Figure 22. UVLO Test Circuit. HCPL-3150 fig 22 HCPL-3150 fig 21 13 IOL VO > 5 V + – VCC 1 8 0.1 µF IF = 7 to 16 mA + 10 KHz – 500 Ω 50% DUTY CYCLE 2 + – 7 IF VCC = 15 to 30 V tr tf VO 3 90% 47 Ω 6 50% VOUT 3 nF 4 10% 5 tPLH tPHL Figure 23. tPLH, tPHL, tr, and tf Test Circuit and Waveforms. VCM IF 5V 1 0.1 µF HCPL-3150 fig 23 A B + – δV 8 2 7 VO 3 6 4 5 δt = VCM ∆t 0V ∆t + – VCC = 30 V VOH VO SWITCH AT A: IF = 10 mA VO VOL + – SWITCH AT B: IF = 0 mA VCM = 1500 V Figure 24. CMR Test Circuit and Waveforms. Applications Information HCPL-3150 fig 24 Eliminating Negative IGBT Gate Drive in many applica­tions as shown in Figure 25. Care should be taken with such a PC board design to avoid routing the IGBT collector or emitter traces close to the HCPL3150/315J input as this can result in unwanted coupling of transient signals into the HCPL-3150/315J and degrade performance. (If the IGBT drain must be routed near the HCPL-3150/315J input, then the LED should be reverse-biased when in the off state, to prevent the transient signals coupled from the IGBT drain from turning on the HCPL-3150/315J.) To keep the IGBT firmly off, the HCPL-3150/315J has a very low maximum VOL specification of 1.0 V. The HCPL3150/315J realizes this very low VOL by using a DMOS transistor with 4 Ω (typical) on resistance in its pull down circuit. When the HCPL‑3150/315J is in the low state, the IGBT gate is shorted to the emitter by Rg + 4 Ω. Minimizing Rg and the lead inductance from the HCPL-3150/315J to the IGBT gate and emitter (possibly by mounting the HCPL-3150/315J on a small PC board directly above the IGBT) can eliminate the need for negative IGBT gate drive HCPL-3150 +5 V 1 8 270 Ω CONTROL INPUT 74XXX OPEN COLLECTOR 0.1 µF 2 7 3 6 4 5 Figure 25a. Recommended LED Drive and Application Circuit. 14 HCPL-3150 fig 25 + – VCC = 18 V + HVDC Rg Q1 3-PHASE AC Q2 - HVDC HCPL-315J +5 V CONTROL INPUT 270 Ω 74XX OPEN COLLECTOR 1 16 0.1 µF 2 15 3 14 + – FLOATING SUPPLY VCC = 18 V Rg GND 1 +5 V CONTROL INPUT 3-PHASE AC 6 11 270 Ω 74XX OPEN COLLECTOR + HVDC 0.1 µF 7 10 8 9 + – VCC = 18 V Rg GND 1 - HVDC Figure 25b. Recommended LED Drive and Application Circuit (HCPL-315J). HCPL-3150 fig 25b Selecting the Gate Resistor (Rg) to Minimize IGBT Switching Losses. Step 1: Calculate Rg Minimum From the IOL Peak Specifica­tion. The IGBT and Rg in Figure 26 can be analyzed as a simple RC circuit with a voltage supplied by the HCPL-3150/315J. (VCC – VEE - VOL) Rg ≥    IOLPEAK Step 2: Check the HCPL-3150/315J Power Dissipation and Increase Rg if Necessary. The HCPL-3150/315J total power dissipa­tion (PT ) is equal to the sum of the emitter power (PE) and the output power (PO): PT = PE + PO PE = IF • VF • Duty Cycle (VCC – VEE - 1.7 V) =    IOLPEAK PO = PO(BIAS) + PO (SWITCHING) (15 V + 5 V - 1.7 V) =    0.6 A For the circuit in Figure 26 with IF (worst case) = 16 mA, Rg = 30.5 Ω, Max Duty Cycle = 80%, Qg = 500 nC, f = 20 kHz and TAmax = 90°C: = 30.5 Ω The VOL value of 2 V in the pre­vious equation is a conservative value of VOL at the peak current of 0.6 A (see Figure 6). At lower Rg values the voltage supplied by the HCPL-3150/315J is not an ideal voltage step. This results in lower peak currents (more margin) than predicted by this analysis. When negative gate drive is not used VEE in the previous equation is equal to zero volts. 15    = ICC•(VCC - VEE) + ESW(RG, QG) •f PE = 16 mA • 1.8 V • 0.8 = 23 mW PO = 4.25 mA • 20 V + 4.0 µJ•20 kHz    = 85 mW + 80 mW    = 165 mW > 154 mW (PO(MAX) @ 90°C    = 250 mW−20C• 4.8 mW/C) HCPL-3150 +5 V 1 8 270 Ω 0.1 µF CONTROL INPUT 2 7 3 6 + – 4 + HVDC Rg Q1 – + 74XXX OPEN COLLECTOR VCC = 15 V VEE = -5 V 3-PHASE AC 5 Q2 - HVDC Figure 26a. HCPL-3150 Typical Application Circuit with Negative IGBT Gate Drive. HCPL-315J +5 V 1 CONTROL INPUT 16 270 Ω 74XX OPEN COLLECTOR HCPL-3150 fig 26 0.1 µF 2 15 3 14 + – – + VEE = -5 V 6 CONTROL INPUT 11 270 Ω 74XX OPEN COLLECTOR 0.1 µF 7 10 8 9 + – 3-PHASE AC VCC = 15 V Rg – + VCC = -5 V GND 1 + HVDC Rg GND 1 +5 V FLOATING SUPPLY VCC = 15 V - HVDC Figure 26b. HCPL-315J Typical Application Circuit with Negative IGBT Gate Drive. HCPL-3150 fig 26b PE Parameter Description IF LED Current VF LED On Voltage Duty Cycle 16 Maximum LED Duty Cycle PO Parameter ICC VCC VEE ESW(Rg,Qg) f Description Supply Current Positive Supply Voltage Negative Supply Voltage Energy Dissipated in the HCPL-3150/315J for each IGBT Switching Cycle (See Figure 27) Switching Frequency The value of 4.25 mA for ICC in the previous equation was obtained by derating the ICC max of 5 mA (which occurs at -40°C) to ICC max at 90°C (see Figure 7). From the thermal mode in Figure 28a the LED and detector IC junction temperatures can be expressed as: Since PO for this case is greater than PO(MAX), Rg must be increased to reduce the HCPL-3150 power dissipation. TJE = PE • (θLC||(θLD + θDC) + θCA)       θLC • θDC + PD • + θCA + TA   θLC + θDC + θLD    ( PO(SWITCHING MAX) = PO(MAX) - PO(BIAS) (     ) ) = 154 mW - 85 mW       θLC • θDC TJD = PE + θCA   θLC + θDC + θLD = 69 mW + PD• (θDC||(θLD + θLC) + θCA) + TA  PO(SWITCHINGMAX) ESW(MAX) =     f Inserting the values for θLC and θDC shown in Figure 28 gives: 69 mW =   20 kHz TJE = PE • (230°C/W + θCA) + PD• (49°C/W + θCA) + TA = 3.45 µJ TJD = PE • (49°C/W + θCA) + PD• (104°C/W + θCA) + TA For Qg = 500 nC, from Figure 27, a value of ESW = 3.45 µJ gives a Rg = 41 Ω. Thermal Model (HCPL-3150) TJE = PE• 313°C/W + PD• 132°C/W + TA The steady state thermal model for the HCPL-3150 is shown in Figure 28a. The thermal resistance values given in this model can be used to calculate the tempera­tures at each node for a given operating condition. As shown by the model, all heat generated flows through θCA which raises the case temperature TC accordingly. The value of θCA depends on the conditions of the board design and is, therefore, determined by the designer. The value of θCA = 83°C/W was obtained from thermal measure­ments using a 2.5 x 2.5 inch PC board, with small traces (no ground plane), a single HCPL-3150 soldered into the center of the board and still air. The absolute maximum power dissipation derating specifica­tions assume a θCAvalue of 83°C/W. θLD = 439°C/W TJE TJD θLC = 391°C/W θDC = 119°C/W TC θCA = 83°C/W* TA   = 45 mW• 313°C/W + 250 mW • 132°C/W + 70°C = 117°C TJD = PE• 132°C/W + PD• 187°C/W + TA   = 45 mW• 132C/W + 250 mW • 187°C/W + 70°C = 123°C TJE and TJD should be limited to 125°C based on the board layout and part placement (θCA) specific to the application. TJE = LED junction temperature JUNCTION TEMPERATURE TTJDJE = = LED detector IC junction temperature = DETECTOR IC JUNCTION TEMPERATURE TTTCJD = case temperature measured at the center of the package bottom C = CASE TEMPERATURE MEASURED AT THE θLC = CENTER LED-to-case thermal BOTTOM resistance OF THE PACKAGE THERMAL RESISTANCE θθθLDLC = == LED-TO-CASE LED-to-detector thermal resistance LD LED-TO-DETECTOR THERMAL RESISTANCE θDC = = DETECTOR-TO-CASE detector-to-caseTHERMAL thermalRESISTANCE resistance θDC θCA THERMAL RESISTANCE θCA = = CASE-TO-AMBIENT case-to-ambient thermal resistance *θ WILL DEPEND ON THE BOARD DESIGN AND ∗θCACA will depend on the board design and the placement of the part. THE PLACEMENT OF THE PART. Figure 28a. Thermal Model. HCPL-3150 fig 28 17 For example, given PE = 45 mW, PO = 250 mW, TA = 70°C and θCA = 83°C/W: Thermal Model Dual-Channel (SOIC-16) HCPL-315J Optoisolator θ1 LED 1 θ3 θ2 Definitions θ1, θ2, θ3, θ4, θ5, θ6, θ7, θ8, θ9, θ10: Thermal impedances between nodes as shown in Figure 28b. Ambient Temperature: Measured approximately 1.25 cm above the optocoupler with no forced air. Description This thermal model assumes that a 16-pin dual-channel (SOIC-16) optocoupler is soldered into an 8.5 cm x 8.1 cm printed circuit board (PCB). These optocouplers are hybrid devices with four die: two LEDs and two detectors. The temperature at the LED and the detector of the optocoupler can be calculated by using the equations below. LED 2 θ4 θ5 DETECTOR 1 θ7 DETECTOR 2 θ10 θ8 θ6 θ9 AMBIENT ∆TE1A = A11PE1 + A12PE2+A13PD1+A14PD2 Figure 28b. Thermal Impedance Model for HCPL-315J. ∆TE2A = A21PE1 + A22PE2+A23PD1+A24PD2 HCPL-3150 fig 28b ∆TD1A = A31PE1 + A32PE2+A33PD1+A34PD2 ∆TD2A = A41PE1 + A42PE2+A43PD1+A44PD2 where: ∆TE1A = Temperature difference between ambient and LED 1 ∆TE2A = Temperature difference between ambient and LED 2 ∆TD1A = Temperature difference between ambient and detector 1 ∆TD2A = Temperature difference between ambient and detector 2 PE1 = Power dissipation from LED 1; PE2 = Power dissipation from LED 2; PD1 = Power dissipation from detector 1; PD2 = Power dissipation from detector 2 Axy thermal coefficient (units in °C/W) is a function of thermal impedances θ1 through θ10. PE1 PD1 PE2 PD2 HCPL-3150 fig 28b Thermal Coefficient Data (units in °C/W) Part Number HCPL-315J A11, A22 198 A12, A21 64 A13, A31 62 A24, A42 64 Note: Maximum junction temperature for above part: 125°C. 18 A14, A41 83 A23, A32 90 A33, A44 137 A34, A43 69 LED Drive Circuit Considerations for Ultra High CMR Performance Without a detector shield, the dominant cause of optocoupler CMR failure is capacitive coupling from the input side of the optocoupler, through the package, to the detector IC as shown in Figure 29. The HCPL-3150/315J improves CMR performance by using a detector IC with an optically transparent Faraday shield, which diverts the capaci­tively coupled current away from the sensitive IC circuitry. How ever, this shield does not eliminate the capacitive coupling between the LED and optocoup­ler pins 5-8 as shown in Figure 30. This capacitive coupling causes perturbations in the LED current during common mode transients and becomes the major source of CMR failures for a shielded optocoupler. The main design objective of a high CMR LED drive circuit becomes keeping the LED in the proper state (on or off ) during common mode transients. For example, the recommended application circuit (Figure 25), can achieve 15 kV/µs CMR while minimizing component complexity. Techniques to keep the LED in the proper state are discussed in the next two sections. CMR with the LED On (CMRH) Esw – ENERGY PER SWITCHING CYCLE – µJ A high CMR LED drive circuit must keep the LED on during common mode transients. This is achieved by overdriving the LED current beyond the input threshold so that it is not pulled below the threshold during a transient. A minimum LED cur­rent of 10 mA provides adequate margin over the maximum IFLH of 5 mA to achieve 15 kV/µs CMR. 7 Qg = 100 nC 6 Qg = 250 nC Qg = 500 nC 5 VCC = 19 V VEE = -9 V 4 3 2 1 0 0 20 40 60 80 100 Rg – GATE RESISTANCE – Ω Figure 27. Energy Dissipated in the HCPL-3150 for Each IGBT Switching Cycle. HCPL-3150 fig 27 19 CMR with the LED Off (CMRL) A high CMR LED drive circuit must keep the LED off (VF ≤ VF(OFF)) during common mode transients. For example, during a -dVCM/dt transient in Figure 31, the current flowing through CLEDP also flows through the RSAT and VSAT of the logic gate. As long as the low state voltage developed across the logic gate is less than VF(OFF), the LED will remain off and no common mode failure will occur. The open collector drive circuit, shown in Figure 32, cannot keep the LED off during a +dVCM/dt transient, since all the current flowing through CLEDN must be supplied by the LED, and it is not recommended for applications requiring ultra high CMRL performance. Figure 33 is an alternative drive circuit which, like the recommended application circuit (Figure 25), does achieve ultra high CMR performance by shunting the LED in the off state. Under Voltage Lockout Feature The HCPL-3150/315J contains an under voltage lockout (UVLO) feature that is designed to protect the IGBT under fault conditions which cause the HCPL-3150/315J supply voltage (equivalent to the fully-charged IGBT gate voltage) to drop below a level necessary to keep the IGBT in a low resistance state. When the HCPL-3150/315J output is in the high state and the supply voltage drops below the HCPL-3150/315J VUVLO- threshold (9.5 
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HCPL-315J-000E
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