HDSP-2131, HDSP-2132, HDSP-2133, HDSP-2179
Eight Character 5.0 mm (0.2 inch) Glass/Ceramic
Intelligent 5x7 Alphanumeric Displays
for Military Applications
Data Sheet
Description
The HDSP-2131 (yellow), HDSP-2179 (orange),
HDSP-2132 (high efficiency red) and the HDSP-2133
(green) are eight-digit, 5 x 7 dot matrix, alphanumeric displays. The 5.0 mm (0.2 inch) high characters
are packaged in a standard 7.64 mm (0.30 inch) 32
pin DIP. The on-board CMOS IC has the ability to
decode 128 ASCII characters, which are permanently
stored in ROM. In addition, 16 programmable
symbols may be stored in an on-board RAM. Seven
brightness levels provide versatility in adjusting the
display intensity and power consumption. The
HDSP-213x and HDSP-2179 are designed for standard microprocessor interface techniques. The
display and special features are accessed through a
bidirectional eight-bit data bus. These features
make the HDSP-213x and HDSP-2179 ideally suited
for applications where a hermetic, low power alphanumeric display is required.
Devices
Yellow
HDSP-2131
High
Efficiency
Red
HDSP-2132
High
Performance
Green
HDSP-2133
Orange
HDSP-2179
Features
• Wide operating temperature range -55°C to +85°C
• Smart alphanumeric display
– On-board CMOS IC
– Built-in RAM
– ASCII decoder
– LED drive circuitry
• 128 ASCII character set
• 16 user definable characters
• Programmable features
– Individual character flashing
– Full display blinking
– Multi-level dimming and blanking
– Self test
– Clear function
• Read/write capability
• Full TTL compatibility
• HDSP-2131/-2133/-2179 useable in night vision
lighting applications
• Categorized for luminous intensity
• HDSP-2131/2133 categorized for color
• Excellent ESD protection
• Wave solderable
• X-Y stackable
• RoHS compliant
Package Dimensions
42.72 (1.68)
5.33 TYP.
(0.210)
6.10 REF.
(0.24)
2.67 TYP.
(0.105)
9.91
(0.39)
0.38 TYP.
(0.015)
PIN 17
4.83
(0.190)
4.96
(0.195)
7.62
(0.300)
2.85
(0.112)
PART NUMBER
DATE CODE
LIGHT INTENSITY CATEGORY
COLOR BIN (NOTE 3)
PIN #1
IDENTIFIER
6.35 MAX.
(0.250)
HDSP-XXXX
YYWW
X
1.78 TYP.
(0.070)
Z
SEATING
PLANE
6.00
(0.24)
12.70
(0.50)
2.29 TYP.
(0.090)
0.51 TYP.
(0.020)
1.27 TYP.
(0.050)
2.54 TYP.
(0.100)
NON-ACCUM.
HDSP-213X/2179
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
FUNCTION
CLS
CLK
WR
CE
RST
RD
NO PIN
NO PIN
NO PIN
NO PIN
D0
D1
D2
D3
NC
VDD
PIN #
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
FUNCTION
GND (SUPPLY)
GND (LOGIC)
D4
D5
D6
D7
NO PIN
NO PIN
NO PIN
NO PIN
FL
A0
A1
A2
A3
A4
NOTES:
1. ALL DIMENSIONS ARE IN mm (INCHES).
2. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ± 0.30 mm (0.015 INCH).
3. FOR GREEN AND YELLOW DEVICES ONLY.
4. LEADS ARE COPPER ALLOY, SOLDER DIPPED.
Absolute Maximum Ratings
Supply Voltage, VDD to Ground[1]
Operating Voltage, VDD to Ground[2]
Input Voltage, Any Pin to Ground
Free Air Operating Temperature Range, TA
Storage Temperature, TS
CMOS IC Junction Temperature, TJ (IC)
Soldering Temperature [1.59 mm (0.063 in.) Below Body]
Solder Dipping
Wave Soldering
ESD Protection @ 1.5 kΩ, 100 pF
-0.3 to 7.0 V
5.5 V
-0.3 to VDD +0.3 V
-55°C to +85°C
-55°C to +100°C
+150°C
260°C for 5 secs
250°C for 3 secs
VZ = 4 kV (each pin)
Notes:
1. Maximum voltage is with no LEDs illuminated.
2. 20 dots ON in all locations at full brightness.
ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED WITH THE
HDSP-2131, HDSP-2132, HDSP-2133, AND HDSP-2179.
2
Character Set
D7
D6
0
0
D5
BIT
S
D4
D3 D2
0
0
0
0
D1
D0
COLUMN
ROW
3
0
0
0
0
1
1
0
1
0
0
1
1
0
2
0
1
0
1
3
0
1
0
0
4
0
1
1
1
5
1
X
1
0
6
X
1
7
X
8–F
0000
0
16
0001
1
U
S
E
R
0010
2
0011
3
0100
4
0101
5
0110
6
0111
7
1000
8
1001
9
1010
A
1011
B
1100
C
1101
D
1110
E
1111
F
D
E
F
I
N
E
D
C
H
A
R
A
C
T
E
R
S
Recommended Operating Conditions
Parameter
Supply Voltage
Symbol
VDD
Minimum
4.5
Nominal
5.0
Maximum
5.5
Electrical Characteristics over Operating Temperature Range
4.5 < VDD < 5.5 V (unless otherwise specified)
25°C
Parameter
Symbol
Min.
Typ.[1]
Input Leakage
II
-10.0
(Input without Pullup)
Units
V
25°C
Max.[1]
Max.[2]
+10.0
Units
µA
11
18
30
µA
IDD (BLK)
IDD(V)
0.5
200
1.5
255
2.0
330
mA
mA
IDD(#)
300
370
430
mA
VDD
+0.3
0.8
V
Test Conditions
VIN = 0 to VDD,
pins CLK, D0-D7,
A0-A4
VIN = 0 to VDD,
pins RST, CLS, WR,
RD, CE, FL
VIN = VDD
"V" on in all 8
locations
"#" on in all 8
locations
VDD = 5.5 V
V
VDD = 4.5 V
V
VDD = 4.5 V,
IOH = -40 µA
VDD = 4.5 V,
IOL = 1.6 mA
VDD = 4.5 V,
IOL = 40 µA
Input Current
(Input with Pullup)
IIP
IDD Blank
IDD 8 digits
12 Dots/Character[3]
IDD 8 digits
20 Dots/Character[3]
Input Voltage High
VIH
2.0
Input Voltage Low
VIL
Output Voltage High
VOH
GND
-0.3 V
2.4
Output Voltage Low
D0-D7
Output Voltage Low
CLK
Thermal Resistance
IC Junction-to-PIN
VOL
RqJ-PIN
-30.0
11
0.4
V
0.4
V
°C/W
Notes:
1. VDD = 5.0 V.
2. Maximum IDD occurs at -55°C.
3. Average IDD measured at full brightness. See Table 2 in Control Word Section for IDD at lower brightness levels. Peak IDD = 28/15 x Average IDD (#).
4
Optical Characteristics at 25°C[4]
VDD = 5.0 V at Full Brightness
High Efficiency Red HDSP-2132
Description
Luminous Intensity Character Average (#)
Peak Wavelength
Dominant Wavelength
Symbol
IV
lPEAK
ld
Minimum
2.5
Typical
7.5
635
626
Units
mcd
nm
nm
Orange HDSP-2179
Description
Luminous Intensity Character Average (#)
Peak Wavelength
Dominant Wavelength
Symbol
IV
lPEAK
ld
Minimum
2.5
Typical
7.5
600
602
Units
mcd
nm
nm
Yellow HDSP-2131
Description
Luminous Intensity Character Average (#)
Peak Wavelength
Dominant Wavelength
Symbol
IV
lPEAK
ld
Minimum
2.5
Typical
7.5
583
585
Units
mcd
nm
nm
High Performance Green HDSP-2133
Description
Luminous Intensity Character Average (#)
Peak Wavelength
Dominant Wavelength
Symbol
IV
lPEAK
ld
Minimum
2.5
Typical
7.5
568
574
Units
mcd
nm
nm
Note:
4. Refers to the initial case temperature of the device immediately prior to the light measurement.
5
AC Timing Characteristics over Temperature Range
VDD = 4.5 to 5.5 V unless otherwise specified
Reference
Number
Symbol
Description
1
tACC
Display Access Time
Write
Read
2
tACS
Address Setup Time to Chip Enable
3
tCE
Chip Enable Active Time[2,3]
Write
Read
4
tACH
Address Hold Time to Chip Enable
5
tCER
Chip Enable Recovery Time
6
tCES
Chip Enable Active Prior to Rising Edge of[1,2]
Write
Read
7
tCEH
Chip Enable Hold Time to Rising Edge of
Read/Write Signal[2,3]
8
tW
Write Active Time[2,3]
9
tWD
Data Valid Prior to Rising Edge of Write Signal
10
tDH
Data Write Hold Time
11
tR
Chip Enable Active Prior to Valid Data
12
tRD
Read Active Prior to Valid Data
13
tDF
Read Data Float Delay
–
tRC
Reset Active Time[4]
Min.[1]
Units
210
230
10
ns
ns
140
160
20
60
ns
ns
ns
140
160
ns
0
100
50
20
160
75
10
300
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Worst case values occur at an IC junction temperature of 150°C.
2. For designers who do not need to read from the display, the Read line can be tied to VDD and the Write and Chip Enable lines can be tied together.
3. Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the
logic levels of the WR and RD lines.
4. The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.
6
AC Timing Characteristics Over Temperature Range
VDD = 4.5 V to 5.5 V unless otherwise specified.
Symbol
Description
25°C Typical
FOSC
Oscillator Frequency
57
FRF[5]
Display Refresh Rate
256
FFL[6]
Character Flash Rate
2
tST[7]
Self Test Cycle Time
4.6
Minimum[1]
28
128
1
9.2
Units
kHz
Hz
Hz
Sec
Notes:
5. FRF = FOSC/224.
6. FFL = FOSC/28,672.
7. tST = 262,144/FOSC.
Write Cycle Timing Diagram
1
A0 -A4
FL
4
2
3
CE
6
7
8
WR
10
9
D0 -D7
INPUT PULSE LEVELS: 0.6 V to 2.4 V
7
2
5
Read Cycle Timing Diagram
1
A0 -A4
FL
4
2
2
5
3
CE
6
7
11
RD
12
13
D0 -D7
INPUT PULSE LEVELS: 0.6 V to 2.4 V
OUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V
OUTPUT LOADING = 1 TTL LOAD AND 100 pF
Character Font
Relative Luminous Intensity vs. Temperature
2.85 TYP.
(0.112)
C2
0.76 TYP.
(0.030)
C3
C4
C5
R1
R2
R3
R4
R5
R6
0.254 TYP.
(0.010)
R7
8
3.5
HDSP-2132 (HER) -2179 (ORANGE)
HDSP-2131 (YELLOW)
HDSP-2133 (GREEN)
3.0
2.5
2.0
1.5
1.0
0.5
0
-55
0.65 TYP.
(0.026)
NOTE: NOT TO SCALE
4.83 TYP.
(0.190)
RELATIVE LUMINOUS INTENSITY
(NORMALIZED TO 1 AT 25°C)
C1
4.0
-35
-15
5
25
45
65
85
TA – AMBIENT TEMPERATURE – °C
105
Electrical Description
Pin Function
Description
RESET (RST, Pin 5)
Reset initializes the display.
FLASH (FL, Pin 27)
FL low indicates an access to the Flash RAM and is unaffected by the
state of address lines A3-A4.
ADDRESS INPUTS
(A0-A4, Pins 28-32)
Each location in memory has a distinct address. Address inputs (A0-A2)
select a specific location in the Character RAM, the Flash RAM or a
particular row in the UDC (User-Defined Character) RAM. A3-A4 are used to
select which section of memory is accessed. Table 1 shows the logic levels
needed to access each section of memory.
Table 1. Logic Levels to Access Memory
FL A4 A3 Section of Memory
A2 A1 A 0
0 X
X Flash RAM
Character Address
1 0
0 UDC Address Register Don't Care
1 0
1 UDC RAM
Row Address
1 1
0 Control Word Register Don't Care
1 1
1 Character RAM
Character Address
CLOCK SELECT
(CLS, Pin 1)
This input is used to select either an internal (CLS = 1) or external
(CLS = 0) clock source.
CLOCK INPUT/OUTPUT
(CLK, Pin 2)
Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave
displays.
WRITE (WR, Pin 3)
Data is written into the display when the WR input is low and the CE input
is low.
CHIP ENABLE (CE, Pin 4)
This input must be at a logic low to read or write data to the display and
must go high between each read and write cycle.
READ (RD, Pin 6)
Data is read from the display when the RD input is low and the CE
input is low.
DATA Bus (D0-D7,
Pins 11-14, 19-22)
The Data bus is used to read from or write to the display.
GND(SUPPLY) (Pin 17)
This is the analog ground for the LED drivers.
GND(LOGIC) (Pin 18)
This is the digital ground for internal logic.
VDD(POWER) (Pin 16)
This is the positive power supply input.
9
10
CLS
CLK
RST
RD
WR
D0-D7
A0-A2
A3
A4
FL
CE
OCS
A3
A4
FL
CE
A3
A4
FL
CE
UDC
ADDR
CLR1
RESET
A3
A4
FL
CE
INTENSITY
FLASH
BLINK
RESET
CLOCK
FLASH
TEST OK
CLR2
TIMING
AND
CONTROL
TEST OK
SELF TEST
SELF
TEST
IN
VISUAL
TEST
ROM
TEST
SELF
TEST
CLR
START
TIMING
ROW SET
CHAR
ADDR
EN
FLASH
RD
DATA
WR
FLASH
D0
RAM
A0-A2
RESET
CHAR ADDR
8x8
EN CHARACTER
RD
D0-D6
RAM
WR
D7
D0-D7
A0-A2
RESET
CHAR ADDR
Figure 1. HDSP-213x/-2179 internal block diagram.
CONTROL WORD
REGISTER
EN
0
INTENSITY
RD
1
WR
2
FLASH
D0-D7
3
BLINK
4
RESET
SELF TEST
6
SELF TEST
7
RESULT
FL
CE
A3
A4
FL
CE
PRE SET
CLR
RD
WR
D0-D7
EN
UDC ADDR REGISTER
UDC RAM
ROW
SEL
SELF
TEST
D0-D6
DOT
DATA
DECODER(*)
EN
EN
RD
WR
DOT
D0-D4
A0-A2 DATA
UDC ADDR
ROW SET
EN
D0-D4
TIMING
DOT
DRIVERS
DOT
DATA
TIMING
ROW DRIVERS
8 5x7
LED
CHARACTERS
Display Internal Block Diagram
Figure 1 shows the internal block
diagram of the HDSP-213x/-2179
display. The CMOS IC consists of
an 8 byte Character RAM, an 8
bit Flash RAM, a 128 character
Character RAM
Flash RAM
User-Defined Character RAM
(UDC RAM)
User-Defined Character
Address Register
(UDC Address Register)
Control Word Register
eight 5 x 7 dot matrix
characters. The major user
accessible portions of the display are listed below:
ASCII decoder, a 16 character
UDC RAM, a UDC Address
Register, a Control Word
Register, and the refresh
circuitry necessary to synchronize the decoding and driving of
This RAM stores either ASCII character data or a UDC RAM address.
This is a 1 x 8 RAM which stores Flash data.
This RAM stores the dot pattern for custom characters.
This register is used to provide the address to the UDC RAM when the user is writing or
reading a custom character.
This register allows the user to adjust the display brightness, flash individual
characters, blink, self test, or clear the display.
Character Ram
Figure 2 shows the logic levels
needed to access the HDSP-213x/
-2179 Character RAM. During a
normal access the CE = “0” and
either RD = “0” or WR = “0”.
However, erroneous data may be
written into the Character RAM if
the Address lines are unstable
when CE = “0” regardless of the
logic levels of the RD or WR lines.
Address lines A0-A2 are used to
select the location in the Character RAM. Two types of data can be
stored in each Character RAM
location: an ASCII code or a UDC
RAM address. Data bit D7 is used
to differentiate between an ASCII
character and a UDC RAM
address. D7 = 0 enables the ASCII
decoder and D7 = 1 enables the
UDC RAM. D0-D6 are used to
input ASCII data and D0-D3 are
used to input a UDC address.
RST
CE
1
0
WR
0
0
1
1
RD
0
1
0
1
UNDEFINED
WRITE TO DISPLAY
READ FROM DISPLAY
UNDEFINED
CONTROL SIGNALS
FL
1
A4
1
A3
1
A2
A1
A0
000 = LEFT MOST
111 = RIGHT MOST
CHARACTER
ADDRESS
CHARACTER RAM ADDRESS
D7
D6
D5
0
D4
D3
D2
D1
D0
128 ASCII CODE
1
X
X
X
UDC CODE
CHARACTER RAM DATA FORMAT
DIG0
DIG1
DIG2
DIG3
DIG4
DIG5
DIG6
DIG7
000
001
010
011
100
101
110
111
SYMBOL IS ACCESSED IN LOCATION
SPECIFIED BY THE CHARACTER ADDRESS ABOVE
DISPLAY
0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE
Figure 2. Logic levels to access the character RAM.
11
UDC RAM and UDC Address Register
Figure 3 shows the logic levels
needed to access the UDC RAM
and the UDC Address Register.
The UDC Address Register is eight
bits wide. The lower four bits (D0D3) are used to select one of the
16 UDC locations. The upper four
bits (D4-D7) are not used. Once
the UDC address has been stored
in the UDC Address Register, the
UDC RAM can be accessed.
To completely specify a 5 x 7
character requires eight write
cycles. One cycle is used to store
the UDC RAM address in the UDC
Address Register. Seven cycles
are used to store dot data in the
UDC RAM. Data is entered by
rows. One cycle is needed to
access each row. Figure 4 shows
the organization of a UDC
character assuming the symbol to
be stored is an “F.” A0-A2 are used
to select the row to be accessed
and D0-D4 are used to transmit
the row dot data. The upper three
bits (D5-D7) are ignored. D0 (least
significant bit) corresponds to the
right most column of the 5 x 7
matrix and D4 (most significant
bit) corresponds to the left most
column of the 5 x 7 matrix.
Flash RAM
Figure 5 shows the logic levels
needed to access the Flash RAM.
The Flash RAM has one bit
associated with each location of
the Character RAM. The Flash
input is used to select the Flash
RAM. Address lines A3-A4 are
ignored. Address lines A0-A2 are
used to select the location in the
Flash RAM to store the attribute.
D0 is used to store or remove the
flash attribute. D0 = “1” stores the
attribute and D0 = “0” removes the
attribute.
When the attribute is enabled
through bit 3 of the Control Word
and a "1" is stored in the Flash
RAM, the corresponding character
12
RST
CE
1
0
WR
0
0
1
1
RD
0
1
0
1
UNDEFINED
WRITE TO DISPLAY
READ FROM DISPLAY
UNDEFINED
CONTROL SIGNALS
FL
A4
A3
A2
A1
A0
1
0
0
X
X
X
UDC ADDRESS REGISTER ADDRESS
D7
D6
D5
D4
X
X
X
X
D3
D2
D1
D0
UDC CODE
UDC ADDRESS REGISTER DATA FORMAT
RST
CE
1
0
WR
0
0
1
1
RD
0
1
0
1
UNDEFINED
WRITE TO DISPLAY
READ FROM DISPLAY
UNDEFINED
CONTROL SIGNALS
FL
A4
A3
1
0
1
A2
A1
A0
ROW SELECT
000 = ROW 1
110 = ROW 7
UDC RAM ADDRESS
D7
D6
D5
X
X
X
D4
D3
D2
D1
D0
DOT DATA
UDC RAM
DATA FORMAT
C
O
L
1
0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE
C
O
L
5
Figure 3. Logic levels to access a UDC character.
C C C
O O O
L L L
1 2 3
D4 D3 D2
1 1 1
1 0 0
1 0 0
1 1 1
1 0 0
1 0 0
1 0 0
IGNORED
C
O
L
4
D1
1
0
0
1
0
0
0
C
O
L
5
D0
1
0
0
0
0
0
0
ROW 1
ROW 2
ROW 3
ROW 4
ROW 5
ROW 6
ROW 7
UDC CHARACTER
• • • • •
•
•
• • • •
•
•
•
HEX CODE
1F
10
10
1D
10
10
10
0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LED
Figure 4. Data to load “F” into the UDC RAM.
will flash at approximately 2 Hz.
The actual rate is dependent on
the clock frequency. For an
external clock the flash rate can
be calculated by dividing the clock
frequency by 28,672.
RST
1
CE
0
WR
0
0
1
1
RD
0
1
0
1
RST
UNDEFINED
WRITE TO DISPLAY
READ FROM DISPLAY
UNDEFINED
1
CONTROL SIGNALS
FL
0
A4
X
A3
X
D6
A2
A1
A0
000 = LEFT MOST
111 = RIGHT MOST
CHARACTER
ADDRESS
X
X
D5
X
0
WR
0
0
1
1
UNDEFINED
WRITE TO DISPLAY
READ FROM DISPLAY
UNDEFINED
FL
A4
A3
A2
A1
A0
1
1
0
X
X
X
CONTROL WORD ADDRESS
D4
X
D3
X
D2
X
D1
D0
X
0
1
FLASH RAM DATA FORMAT
REMOVE FLASH AT
SPECIFIED DIGIT LOCATION
STORE FLASH AT
SPECIFIED DIGIT LOCATION
D7
D6
D5
D4
D3
D2
D1
D0
C
S
S
BL
F
B
B
B
0
0
0
0
0
1
0
1
1
0
1
0
1
1
1
1
0 DISABLE FLASH
1 ENABLE FLASH
0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE
Figure 5. Logic levels to access the flash RAM.
Control Word Register
Figure 6 shows how to access the
Control Word Register. This is an
eight bit register which performs
five functions. They are Brightness control, Flash RAM control,
Blinking, Self Test and Clear.
Each function is independent of
the others. However, all bits are
updated during each Control
Word write cycle.
Brightness (Bits 0-2)
Bits 0-2 of the Control Word
adjust the brightness of the
display. Bits 0-2 are interpreted
as a three bit binary code with
code (000) corresponding to
maximum brightness and code
(111) corresponding to a blanked
display. In addition to varying the
display brightness, bits 0-2 also
vary the average value of IDD. IDD
can be calculated at any brightness level by multiplying the
percent bright-ness level by the
value of IDD at the 100%
brightness level. These values of
IDD are shown in Table 2.
Flash Function (Bit 3)
Bit 3 determines whether the
flashing character attribute is on
or off. When bit 3 is a “1,” the
output of the Flash RAM is
checked. If the content of a location in the Flash RAM is a “1,” the
associated digit will flash at
13
RD
0
1
0
1
CONTROL SIGNALS
FLASH RAM ADDRESS
D7
CE
0
1
0
1
0
1
0
1
100%
80%
53% BRIGHTNESS
40% CONTROL
27% LEVELS
20%
13%
0%
0 DISABLE BLINKING
1 ENABLE BLINKING
0
1
X NORMAL OPERATION; X IS IGNORED
X START SELF TEST; RESULT GIVEN IN X
X = 0 FAILED X = 1 PASSED
0 NORMAL OPERATION
1 CLEAR FLASH AND CHARACTER RAMS
CONTROL WORD DATA FORMAT
0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE
Figure 6. Logic levels to access the control word register.
Table 2. Current Requirements at Different Brightness Levels
Symbol
IDD (V)
D2
0
0
0
0
1
1
1
D1
0
0
1
1
0
0
1
D0
0
1
0
1
0
1
0
approximately 2 Hz. For an
external clock, the blink rate can
be calculated by driving the clock
frequency by 28,672. If the flash
enable bit of the Control Word is a
“0,” the content of the Flash RAM
is ignored. To use this function
with multiple display systems see
the Reset section.
Blink Function (Bit 4)
Bit 4 of the Control Word is used
to synchronize blinking of all eight
% Brightness
100
80
53
40
27
20
13
25°C Typ.
200
160
106
80
54
40
26
Units
mA
mA
mA
mA
mA
mA
mA
digits of the display. When this bit
is a “1” all eight digits of the
display will blink at approximately 2 Hz. The actual rate is
dependent on the clock frequency.
For an external clock, the blink
rate can be calculated by dividing
the clock frequency by 28,672.
This function will override the
Flash function when it is active.
To use this function with multiple
display systems see the Reset
section.
Setting bit 6 to a logic 1 will start
the self test function. The built-in
self test function of the IC consists
of two internal routines which
exercises major portions of the IC
and illuminates all of the LEDs.
The first routine cycles the ASCII
decoder ROM through all states
and performs a checksum on the
output. If the checksum agrees
with the correct value, bit 5 is set
to “1.” The second routine
provides a visual test of the LEDs
using the drive circuitry. This is
accomplished by writing
checkered and inverse checkered
patterns to the display. Each
pattern is displayed for approximately 2 seconds.
During the self test function the
display must not be accessed. The
time needed to execute the self
test function is calculated by
multiplying the clock period by
262,144. For example, assume a
clock frequency of 58 KHz, then
the time to execute the self test
function frequency is equal to
(262,144/58,000) = 4.5 second
duration.
At the end of the self test function,
the Character RAM is loaded with
blanks, the Control Word Register
is set to zeros except for bit 5, and
the Flash RAM is cleared and the
UDC Address Register is set to all
ones.
Clear Function (Bit 7)
Bit 7 of the Control Word will
clear the Character RAM and the
Flash RAM. Setting bit 7 to a "1"
will start the clear function. Three
14
clock cycles (110 µs min. using the
internal refresh clock) are
required to complete the clear
function. The display must not be
accessed while the display is being
cleared. When the clear function
has been completed, bit 7 will be
reset to a “0.” The ASCII character
code for a space (20H) will be
loaded into the Character RAM to
blank the display and the Flash
RAM will be loaded with “0”s. The
UDC RAM, UDC Address Register,
and the remainder of the Control
Word are unaffected.
Display Reset
Figure 7 shows the logic levels
needed to Reset the display. The
display should be Reset on Powerup. The external Reset clears the
Character RAM, Flash RAM,
Control Word and resets the
internal counters. After the rising
edge of the Reset signal, three
clock cycles (110 µs min. using the
internal refresh clock) are
required to complete the reset
sequence. The display must not be
accessed while the display is being
reset. The ASCII Character code
for a space (20H) will be loaded
into the Character RAM to blank
the display. The Flash RAM and
Control Word Register are loaded
with all "0"s. The UDC RAM and
UDC Address Register are unaffected. All displays which
operate with the same clock
source must be simultaneously
reset to synchronize the Flashing
and Blinking functions.
RST
CE
WR
RD
FL
0
1
X
X
X
A4 -A0 D7 -D0
X
X
0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE
NOTE:
IF RST, CE, AND WR ARE LOW, UNKNOWN
DATA MAY BE WRITTEN INTO THE DISPLAY.
Figure 7. Logic levels to reset the display.
Mechanical and Electrical
Considerations
The HDSP-213x/-2179 is a 32 pin
dual-in-line package with 24
external pins, which can be
stacked horizontally and vertically to create arrays of any size.
The HDSP-213x/-2179 is designed
to operate continuously from
-55°C to +85°C with a maximum
of 20 dots ON per character.
Illuminating all thirty-five dots at
full brightness is not
recommended.
The HDSP-213x/-2179 is
assembled by die attaching and
wire bonding 280 LED chips and a
CMOS IC to a ceramic sub-strate.
A glass window is placed over the
ceramic substrate creating an air
gap over the LED wire bonds. A
second glass window creates an
air gap over the CMOS IC. This
package construction makes the
display highly tolerant to temperature cycling and allows wave
soldering and visual inspection of
the IC.
The inputs to the CMOS IC are
protected against static discharge
and input current latchup. However, for best results standard
CMOS handling precautions
should be used. Prior to use, the
HDSP-213X should be stored in
4.0
PD – POWER DISSIPATION – W
Self Test Function (Bits 5, 6)
Bit 6 of the Control Word Register
is used to initiate the self test
function. Results of the internal
self test are stored in bit 5 of the
Control Word. Bit 5 is a read only
bit where bit 5 = “1” indicates a
passed self test and bit 5 = “0”
indicates a failed self test.
3.0
2.0
RqJ-A = 30°C/W
1.0
0
25
35
45
55
65
75
85
95
TA – AMBIENT TEMPERATURE – °C
Figure 8. Maximum power dissipation vs.
ambient temperature derating based on
TJMAX = 125°C.
105
antistatic packages or conductive
material. During assembly, a
grounded conductive work area
should be used, and assembly
personnel should wear conductive
wrist straps. Lab coats made of
synthetic material should be
avoided since they are prone to
static charge buildup. Input
current latchup is caused when
the CMOS inputs are subjected to
either a voltage below ground
(VIN < ground) or to a voltage
higher than VDD (VIN > VDD) and
when a high current is forced into
the input. To prevent input current latchup and ESD damage,
unused inputs should be connected either to ground or to VDD.
Voltages should not be applied to
the inputs until VDD has been
applied to the display. Transient
input voltages should be eliminated.
Thermal Considerations
The HDSP-213x/-2179 has been
designed to provide a low thermal
resistance path from the CMOS IC
to the 24 package pins. This heat is
then typically conducted through
the traces of the user’s printed
circuit board to free air. For most
applications no additional
heatsinking is required.
The maximum operating IC
junction temperature is 150°C.
The maximum IC junction temperature can be calculated using
the following equation:
The logic ground should be connected to the same ground potential as the logic interface circuitry.
The analog ground and the logic
ground should be connected at a
common ground which can
withstand the current introduced
by the switching LED drivers.
When separate ground connections are used, the analog ground
can vary from -0.3 V to +0.3 V
with respect to the logic ground.
Voltage below -0.3 V can cause all
dots to be on. Voltage above +0.3
V can cause dimming and dot
mismatch.
IDDMAX = 370 mA with 20 dots
ON in eight character locations at
25°C ambient. This value is from
the Electrical Characteristics
table.
For further information on
soldering and post solder
cleaning, see Application Note
1027, Soldering LED Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE – °C
PDMAX = (VDDMAX) (IDDMAX)
Proper handling is imperative to
avoid excessive thermal stresses
to component when heated.
Therefore, the solder PCB must be
allowed to cool to room
temperature, 25°C, before
handling.
ESD Susceptibility
These displays have ESD susceptibility ratings of CLASS 3 per
DOD-STD-1686 and CLASS B per
MIL-STD-883C.
TJ(IC) MAX = TA
+ (PDMAX) (RqJ-PIN + RqPIN-A)
Where
Soldering and Post Solder
Cleaning Instructions for the
HDSP-213x/-2179
The HDSP-213x/-2179 may be
hand soldered or wave soldered
with lead-free solder. When hand
soldering it is recommended that
an electronically temperature controlled and securely grounded
soldering iron be used. For best
results, the iron tip temperature
should be set at 315°C (600°F).
For wave soldering, a rosin-based
RMA flux can be used. The solder
wave temperature should be set at
245°C ± 5°C (473°F ± 9°F), and
dwell in the wave should be set
between 11/2 to 3 seconds for
optimum soldering. The preheat
temperature should not exceed
105°C (221°F) as measured on
the solder side of the PC board.
Ground Connections
Two ground pins are provided to
keep the internal IC logic ground
clean. The designer can, when
necessary, route the analog
ground for the LED drivers separately from the logic ground until
an appropriate ground plane is
available. On long interconnects
between the display and the host
system, the designer can keep
voltage drops on the analog
ground from affecting the display
logic levels by isolating the two
grounds.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
150
FLUXING
100
50
30
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
PDMAX = (5.5 V) (0.370 A)
= 2.04 W
15
Figure 9. Recommended wave soldering profile for lead-free Smart Display.
Contrast Enhancement
When used with the proper contrast enhancement filters, the
HCMS-213x/-2179 series displays
are readable daylight ambients.
Refer to Application Note 1029
Luminous Contrast and Sunlight
Readability of the HDSP-235x
Series Alphanumeric Displays
for Military Applications for
information on contrast enhancement for daylight ambients.
Refer to Application Note 1015
Contrast Enhancement Techniques
for LED Displays for information
on contrast enhancement in
moderate ambients.
Intensity Bin Limits
Intensity Range (mcd)
Bin
Min.
Max.
G
2.50
4.00
H
3.41
6.01
I
5.12
9.01
J
7.68
13.52
K
11.52
20.28
Color Bin Limits
Color
Green
Yellow
Note: Test conditions as specified in Optical
Characteristic table.
Note: Test conditions as specified in Optical
Characteristic table.
Night Vision Lighting
When used with the proper NVG/
DV filters, the HDSP-2131, HDSP2179 and HDSP-2133 may be used
in night vision lighting applications. The HDSP-2131 (yellow),
HDSP-2179 (orange) displays are
used as master caution and
warning indicators. The HDSP2133 (high per-formance green)
displays are used for general
instrumenta-tion. For a list of
NVG/DV filters and a discussion
on night vision lighting technology, refer to Application Note
1030 LED Displays and Indicators
and Night Vision Imaging System
Lighting. An external dimming
circuit must be used to dim these
displays to night vision lighting
levels to meet NVIS radiance
requirements. Refer to AN 1039
Dimming HDSP-213x Displays to
Meet Night Vision Lighting Levels.
For product information and a complete list of distributors, please go to our website:
Bin
1
2
3
4
3
4
5
6
Color Range (nm)
Min.
Max.
576.0
580.0
573.0
577.0
570.0
574.0
567.0
571.5
581.5
585.0
584.0
587.5
586.5
590.0
589.0
592.5
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Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3182EN
AV02-0190EN March 6, 2007
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