HFBR-0500ETZ Series
Versatile Link
The Versatile Fiber Optic Connection
Data Sheet
Description
Features
The Versatile Link series is a complete family of fiber
optic link components for applications requiring a low
cost solution. The HFBR-0500ETZ series includes trans
mitters, receivers, connectors and cable specified for
easy design. This series of components is ideal for
solving problems with voltage isolation/insulation,
EMI/RFI immunity or data security. The optical link
design is simplified by the logic compatible receivers
and complete specifi-cations for each component. The
key optical and electrical parameters of links configured
with the HFBR-0500ETZ family are fully guaranteed from
-40° to 85° C.
• Extended temperature range -40 to +85° C
• RoHS-compliant
• Low cost fiber optic components
• Enhanced digital links: dc-5 MBd
• Link distance up to 43m at 1MBd and 20m at 5MBd
• Low current link: 6 mA peak supply current
• Horizontal and vertical mounting
• Interlocking feature
• High noise immunity
• Easy connectoring: simplex, duplex, and latching
connectors
• Flame retardant
• Transmitters incorporate a 660 nm red LED for easy
visibility
• Compatible with standard TTL circuitry
A wide variety of package configurations and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver components have been designed for use in high
volume/low cost assembly processes such as auto insertion and wave soldering.
Transmitters incorporate a 660 nm LED. Receivers
include a monolithic dc coupled, digital IC receiver
with open collector Schottky output transistor. An
internal pullup resistor is availa ble for use in the
HFBR-25X1ETZ and HFBR-25X2ETZ receivers. A shield has
been integrated into the receiver IC to provide additional,
localized noise immunity.
Internal optics have been optimized for use with 1 mm
diameter plastic optical fiber. Versatile Link specifications
incorporate all connector interface losses. Therefore,
optical calculations for common link applications are
simplified.
Applications
• Industrial Drives/Frequency Inverters
• Renewable Energies (Wind Turbines, Solar PV farms)
Power electronics
• Reduction of lightning/voltage transient susceptibility
• Motor controller triggering
• Data communications and local area networks
• Electromagnetic Compatibility (EMC) for regulated
systems: FCC, VDE, CSA, etc.
• Tempest-secure data processing equipment
• Isolation in test and measurement instruments
• Error free signalling for industrial and manufacturing
equipment
• Automotive communications and control networks
• Noise immune communication in audio and video
equipment
HFBR-0500ETZ Series Part Number Guide
HFBR-X5XXETZ
1 = Transmitter
2 = Receiver
5 = 660 nm Transmitter and
Receiver Products
2 = Horizontal Package
3 = Vertical Package
4 = 30° Tilted Package
ET = extended temperature range
Z = RoHS compliant
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
6 = 155 MBd Receiver
7 = 155 MBd Transmitter
Available option – Horizontal Package
HFBR-x521ETZ
HFBR-x522ETZ
Available option – Vertical Package
HFBR-x531ETZ
HFBR-x532ETZ
Available option – 30° Tilted Package
HFBR-x541ETZ
HFBR-x542ETZ
Link Selection Guide
(Links specified from -40° to 85° C, for plastic optical fiber unless specified.)
Signal Rate
Distance (m) 25° C
Distance (m)
Transmitter
Receiver
1 MBd
67
43
HFBR-15x2ETZ
HFBR-25x2ETZ
5 Mbd
38
20
HFBR-15x1ETZ
HFBR-25x1ETZ
2
Application Literature
Handling
Application Note 1035 (Versatile Link)
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link components, the optical port plug should be left in to prevent
contamination of the port. Do not use reflow solder
processes (i.e., infrared reflow or vapor-phase reflow).
Nonhalogenated water soluble fluxes (i.e., 0% chloride),
not rosin based fluxes, are recommended for use with
Versatile Link components.
Package and Handling Information
The compact Versatile Link package is made of a flame
retardant VALOX® UL 94 V-0 material (UL file # E121562)
and uses the same pad layout as a standard, eight pin
dual-in-line package. Vertical and horizontal mountable
parts are available. These low profile Versatile Link packages are stackable and are enclosed to provide a dust
resistant seal. Snap action simplex, simplex latching,
duplex, and duplex latching connectors are offered with
simplex or duplex cables.
Package Orientation
Performance and pinouts for the vertical and horizontal packages are identical. To provide additional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a selftapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connections. Receivers are blue and transmitters are gray.
VALOX is a registered trademark of the General Electric Corporation.
3
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period of
time, they may require a baking step before the solder
ing process. Refer to the special labeling on the shipping
tube for details.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
Mechanical Dimensions
Vertical Modules
2
[0.08]
Horizontal Modules
3.6
[0.14]
5.1
[0.20]
10.2
[0.40]
6.5
[0.26]
10.2
[0.40]
1
[0.04]
18.8
[0.74]
18.1
[0.71]
5.1
[0.20]
6.5
[0.26]
7.6
[0.30]
4.2
[0.17]
18.9
[0.75]
0.6
[0.02]
2.54
[0.100]
2.8 [0.11] MIN
.6
∅ 0 3]
0.0
[∅
0.5
[0.02]
3.3 [0.13] MAX
3.6[0.14]MIN.
7.7
[0.30]
1.7
[0.07]
1.3
[0.05]
3.8[0.15]MAX.
0.6
[0.03]
7.6
[0.30]
2
[0.08]
NOTES:
1) Dimensions: mm [in]
1.3
[0.05]
0.5
[0.02]
7.62
[0.300]
2.54
[0.100]
∅
3.8
[0.15]
1.7
[0.07]
2.8
[0.11]
NOTES:
1) Dimensions: mm [in]
2) Optional mounting hole for #2 self-tapping-screw
2)
(metric equivalent M2.2 x 0.45)
3.8
[0.15]
2
[0.08]
30° Tilted Modules
6.5
[0.26]
10.2
[0.40]
A
30°
0.4
[0.02]
2.54
[0.100]
0.5
[0.02]
1.3
[0.05]
0.7
[0.03]
4.6
[0.18]
4.6
[0.18]
0.6
[0.03]
6.6
[0.26]
15.2
[0.60]
.7
18 4]
7
[0.
A
1.1
[0.05]
8.7
[0.34]
10.1
[0.40]
7.62
[0.300]
2.2
[0.09]
NOTES:
1) Dimensions: mm [in]
19.3
[0.76]
4
0.6 3]
0
0.
[∅
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Vertical Module
7.62
[0.300]
7.62
[0.300]
2.54
[0.100]
2.54
[0.100]
∅1
[∅
2
[∅
1
7.7
[0.30]
3
4]
4]
2.25 [0.09] clearance hole
for optional vertical mount
self-tapping-screw #2
3.8
[0.15]
8
5
∅1
0.0
4
5
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
7.62
[0.300]
2.54
[0.100]
∅1
.04]
1
8.7
[0.34]
2
5
8
PCB EDGE
2.2 MIN.
[0.09]
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
5
8
1.7
[0.07] MIN.
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
30° Tilted Modules
3
1
PCB EDGE
3.8
[0.15]
4
2
PCB EDGE
1.9 MIN.
[0.07]
[∅0
3
7.62
[0.300]
4
0.0
Interlocked (Stacked) Assemblies (refer to Figure 1)
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the interlocking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated
stacking and unstacking causes no damage to individual
units.
Stacking Horizontal Modules
Stacking Vertical Modules
Stacking 30° Tilted Modules
Figure 1. Interlocked (stacked) horizontal, vertical or 30° tilted packages
6
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
5 MBd Link (HFBR-15X1ETZ/25X1ETZ)
System Performance -40 ° to 85 °C, unless otherwise specified.
Parameter
Symbol Min. Typ. Max. Units Conditions
Ref.
Data Rate
dc
Link Distance
d
17
m
IFdc = 60 mA
(Standard Cable)
33
m
IFdc = 60 mA, 25° C
Link Distance
d
20
m
IFdc = 60 mA
(Improved Cable)
38
m
IFdc = 60 mA, 25° C
Propagation tPLH
Delay
tPHL
5
MBd
BER ≤10-9, PRBS:27-1
High
Performance
5 MBd
Notes 3, 4
Notes 3, 4
90 140 ns RL = 560 Ω, CL = 30 pF
Fig. 3, 6
50
Notes 1, 2, 4
140
ns
fiber length = 0.5 m
-21.6 ≤PR ≤-9.5 dBm
tD 40
ns PR = -15 dBm
Pulse Width
RL = 560 Ω, CL = 30 pF
Distortion tPLH-tPHL
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at PR = -15 dBm.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
4. Optical link performance is guaranteed only with transmitter HFBR-15x1ETZ and receiver HFBR-25x1ETZ.
Figure 2. Typical 5 MBd interface circuit
Figure 3. 5 MBd propagation delay test circuit
7
Fig. 3, 5
Note 4
Figure 4. Propagation delay test waveforms
100
60
50
40
30
20
X5X1ETZ -40° C
X5X1ETZ 25° C
X5X1ETZ 85° C
10
0
-27
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 5. Typical link pulse width distortion vs. optical power
8
tP - PROPAGATION DELAY - ns
tD - PULSE WIDTH DISTORTION - ns
70
-9
-6
80
60
40
20
0
-27
tPLH X5X1ETZ
tPHL X5X1ETZ
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 6. Typical link propagation delay vs. optical power
-9
-6
HFBR-15X1ETZ Transmitter
Pin #
Function
1
1
Anode
2
2
Cathode
GROUND
3
3
Ground
4
4
Ground
GROUND
5
Ground
8
Ground
8 GROUND
ANODE
CATHODE
5 GROUND
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Absolute Maximum Ratings
Parameter
Symbol Min. Max. Units Reference
Storage Temperature
Operating Temperature
TS
–40
TA
–40 +85 °C
Lead Soldering Cycle
Temp.
Time
+85
260
°C
°C
10
sec
1000
mA
Forward Input Current
IFPK
IFdc 80
Reverse Input Voltage
VBR
5
Note 1, 4
Note 2, 3
V
Notes:
1. 1.6 mm below seating plane.
2. Recommended operating range between 10 and 750 mA.
3. 1 µs pulse, 20 µs period.
4. Moisture sensitivity level is MSL-3
All HFBR-15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your local Avago sales
representative for more information.
9
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise specified.
Symbol Min. Typ.[5]
Parameter
Transmitter Output
PT
Optical Power
Output Optical Power
Max.
Units Conditions
-16.8
-7.1 dBm IFdc = 60 mA
-14.3
-8.0
dBm
Ref.
Notes 1, 2
IFdc = 60 mA, 25° C
∆PT /∆T -0.85 %/°C
Temperature Coefficient
λPK 660 nm
Peak Emission
Wavelength
Forward Voltage
Forward Voltage
VF
1.43 1.67 2.05 V IFdc = 60 mA
∆VF /∆T
-1.37
D
1
mV/°C
Fig. 7
Temperature Coefficient
Effective Diameter
Reverse Input Breakdown
VBR
mm
5.0 11.0
V IFdc = 10 µA,
Voltage
TA = 25° C
Diode Capacitance
CO
86
pF VF = 0, f = MHz
Rise Time
tr
20
ns
Fall Time
tf 20 ns
Notes:
10% to 90%,
IF = 60 mA
Note 3
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Optical power, P (dBm) = 10 Log [P(µW)/1000 µW].
3. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50 Ω input of a wide bandwidth oscilloscope, is used for this response time measurement.
5
PT - NORMALIZED OUTPUT POWER - dB
1.8
VF - VORWARD VOLTAGE - V
1.75
1.7
1.65
1.6
1.55
1.5
-40° C
25° C
85° C
1.45
1.4
1
10
IFdc - TRANSMITTER DRIVE CURRENT (mA)
Figure 7. Typical forward voltage vs. drive current
10
100
0
-5
-10
-40° C
25° C
85° C
-15
-20
1
10
IFdc - TRANSMITTER DRIVE CURRENT (mA)
Figure 8. Normalized typical output power vs. drive current
100
HFBR-25X1ETZ Receiver
DO NOT CONNECT
4
3
2
1
DO NOT CONNECT
Function
1
VO
RL
2
Ground
VCC
3
VCC
GROUND
4
RL
VO
5
Ground
8
Ground
5
1000 Ω
Pin #
8
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Absolute Maximum Ratings
Parameter
Symbol Min. Max. Units Reference
Storage Temperature
Operating Temperature
Lead Soldering Cycle
TS
–40
+85
TA
–40
+85
°C
260
° C
10
sec
Temp.
Time
–0.5
7
°C
V
Note 1, 3
Supply Voltage
VCC
Note 2
Output Collector Current
IOAV 25 mA
Output Collector Power Dissipation
POD 40 mW
Output Voltage
VO –0.5 18 V
Pull-up Voltage
VP –5 VCC V
Fan Out (TTL)
N
5
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 µF be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤VCC ≤5.25 V, unless otherwise specified.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Ref.
Input Optical Power
PR(L) –21.6
–9.5 dBm VOL = 0.5 V
Notes 1,
Level for Logic “0”
IOL = 8 mA
2, 4, 5
–21.6
–8.7
VOL = 0.5 V
IOL = 8 mA, 25° C
Input Optical Power
PR(H)
–43 dBm VOL = 5.25 V
Notes 1, 5
Level for Logic “1”
IOH ≤250 µA
High Level Output Current
IOH 5 250
µA VO = 18 V, PR = 0
Notes 3, 5
Low Level Output Voltage
VOL 0.4 0.5 V IOL = 8 mA,
Notes 3, 5
PR = PR(L)MIN
High Level Supply
ICCH
3.5 6.3 mA VCC = 5.25 V,
Notes 3, 5
Current
PR = 0
Low Level Supply Current
ICCL
6.2 10 mA VCC = 5.25 V
Notes 3, 5
PR = -12.5 dBm
Effective Diameter
D 1
mm
Internal Pull-up Resistor
RL 680 1000 1700 Ω
Notes:
1. Optical flux, P (dBm) = 10 Log [P (µW)/1000 µW].
2. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
3. RL is open.
4. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse
width distortion of the receiver output signal.
5. Guaranteed only if optical input signal to the receiver is generated by HFBR-15x1ETZ, with ideal alignment to photo diode using 1mm POF
(NA=0.5).
11
1 MBd Link
(High Performance HFBR-15X2ETZ/25X2ETZ)
System Performance Under recommended operating conditions, unless otherwise specified.
Parameter
Symbol Min. Typ. Max. Units Conditions
High
Performance
1 MBd
Data Rate
dc
Link Distance
d
37
m
IFdc = 60 mA
(Standard Cable)
58
m
IFdc = 60 mA, 25° C
Link Distance
d
43
m
IFdc = 60 mA
(Improved Cable)
67
m
IFdc = 60 mA, 25° C
Propagation tPLH
Delay
tPHL
1
MBd
100 250 ns RL = 560 Ω, CL = 30 pF
80
140
ns
Ref.
BER ≤10-9, PRBS:27-1
I = 0.5 metre
Notes 1,
3, 4, 5
Notes 1,
3, 4, 5
Fig. 10, 12
Notes 2, 4, 5
PR = -24 dBm
tD 20 ns PR = -24 dBm
Pulse Width
RL = 560 Ω, CL = 30 pF
Distortion tPLH-tPHL
Notes:
Fig. 10, 11
Notes 4, 5
1. For IFPK > 80 mA, the duty factor must be such as to keep IFdc ≤80 mA. In addition, for IFPK > 80 mA, the following rules for pulse width apply:
IFPK ≤160 mA: Pulse width ≤1 ms
IFPK > 160 mA: Pulse width ≤1 µS, period ≥20 µS.
2. The propagation delay for one meter of cable is typically 5 ns.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
4. Pulsed LED operation at IFPK > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased
pulse width distortion of the receiver output signal.
5. Optical link performance is guaranteed only with transmitter HFBR-15x2ETZ and receiver HFBR-25x2ETZ.
Figure 9. Required 1 MBd interface circuit
The HFBR-25X2ETZ receiver cannot be overdriven when using the required
interface circuit shown in Figure 9
12
Figure 10. 1 MBd propagation delay test circuit
120
80
70
60
50
40
30
X5X2ETZ -40° C
X5X2ETZ 25° C
X5X2ETZ 85° C
20
10
0
-27
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 11. Typical link pulse width distortion vs. optical power
Figure 13. Propagation delay test waveforms
13
tP - PROPAGATION DELAY - ns
tD - PULSE WIDTH DISTORTION - ns
90
-9
-6
100
80
60
40
tPLH X5X2ETZ
tPHL X5X2ETZ
20
0
-27
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 12. Typical link propagation delay vs. optical power
-9
-6
HFBR-15X2ETZ Transmitters
CATHODE
Function
1
Anode
1
2
Cathode
2
3
Ground
4
Ground
5
Ground
8
Ground
8 GROUND
ANODE
Pin #
GROUND
3
GROUND
4
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
5 GROUND
Absolute Maximum Ratings
Parameter
Symbol Min. Max. Units Reference
Storage Temperature
TS
–40
+85
°C
Operating Temperature
TA
–40
+85
°C
Lead Soldering Cycle
Temp.
Time
260
° C
10
sec
1000
mA
Forward Input Current
IFPK
IFdc 80
Reverse Input Voltage
VBR 5 V
Note 1, 4
Note 2, 3
Notes:
1. 1.6 mm below seating plane.
2. Recommended operating range between 10 and 750 mA.
3. 1 µs pulse, 20 µs period.
4. Moisture sensitivity level is MSL-3
All HFBR15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your Avago sales
representative for more information.
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise specified.
For forward voltage and output power vs. drive current graphs.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
Ref.
Transmitter Output
PT
–13.9
–4.0 dBm IFdc = 60 mA
Note 1
Optical Power
–11.2
–5.1
IFdc = 60 mA, 25° C
Output Optical Power
∆PT /∆T
–0.85
%/° C
Temperature Coefficient
Peak Emission Wavelength
λPK 660 nm
Forward Voltage
VF 1.43 1.67 2.05 V IFdc = 60 mA
Forward Voltage
∆VF /∆T
–1.37
mV/° C
Fig. 09
Temperature Coefficient
Effective Diameter
DT 1 mm
Reverse Input Breakdown
VBR 5.0 11.0 V IFdc = 10 µA,
Voltage
TA = 25° C
Diode Capacitance
CO 86 pF VF = 0, f = 1 MHz
Rise Time
tr
20
ns
10% to 90%,
Note 2
Fall Time
tf 20 ns IF = 60 mA
Note:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50 Ω input of a wide bandwidth oscilloscope, is used for this response time measurement.
14
HFBR-25X2ETZ Receivers
DO NOT CONNECT
1000 Ω
4
3
2
1
DO NOT CONNECT
Pin #
Function
1
VO
RL
2
Ground
VCC
3
GROUND
VCC
4
VO
RL
5
Ground
8
Ground
5
8
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Reference
Storage Temperature
TS
–40
+85
°C
Operating Temperature
TA
–40
+85
°C
Lead Soldering Cycle
Temp.
260
° C
Note 1, 3
Time
10
sec
Supply Voltage
VCC
–0.5
7
V
Note 2
Output Collector Current
IOAV 25 mA
Output Collector Power Dissipation
POD 40 mW
Output Voltage
VO –0.5 18 V
Pull-up Voltage
VP –5 VCC V
Fan Out (TTL)
N
5
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 µF be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤VCC ≤5.25 V unless otherwise specified.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
Receiver Optical Input
PR(L) –24
-9.5 dBm VOL ≤ 0.5 V
Power Level Logic 0
IOL = 8 mA
Optical Input Power
PR(H)
-43 dBm VOH = 5.25 V
Level Logic 1
IOH = ≤250 µA
High Level Output Current
IOH 5 250
µA VO = 18 V, PR = 0
Low Level Output Voltage
VOL 0.4 0.5 V IOL = 8 mA
PR = PR(L)MIN
High
Level
Supply
Current
I
3.5
6.3
mA V
CCH
CC = 5.25 V,
PR = 0
ICCL
6.2 10 mA VCC = 5.25 V,
Low Level Supply Current
PR = -12.5 dBm
Effective Diameter
D
1
mm
Internal Pull-up Resistor
RL 680 1000 1700 Ω
Notes:
Ref.
Notes 1, 2, 3, 6
Notes 4, 6
Notes 5, 6
Notes 5, 6
Notes 5, 6
Notes 5, 6
1. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse
width distortion of the receiver output signal.
3. The LED drive circuit of Figure 11 is required for 1 MBd operation of the HFBR-25X2ETZ.
4. Optical flux, P (dBm) = 10 Log [P(µW)/1000 µW].
5. RL is open.
6. Guaranteed only if optical input signal to the receiver is generated by HFBR-15x2ETZ, with ideal alignment to photodiode using 1 mm POF
(NA=0.5).
15
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