HLMP-1420

Data Sheet HLMP-132x Series, HLMP-142x Series, HLMP-152x Series T-1 (3 mm) High Intensity LED Lamps Description The Broadcom® family of T-1 lamps is specially designed for applications requiring higher on-axis intensity than is achievable with a standard lamp. The light generated is focused to a narrow beam to achieve this effect. Features        High intensity Choice of 3 bright colors – Red – Yellow – Green Popular T-1 diameter package Narrow viewing angle General purpose leads Reliable and rugged Available on tape and reel For more information, refer to the Tape and Reel Option Data Sheet. Broadcom AV02-1068EN August 6, 2021 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps Package Dimensions Ø 3.17 (.125) 2.67 (.105) 3.43 (.135) 2.92 (.115) 4.70 (.185) 4.19 (.165) 1.14 (.045) 0.51 (.020) 6.35 (.250) 5.58 (.220) 0.65 (0.026) max. Cathode 24.1(.95) min. 1.52 (.060) 1.02 (.040) (0.022) 0.55 SQ. TYP. (0.016) 0.40 2.79 (.110) 2.29 (.090) NOTE: 1. All dimensions are in millimeters (in.). 2. An epoxy meniscus may extend about 1 mm (0.40 in.) down the leads. 3. For PCB hole recommendations, see Precautions. Device Selection Guide Luminous Intensity Iv (mcd) at 10 mA Part Number Package Description Material/Color Min. Max. Tinted, Non-diffused AlInGaP Red 8.6 — HLMP-1420 Microtinted, Non-diffused AlInGaP Yellow HLMP-1421 Tinted, Non-diffused HLMP-1321 HLMP-1321-G00xx HLMP-1421-F00xx HLMP-1520 Microtinted, Non-diffused HLMP-1521 Tinted, Non-diffused HLMP-1521-E00xx Broadcom AlInGaP Green 8.6 — 9.2 — 9.2 — 9.2 — 6.7 — 6.7 — 6.7 — AV02-1068EN 2 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps Absolute Maximum Ratings at TA = 25°C Parameter Red Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Currenta 25 20 25 mA DC Currentb 30 20 30 mA Power Dissipationc 135 85 135 mW 5 5 5 V 110 110 110 °C °C Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range –40 to +100 –40 to +100 –20 to +100 Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 a. See Figure 4 (Red), Figure 8 (Yellow), or Figure 12 (Green) to establish pulsed operating conditions. b. For Red and Green series, derate linearly from 50°C at 0.5 mA/°C. For Yellow series, derate linearly from 50°C at 0.2 mA/°C. c. For Red and Green series, derate power linearly from 25°C at 1.8 mW/°C. For Yellow series, derate power linearly from 50°C at 1.6 mW/°C. Broadcom AV02-1068EN 3 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps Electrical/Optical Characteristics at TA = 25°C Device Symbol Description HLMP- Min. Typ. Max. Units 2½ Including Angle Between Half Luminous Intensity Points All — 45 — Deg. 132x — 632 — nm 142X — 590 — 152X — 570 — 132x — 14 — 142X — 12 — PEAK ½ d s C RJ-PIN VF Peak Wavelength Spectral Line Halfwidth Dominant Wavelength Speed of Response Capacitance Thermal Resistance Forward Voltage VR Reverse Breakdown Voltage V Luminous Efficacy Test Conditions IF = 10 mA, see Note a Measurement at Peak nm 152X — 13 — 132x — 626 — 142X — 589 — 152X — 569 — 132x — 90 — 142X — 90 — 152X — 500 — 132x — 11 — 142X — 15 — 152X — 18 — All — 290 — °C/W 132x — 1.9 2.4 V IF = 10 mA 142X — 1.9 2.4 152X — 2.0 2.7 All 5.0 — — V IR = 100 µA 132x — 180 — lm/W See Note c 142X — 500 — 152X — 640 — nm See Note b ns pF VF = 0; f = 1 MHz Junction to Cathode Lead a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. c. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = lv/v, where lv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Broadcom AV02-1068EN 4 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps Part Numbering System H L M P - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description x1 Package type 1 T-1 (3 mm) x2 Color 3 Red 4 Yellow 5 Green 20 Untinted or Micro Tinted, Non-diffused 21 Tinted, Non-diffused x3 x4 Lens Appearance Option x5 Minimum intensity bin x6 Maximum intensity bin x7 Color bin selection 0 Full range x8 x9 Packaging option 00 Bulk packaging 01 Tape and Reel, Crimped Leads Broadcom See Intensity Bin Limits 02 Tape and Reel, Straight Leads A1 Right Angle Housing, Uneven Leads A2 Right Angle Housing, Even Leads AV02-1068EN 5 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps Intensity Bin Limits Intensity Range (mcd) Intensity Range (mcd) Color Bin Min. Max. Color Bin Min. Max. Red G 9.7 15.5 Green E 7.6 12.0 H 15.5 24.8 F 12.0 19.1 I 24.8 39.6 G 19.1 30.7 J 39.6 63.4 H 30.7 49.1 Yellow K 63.4 101.5 I 49.1 78.5 L 101.5 162.4 J 78.5 125.7 M 162.4 234.6 K 125.7 201.1 289.0 N 234.6 340.0 L 201.1 O 340.0 540.0 M 289.0 417.0 P 540.0 850.0 N 417.0 680.0 Q 850.0 1200.0 O 680.0 1100.0 R 1200.0 1700.0 P 1100.0 1800.0 S 1700.0 2400.0 Q 1800.0 2700.0 4300.0 T 2400.0 3400.0 R 2700.0 U 3400.0 4900.0 S 4300.0 6800.0 V 4900.0 7100.0 T 6800.0 10800.0 W 7100.0 10200.0 U 10800.0 16000.0 X 10200.0 14800.0 V 16000.0 25000.0 Y 14800.0 21400.0 W 25000.0 40000.0 Z 21400.0 30900.0 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 Maximum tolerance for each bin limit is ± 18%. Color Categories Lambda (nm) Color Category Number Min. Max. Green 6 561.5 564.5 N 360.0 510.0 5 564.5 567.5 O 510.0 800.0 4 567.5 570.5 P 800.0 1250.0 3 570.5 573.5 2 573.5 576.5 Q 1250.0 1800.0 R 1800.0 2900.0 1 582.0 584.5 S 2900.0 4700.0 3 584.5 587.0 Yellow T 4700.0 7200.0 2 587.0 589.5 U 7200.0 11700.0 4 589.5 592.0 V 11700.0 18000.0 5 592.0 593.0 W 18000.0 27000.0 Tolerance for each bin limit is ± 0.5 nm. Broadcom AV02-1068EN 6 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps Packaging Option Matrix Packaging Option Code NOTE: Definition 00 Bulk Packaging, minimum increment 500 pieces/bag 01 Tape and Reel, crimped leads, minimum increment 1800 pieces/reel 02 Tape and Reel, straight leads, minimum increment 1800 pieces/reel A1 Right Angle Housing, uneven leads, minimum increment 500 pieces/bag A2 Right Angle Housing, even leads, minimum increment 500 pieces/bag All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom representative for further clarification or information. Figure 1: Relative Intensity vs. Wavelength 1 RELATIVE INTENSITY 0.9 YELLOW GREEN 0.8 RED 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 650 700 WAVELENGTH - nm Broadcom AV02-1068EN 7 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps T-1 Red Non-Diffused Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Luminous Intensity vs. DC Forward Current 2 30 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 25 20 15 10 5 0 0 1 2 1.5 1 0.5 3 0 FORWARD VOLTAGE - V 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA 6 5 4 3 2 Hz Hz 1,000 100 300 z z 100 1 KH Hz Hz 10 3 KH 10 K Hz 1 1.0 30 K KHz 100 K 300 IPEAK MAX. IDC MAX. RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT Figure 4: Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX Ratings) 10,000 tp – PULSE DURATION – μs Figure 5: Relative Luminous Intensity vs. Angular Displacement 20° 10° 0° 1.0 30° .8 40° 50° .6 60° .4 70° .2 80° 90° Broadcom NON-DIFFUSED 0° 20° 40° 60° 80° 100° AV02-1068EN 8 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps T-1 Yellow Non-Diffused Figure 6: Forward Current vs. Forward Voltage Figure 7: Relative Luminous Intensity vs. DC Forward Current 2 30 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 25 20 15 10 5 0 0 1 2 1.5 1 0.5 3 0 FORWARD VOLTAGE - V 0 5 10 15 20 DC FORWARD CURRENT - mA 6 5 4 3 Hz Hz 1,000 100 300 z z 100 1 KH Hz Hz Hz 10 3 KH 10 K 30 K KHz 1 1.0 100 K IDC MAX. 2 300 IPEAK MAX. RATIO OF MAXIMUM TOLERABLE PEAK CURRNT TO MAXIMUM TOLERABLE DC CURRENT Figure 8: Maximum Tolerable Peak Current vs. Pulse Duration (IDCMAX as per MAX Ratings) 10,000 tp – PULSE DURATION – μs Figure 9: Relative Luminous Intensity vs. Angular Displacement 20° 10° 0° 1.0 30° .8 40° 50° .6 60° .4 70° .2 80° 90° Broadcom NON-DIFFUSED 0° 20° 40° 60° 80° 100° AV02-1068EN 9 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet T-1 (3 mm) High Intensity LED Lamps T-1 Green Non-Diffused Figure 10: Forward Current vs. Forward Voltage Figure 11: Relative Luminous Intensity vs. DC Forward Current 30 2.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 25 20 15 10 5 0 0 1 2 3 2 1.5 1 0.5 0 FORWARD VOLTAGE - V 0 5 10 15 20 25 DC FORWARD CURRENT - mA 30 6 5 4 3 100 300 Hz z Hz z 100 1 KH 3 KH Hz Hz 10 Hz 10 K 30 K KHz 1 1.0 100 K IDC MAX. 2 300 IPEAK MAX. RATIO OF MAXIMUM TOLERABLE PEAK CURRNT TO MAXIMUM TOLERABLE DC CURRENT Figure 12: Maximum Tolerable Peak Current vs. Pulse Duration (IDCMAX as per MAX Ratings) 1,000 10,000 tp – PULSE DURATION – μs Figure 13: Relative Luminous Intensity vs. Angular Displacement 20° 10° 0° 1.0 30° .8 40° 50° .6 60° .4 70° .2 80° 90° Broadcom NON-DIFFUSED 0° 20° 40° 60° 80° 100° AV02-1068EN 10 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet Precautions T-1 (3 mm) High Intensity LED Lamps  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Use this method for the hand soldering operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED.   Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition. Wave Solderinga, b NOTE: 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, re-calibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Over-stressing the LED during the soldering process might cause premature failure to the LED due to delamination.    1.59 mm Manual Solder Dipping Pre-heat Temperature 105°C max. — Pre-heat Time 60s max. — Peak Temperature 250°C max. 260°C max. Dwell Time 3s max. 5s max. Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions.  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use non-metal material because it will absorb less heat during the wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through-hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. The recommended PC board plated through holes (PTH) size for LED component leads follows. LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm (0.018 × 0.018 in.) (0.025 in.) (0.039 to 0.043 in.) Dambar shear- 0.65 mm off area (max.) (0.026 in.) 0.919 mm (0.036 in.) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm (0.020 × 0.020 in.) (0.028 in.) (0.041 to 0.045 in.) Dambar shear- 0.70 mm off area (max.) (0.028 in.) 0.99 mm (0.039 in.) a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. Broadcom NOTE: Refer to application note AN1027 for more information on soldering LED components. AV02-1068EN 11 HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Data Sheet  T-1 (3 mm) High Intensity LED Lamps Over-sizing the PTH can lead to twisted LED after clinching. On the other hand, under-sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. Figure 14: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245qC ± 5 qC (maximum peak temperature = 250qC) TEMPERATURE (qC) 200 Dwell time: 1.5s – 3.0s (maximum = 3 seconds) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 AV02-1068EN 12 Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2013–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.