HLMP-1503

HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 T-1 (3-mm) Diffused LED Lamps Data Sheet Description Features This family of T-1 lamps is widely used in general-purpose indicator applications. Diffusants, tints, and optical design are balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility.         High intensity Choice of four bright colors: — High Efficiency Red — Orange — Yellow — High Performance Green Popular T-1 diameter package Selected minimum intensities Wide viewing angle General purpose leads Reliable and rugged Available on tape and reel Package Dimensions 1.14 (.045) 0.51 (.020) 3.43 (.135) 2.92 (.115) ‡ 2.79 (.110) 2.29 (.090) 24.1(.95) MIN. CATHODE 0.65 (0.026) max. 1.52 (.060) 1.02 (.040) 3.17 (.125) 2.67 (.105) (0.022) 0.55 SQ. TYP. (0.016) 0.40 4.70 (.185) 4.19 (.165) 6.35 (.250) 5.58 (.220) NOTE 1. 2. 3. All dimensions are in mm (inches). An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads. For PCB hole recommendations, see Precautions. Broadcom -1- HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Device Selection Guide Luminous Intensity Iv (mcd) at 10 mA Material Color Part Number Min. GaAsP on GaP Red Yellow Orange GaP Green Emerald Green a. a Max. HLMP-1301 3.4 — HLMP-1301-E00xx 3.4 — HLMP-1301-G00xx 8.6 — HLMP-1301-GH0xx 8.6 27.6 HLMP-1401 2.2 — HLMP-1401-D00xx 3.6 — HLMP-1401-E0000 5.7 — HLMP-K401 2.1 — HLMP-K401-E00xx 3.4 — HLMP-K401-FGDxx 5.4 17.2 HLMP-K401-FH000 5.4 27.6 HLMP-1503 1.0 — HLMP-1503-C00xx 2.6 — HLMP-1503-D00xx 4.2 — HLMP-1503-DE000 4.2 13.4 HLMP-1503-E00xx 6.7 — HLMP-K600 1.0 — Refer to Application Note 1061 for information comparing standard green and emerald green light output degradation. Absolute Maximum Ratings at TA = 25°C Parameter HER/Orange Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Currenta 25 20 25 mA DC Currentb, c 30 20 30 mA Reverse Voltage (IR = 100 A) 5 5 5 V Transient Forward Currentd (10s Pulse) 500 500 500 mA LED Junction Temperature 110 110 110 °C Operating Temperature Range –40 to +100 –40 to +100 –20 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 °C a. See Figure 5 (HER/Orange), Figure 10 (Yellow), or Figure 15 (Green/Emerald Green) to establish pulsed operating conditions. b. For Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. c. For Red, Orange, and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C. d. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. Broadcom -2- HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Device Included Angle Between Half Luminous Intensity Points 21/2 Peak Wavelength PEAK Dominant Wavelength Spectral Line Halfwidth Speed of Response Capacitance d 1/2 s C Min. Typ. Max. Units Test Conditions All — 60 — Deg. IF = 10 mA, See Note a High Efficiency Red — 635 — nm Measurement at Peak Orange — 600 — Yellow — 583 — Green — 565 — nm See Note b Emerald Green — 558 — High Efficiency Red — 626 — Orange — 602 — Yellow — 585 — Green — 569 — Emerald Green — 560 — High Efficiency Red — 40 — Yellow — 36 — Green — 28 — Emerald Green — 24 — High Efficiency Red — 90 — Orange — 280 — Yellow — 90 — Green — 500 — Emerald Green — 3100 — High Efficiency Red — 11 — Orange — 4 — Yellow — 15 — Green — 18 — Emerald Green — 35 — nm ns pF VF = 0; f = 1 MHz Thermal Resistance RJ-PIN All — 290 — °C/W Forward Voltage VF HER/Orange 1.5 1.9 2.4 V IF = 10 mA V IR = 100 μA Yellow 1.5 2.0 2.4 Green 1.5 2.1 2.7 Emerald Green — 2.1 2.7 Reverse Breakdown Voltage VR All 5.0 — — Luminous Efficacy V High Efficiency Red — 145 — Orange — 380 — Yellow — 500 — Green — 595 — Emerald Green — 655 — Junction to Cathode Lead lumens/ See Note c watt a. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. The dominant wavelength,d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. c. Radiant intensity, le, in watts/steradian, may be found from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Broadcom -3- HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Part Numbering System H L M P - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description Option x1 Package type 1 T-1 (3 mm) K T-1 (3 mm) x2 Color 3 GaP HER 4 GaP Yellow (except K4xx series) 5 GaP Green 6 GaP Emerald Green x3 x4 Product specific designation — x5 Minimum intensity bin Refer to Intensity Bin Limits Table x6 Maximum intensity bin x7 Color bin selection x8 x9 Packaging option 0 Full range D Color Bin 4 and 5 only 00 Bulk packaging 02 Tape and Reel, Straight Leads A1 Right Angle Housing, Uneven Leads A2 Right Angle Housing, Even Leads FG Products need inventory control for customer IDI Broadcom -4- HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Intensity Bin Limts Table 1 Intensity Bin Limits (Continued) Intensity Range (mcd) Color Bin Min. Max. C 2.5 4.0 D 4.0 6.5 E 6.5 10.3 Table 1 Intensity Bin Limits Intensity Range (mcd) Color Red/Orange Bin Min. Max. D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Yellow Broadcom -5- F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Color Categories Table 1 Intensity Bin Limits (Continued) Intensity Range (mcd) Color Bin Green/Emerald Green NOTE NOTE Min. Max. A 1.1 1.8 B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ± 18%. All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom representative for further clarification or information. Lambda (nm) C olor Category # Emerald Green Green Yellow Orange NOTE Min. Max. 9 522.5 555.5 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Tolerance for each bin limit is ± 0.5 nm. Packaging Option Matrix Packaging Option Code Broadcom -6- Definition 00 Bulk Packaging, minimum increment, 500 pcs/bag 02 Tape & Reel, straight leads, minimum increment, 1800 pcs/bag A1 Right Angle Housing, uneven leads, minimum increment, 500 pcs/bag A2 Right Angle Housing, even leads, minimum increment, 500 pcs/bag FG Inventory Control for Customer IDI HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Figure 1 Relative Intensity vs. Wavelength RELATIVE INTENSITY 1.0 EMERALD GREEN ORANGE HIGH PERFORMANCE GREEN AlGaAs RED T A = 25° C HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 WAVELENGTH – nm 700 Broadcom -7- 750 HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet T-1 High Efficiency Red, Orange Diffused Lamps Figure 2 Forward Current vs. Forward Voltage Characteristics Figure 3 Relative Luminous Intensity vs. DC Forward Current Figure 4 Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak LED Current Figure 5 Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX Ratings) Figure 6 Relative Luminous Intensity vs. Angular Displacement Broadcom -8- HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet T-1 Yellow Diffused Lamps Figure 7 Forward Current vs. Forward Voltage Characteristics Figure 8 Relative Luminous Intensity vs. Forward Current Figure 9 Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current Figure 10 Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX Ratings) Figure 11 Relative Luminous Intensity vs. Angular Displacement Broadcom -9- HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet T-1 Green/Emerald Green Diffused Lamps Figure 12 Forward Current vs. Forward Voltage Characteristics Figure 13 Relative Luminous Intensity vs. Forward Current Figure 14 Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak LED Current Figure 15 Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX Ratings) Figure 16 Relative Luminous Intensity vs. Angular Displacement Broadcom - 10 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Precautions  Lead Forming    Preform or cut the leads of an LED lamp to length before they are inserted and soldered into the PC board. If forming a lead is required before it is soldered, take care to avoid any excessive mechanical stress induced to the LED package. Otherwise, cut the LED leads to length after soldering at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. Make tooling precisely and cut the leads cut to length, rather than relying on your hand.      Soldering Conditions   Take care during PCB assembly and soldering process to prevent damage to LED component. The closest an LED is allowed to be soldered on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Follow the recommended soldering conditions in this table. LED Component Lead Size Wave Soldering Manual Solder Dipping 105°C Max. — 30s Max. — 250°C Max. 260°C Max. 3s Max. 5s Max. Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time Set and maintain the wave soldering parameter according to the recommended temperature and dwell time in the solder wave. You are advised to periodically check the soldering profile to ensure the soldering profile used always conforms to recommended soldering condition. If necessary, use a fixture during soldering process to hold the LED component in the proper orientation with respect to the PCB. Handle the LED properly to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. To ensure solderability, pay special attention to board fabrication, solder masking, surface plating, and lead hole size and component orientation. Follow the recommended PC board plated through-hole sizes for LED component leads in this table. 0.45 × 0.45 mm (0.018 × 0.018 in.) Dambar shear-off area (max.) 0.65 mm (0.026 in.) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) Dambar shear-off area (max.) 0.70 mm (0.028 in.) 0.99 mm (0.039 in) NOTE LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE – C CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 PREHEAT 0 10 20 30 40 50 60 TIME – SECONDS 70 80 90 100 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Broadcom - 11 - 0.707 mm 1.05 to 1.15 mm (0.028 in) (0.041 to 0.045 in.) Refer to application note AN1027 for more information on soldering LED components. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 Plated Through-Hole Diameter 0.636 mm 0.98 to 1.08 mm (0.025 in) (0.039 to 0.043 in.) Lead size (typ.) Figure 17 Recommended Wave Soldering Profile 250 Diagonal For product information and a complete list of distributors, please go to our web site: www.broadcom.com. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries and/or the EU. Copyright © 2013–2017 by Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AV02-1555EN – July 14, 2017