HLMP-3401

Data Sheet HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 T-1¾ (5 mm) Diffused LED Lamps Description Features This family of T-1¾ tinted, diffused LED lamps is widely used in general-purpose indicator applications. Diffusants, tints, and optical design are balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility.         High intensity Choice of four bright colors – Red – Orange – Yellow – Green Popular T-1¾ diameter package Selected minimum intensities Wide viewing angle General purpose leads Reliable and rugged Available on tape and reel Package Dimensions 6.10 (0.240) 5.59 (0.220) 0.89 (0.035) 0.64 (0.025) 0.65 (0.026) max SQUARE TYP. 0.55 (0.022) 0.40 (0.016) 5.08 (0.200) 4.57 (0.180) 2.54 (0.100) NOM. 9.19 (0.362) 8.43 (0.332) CATHODE LEAD 25.40 (1.00) MINIMUM 1.27 (0.050) NOM. NOTE: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads. 3. For PCB hole recommendations, see Precautions. Broadcom AV02-1558EN August 4, 2021 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps Device Selection Guide Luminous Intensity , lv (mcd) at 10 mA Material/Color Part Number AlInGaP Red AlInGaP Yellow Min. Max. HLMP-3301 6.1 — HLMP-3301-D00xx 2.4 — HLMP-3301-F00xx 6.1 — HLMP-3762 9.7 — HLMP-3762-G00xx 9.7 — HLMP-3401 6.5 — HLMP-3401-E00xx 6.5 — HLMP-3862 10.3 — AlInGaP Orange HLMP-D401 6.1 — AlInGaP Green HLMP-3507 4.7 — HLMP-3507-D00xx 4.7 — HLMP-3962 12.0 — HLMP-3962-F00xx 12.0 — Absolute Maximum Ratings at TA = 25°C Parameter Red/Orange Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Currenta 25 20 25 mA DC Currentb 30 20 30 mA Power Dissipationc 135 85 135 mW 5 5 5 V 110 110 110 °C Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range –40 to +100 –40 to +100 –20 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 °C a. See Figure 4 (Red/Orange), Figure 8 (Yellow), or Figure 12 (Green) to establish pulsed operating conditions. b. For Red, Orange and Green series, derate linearly from 50°C at 0.5 mA/°C. For Yellow series, derate linearly from 50°C at 0.2 mA/°C. c. 1.8 mW/°C. For Yellow series, derate power linearly from 50°C at 1.6 mW/°C. Broadcom AV02-1558EN 2 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps Optical/Electrical Characteristics at TA = 25°C Symbol Parameter Color 21/2 Included Angle Between Half Luminous Intensity Points PEAK ½ d Peak Wavelength Spectral Line Halfwidth Dominant Wavelength s Speed of Response C Capacitance Min. Typ. Max. Units Test Condition Red — 60 — Deg. IF = 10 mA, see Note a Orange — 60 — nm Measurement at Peak Yellow — 60 — Green — 60 — Red — 632 — Orange — 610 — Yellow — 590 — Green — 570 — Red — 14 — Orange — 13 — Yellow — 12 — Green — 13 — Red — 626 — Orange — 605 — Yellow — 589 — Green — 569 — Red — 90 — Orange — 280 — Yellow — 90 — Green — 500 — Red — 11 — Orange — 4 — Yellow — 15 — Green — 18 — nm nm See Note b ns pF VF = 0; f = 1 MHz RJ-PIN Thermal Resistance All — 260 — °C/W VF Forward Voltage Red/Orange — 1.9 2.4 V IF = 10 mA Yellow — 1.9 2.4 Green — 2 2.7 5.0 — — V IR = 100 µA lumens/Watt See Note c VR Reverse Breakdown Voltage All V Luminous Efficacy Red — 180 — Orange — 350 — Yellow — 500 — Green — 640 — Junction to Cathode Lead a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. c. Radiant intensity, Ie, in Watts/steradian, may be found from the equation Ie = Iv / v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/Watt. Broadcom AV02-1558EN 3 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps Part Numbering System H L M P - Code Description x1 Package Type x2 x1 x2 Color x3 x4 - x5 x6 x7 x8 x9 Option 3 T - 1¾ (5 mm) D T - 1¾ (5 mm) Orange 3, 7 Red 4, 8 Yellow (except D4xx) 5, 9 Green x3 x4 Brightness Level 0x Less brightness 62 Higher brightness x5 Minimum Intensity Bin See Intensity Bin Limits x6 Maximum Intensity Bin 0 Open bins (no max Iv bin limit) x7 Color Bin Option 0 Full distribution x8 x9 Packing Option 00 Bulk (Loose forms packaging) 01 Tape and Reel, Crimped Leads Broadcom 02 Tape and Reel, Straight Leads B1 Right Angle Housing, Uneven Leads B2 Right Angle Housing, Even Leads DD Ammopack R4 Tape and Reel, Counter Clockwise AV02-1558EN 4 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps Bin Information Intensity Bin Limits Intensity Range (mcd) Intensity Range (mcd) Color Bin Min. Max. Yellow E 6.5 10.3 Color Bin Min. Max. F 10.3 16.6 Red/Orange D 2.4 3.8 G 16.6 26.5 E 3.8 6.1 H 26.5 42.3 F 6.1 9.7 I 42.3 67.7 G 9.7 15.5 J 67.7 108.2 H 15.5 24.8 K 108.2 173.2 I 24.8 39.6 L 173.2 250.0 J 39.6 63.4 M 250.0 360.0 K 63.4 101.5 N 360.0 510.0 L 101.5 162.4 O 510.0 800.0 M 162.4 234.6 P 800.0 1250.0 N 234.6 340.0 Q 1250.0 1800.0 O 340.0 540.0 R 1800.0 2900.0 P 540.0 850.0 S 2900.0 4700.0 Q 850.0 1200.0 T 4700.0 7200.0 R 1200.0 1700.0 U 7200.0 11700.0 S 1700.0 2400.0 V 11700.0 18000.0 T 2400.0 3400.0 W 18000.0 27000.0 U 3400.0 4900.0 D 4.7 7.6 V 4900.0 7100.0 E 7.6 12.0 W 7100.0 10200.0 F 12.0 19.1 X 10200.0 14800.0 G 19.1 30.7 Y 14800.0 21400.0 H 30.7 49.1 Z 21400.0 30900.0 I 49.1 78.5 Green J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. Broadcom AV02-1558EN 5 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet Color Categories Packaging Option Matrix Lambda (nm) Color Category Number Min. Max. Green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Yellow Orange T-1¾ (5 mm) Diffused LED Lamps Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pieces/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pieces/reel 02 Tape & Reel, straight leads, minimum increment 1300 pieces/reel B1 Right Angle Housing, uneven leads, minimum increment 500 pieces/bag B2 Right Angle Housing, even leads, minimum increment 500 pieces/bag DD Ammo Pack, straight leads with minimum increment 2000/pack R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel first, minimum increment 1300 pieces/reel NOTE: All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom® representative for further clarification/information. Tolerance for each bin limit is ±0.5 nm. Figure 1: Relative Intensity vs. Wavelength 1 ORANGE RELATIVE INTENSITY 0.9 GREEN 0.8 RED 0.7 YELLOW 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 650 700 WAVELENGTH - nm Broadcom AV02-1558EN 6 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps T-1¾ Red, Orange Diffused Lamps Figure 2: Forward Current vs. Forward Voltage Characteristics Figure 3: Relative Luminous Intensity vs. DC Forward Current 2.5 25 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 30 20 ORANGE 1.5 15 10 5 0 2 RED 1 0.5 0 1 2 3 0 FORWARD VOLTAGE - V 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA Figure 4: Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX as per MAX ratings) Figure 5: Relative Luminous Intensity vs. Angular Displacement RED Broadcom AV02-1558EN 7 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps T-1¾ Yellow Diffused Lamps Figure 6: Forward Current vs. Forward Voltage Characteristics Figure 7: Relative Luminous Intensity vs. DC Forward Current 2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 30 25 20 15 10 5 0 0 1 2 3 FORWARD VOLTAGE - V 1.5 1 0.5 0 0 5 10 15 20 DC FORWARD CURRENT - mA Figure 8: Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX as per MAX ratings) Figure 9: Relative Luminous Intensity vs. Angular Displacement Broadcom AV02-1558EN 8 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet T-1¾ (5 mm) Diffused LED Lamps T-1¾ Green Diffused Lamps Figure 10: Forward Current vs. Forward Voltage Characteristics Figure 11: Relative Luminous Intensity vs. DC Forward Current 2.5 25 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 30 20 15 10 5 0 0 1 2 3 FORWARD VOLTAGE - V 2 1.5 1 0.5 0 0 5 10 15 20 25 DC FORWARD CURRENT - mA 30 Figure 12: Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX as per MAX ratings) Figure 13: Relative Luminous Intensity vs. Angular Displacement Broadcom AV02-1558EN 9 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet Precautions T-1¾ (5 mm) Diffused LED Lamps  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Use this method for the hand soldering operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59 mm   Wave Solderinga, b Manual Solder Dipping Pre-heat Temperature 105°C max. Pre-heat Time 60s max. Peak Temperature 250°C max. 260°C max. Dwell Time 3s max. 5s max. — — a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. Broadcom NOTE: 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Over-stressing the LED during the soldering process might cause premature failure to the LED due to delamination.    Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition. Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions.  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use nonmetal material because it absorbs less heat during the wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through-hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. The recommended PC board plated through holes (PTH) size for LED component leads follows. LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm (0.018 × 0.018 in.) (0.025 in.) (0.039 to 0.043 in.) Dambar shear- 0.65 mm off area (max.) (0.026 in.) 0.919 mm (0.036 in.) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm (0.020 × 0.020 in.) (0.028 in.) (0.041 to 0.045 in.) Dambar shear- 0.70 mm off area (max.) (0.028 in.) NOTE: 0.99 mm (0.039 in.) Refer to application note AN1027 for more information on soldering LED components. AV02-1558EN 10 HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Data Sheet  T-1¾ (5 mm) Diffused LED Lamps Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Figure 14: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245qC ± 5 qC (maximum peak temperature = 250qC) TEMPERATURE (qC) 200 Dwell time: 1.5s – 3.0s (maximum = 3 seconds) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 AV02-1558EN 11 Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2015–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.