HLMP-3416

HLMP-331x, HLMP-341x, HLMP-351x Series T-13/4 (5 mm) High Intensity LED Lamps Data Sheet Description Features This family of T-13/4 nondiffused LED lamps is specially designed for applica­ tions requiring higher on-axis intensity than is achievable with a standard lamp. The light generated is focused to a narrow beam to achieve this effect. • High intensity • Choice of 3 bright colors - High Efficiency Red - Yellow - High Performance Green Selection Guide Luminous Intensity Iv (mcd) @ 10 mA • Popular T-13/4 diameter package • Selected minimum intensities Color Part Number Min. Max. Red HLMP-3316 24.8 - HLMP-3316-I00xx 24.8 - • General purpose leads Yellow HLMP-3416 16.6 - • Reliable and rugged Green HLMP-3519 12.0 - • Available on tape and reel HLMP-3519-F00xx 12.0 - • Narrow viewing angle Part Numbering System HLMP - 3 x 1 x - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B1: Right Angle Housing, Uneven Leads B2: Right Angle Housing, Even Leads Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Brightness Level 6, 9: Higher Brightness Color Options 3: GaP HER 4: GaP Yellow 5: GaP Green Package Dimensions 5.08 (0.200) 4.57 (0.180) 9.19 (0.362) 8.43 (0.332) 0.65 MAX. (0.026) 0.89 (0.035) 0.64 (0.025) 25.40 (1.00) MIN. CATHODE LEAD (NOTE 1) 1.27 (0.050) NOM. 0.46 (0.018) SQUARE NOM. 6.10 (0.240) 5.59 (0.220) 2.54 (0.100) NOM. 2 Notes: 1. All dimensions are in millimeters (inches). 2. An epoxy meniscus may extend about 1 mm (0.40") down the leads. 3. For PCB hole recommendations, see the Precautions section. Electrical Characteristics at TA = 25°C Symbol Description Device HLMP- Min. Typ. IV 3316 24.8 60.0 3416 3519 2q1/2 Luminous Intensity Max. Units Test Conditions mcd IF = 10 mA (Figure 3) 16.6 50.0 mcd IF = 10 mA (Figure 8) 12.0 70.0 mcd IF = 10 mA (Figure 13) Including Angle Between Half 3316 35 Deg. Luminous Intensity Points IF = 10 mA See Note 1 (Figure 6) 3416 35 Deg. IF = 10 mA See Note 1 (Figure 11) 3519 24 Deg. IF = 10 mA See Note 1 (Figure 16) lPEAK Peak Wavelength 331X 635 nm Measurement at Peak 341X 583 (Figure 1) 351X 565 Dl1/2 Spectral Line Halfwidth 331X 341X 351X 40 36 28 nm ld Dominant Wavelength 331X 341X 351X 626 585 569 nm ts Speed of Response 331X 341X 351X 90 90 500 ns C Capacitance 331X 341X 351X 11 15 18 pF RqJ-PIN Thermal Resistance 331X 260 °C/W Junction to Cathode 341X Lead 351X VF Forward Voltage 331X 1.9 2.4 V IF = 10 mA (Figure 2) 341X 2.0 2.4 IF = 10 mA (Figure 7) 351X 2.1 2.7 IF = 10 mA (Figure 12) VR All Reverse Breakdown Volt. hV Luminous Efficacy 5.0 331X 341X 351X V 145 lumens 500  Watt 595 See Note 2 (Figure 1) VF = 0; f = 1 MHz IR = 100 µA See Note 3 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 3 Absolute Maximum Ratings at TA = 25°C Parameter 331X Series 341X Series 351X Series Units Peak Forward Current 90 60 90 mA 20 25 mA Average Forward Current[1] 25 DC Current[2] 30 20 30 mA Power Dissipation[3] 135 85 135 mW Reverse Voltage (IR = 100 µA) 5 5 5 V Transient Forward Current[4] 500 (10 µsec Pulse) 500 500 mA LED Junction Temperature 110 110 110 °C Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C Notes: 1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. Figure 1. Relative intensity vs. wavelength. 4 High Efficiency Red HLMP-331X Series Figure 2. Forward current vs. forward voltage characteristics. Figure 5. Maximum tolerable peak current vs. pulse duration (IDC MAX as per MAX ratings). 5 Figure 3. Relative luminous intensity vs. DC forward current. Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Figure 6. Relative luminous intensity vs. angular displacement. Yellow HLMP-341X Series Figure 7. Forward current vs. forward voltage characteristics. Figure 10. Maximum tolerable peak current vs. pulse duration (IDC MAX as per MAX ratings). 6 Figure 8. Relative luminous intensity vs. DC forward current. Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current. Figure 11. Relative luminous intensity vs. angular displacement. Green HLMP-351X Series Figure 12. Forward current vs. forward voltage characteristics. Figure 15. Maximum tolerable peak current vs. pulse duration (IDC MAX as per MAX ratings). 7 Figure 13. Relative luminous intensity vs. DC forward current. Figure 14. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Figure 16. Relative luminous intensity vs. angular displacement. T-13/4 lamp. Table 2. Intensity Bin Limit Table 2. (Cont'd) Table 2. (Cont'd) Intensity Range (mcd) Intensity Range (mcd) Intensity Range (mcd) Color Bin Color Bin Color Bin H 15.5 24.8 G 16.6 26.5 E 7.6 I 24.8 39.6 H 26.5 42.3 F 12.0 19.1 J 39.6 63.4 I 42.3 67.7 G 19.1 30.7 K 63.4 101.5 J 67.7 108.2 H 30.7 49.1 L 101.5 162.4 K 108.2 173.2 I 49.1 78.5 M 162.4 234.6 L 173.2 250.0 J 78.5 125.7­ N 234.6 340.0 M 250.0 360.0 K 125.7 201.1 O 340.0 540.0 Yellow N 360.0 L 201.1 289.0 Min. Max. Min. Max. 510.0 Min. Max. 12.0 Red P 540.0 850.0 O 510.0 800.0 Green M 289.0 417.0 Q 850.0 1200.0 P 800.0 1250.0 N 417.0 680.0 R 1200.0 1700.0 Q 1250.0 1800.0 O 680.0 1100.0 S 1700.0 2400.0 R 1800.0 2900.0 P 1100.0 1800.0 T 2400.0 3400.0 S 2900.0 4700.0 Q 1800.0 2700.0 U 3400.0 4900.0 T 4700.0 7200.0 R 2700.0 4300.0 V 4900.0 7100.0 U 7200.0 11700.0 S 4300.0 6800.0 W 7100.0 10200.0 V 11700.0 18000.0 T 6800.0 10800.0 X 10200.0 14800.0 W 18000.0 27000.0 U 10800.0 16000.0 Y 14800.0 21400.0 V 16000.0 25000.0 Z 21400.0 30900.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. 8 Color Categories Lambda (nm) Color Cat # Min. 6 561.5 564.5 Max. 5 564.5 567.5 Green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 Yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Tolerance for each bin limit is ± 0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition     00 Bulk Packaging, minimum increment 500 pcs/bag     01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag     02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag     B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag     B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag Note: All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 9 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: • Recommended soldering conditions: Diagonal Plated Through -Hole Diameter 0.98 to 1.08 mm (0.039 to 0.043 in) Wave Soldering Manual Solder Dipping Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Dambar shearoff area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Peak Temperature 250 °C Max. 260 °C Max. Lead size (typ.) Dwell Time 3 sec Max. 5 sec Max. 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shearoff area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) TURBULENT WAVE 250 TEMPERATURE – °C LED Component Lead Size LAMINAR WAVE HOT AIR KNIFE FLUXING 100 PREHEAT 0 10 20 30 on soldering LED components. CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 50 30 Note: Refer to application note AN1027 for more information BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 40 50 60 TIME – SECONDS 70 80 90 100 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 17. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our website: 1.05 to 1.15 mm (0.041 to 0.045 in) www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-4259EN AV02-1023EN - April 15, 2015