HLMP-3707, HLMP-3807, HLMP-3907, HLMP-3750,
HLMP-3850, HLMP-3950, HLMP-3960, HLMP-3390,
HLMP-3490, HLMP-3590, HLMP-1340, HLMP-1440,
HLMP-1540, HLMP-D640, HLMP-K640
T-13/4 (5 mm), T-1 (3 mm), Ultra‑Bright LED Lamps
Data Sheet
Description
Features
These non-diffused lamps out-perform conventional
LED lamps. By utilizing new higher intensity material, we
achieve superior product performance.
• Improved brightness
The HLMP‑3750/‑3390/‑1340 Series Lamps are Gallium Arsenide Phosphide on Gallium Phosphide red light emitting
diodes. The HLMP‑3850/‑3490/‑1440 Series are Gallium
Arsenide Phosphide on Gallium Phosphide yellow light
emitting diodes. The HLMP‑3950/‑3590/-3960/‑1540/D640/-K640 Series Lamps are Gallium Phosphide green
light emitting diodes.
• Improved color performance
• Available in popular T-1 and T-13/4 packages
• New sturdy leads
• IC compatible/low current capability
• Reliable and rugged
• Choice of 3 bright colors
High Efficiency Red
High Brightness Yellow
High Performance Green
Applications
• Lighted switches
• Backlighting front panels
• Light pipe sources
• Keyboard indicators
Selection Guide
Luminous Intensity Iv (mcd) @ 20mA
Package
Description
Color
Device
HLMP-
Min.
Typ.
Max.
2q1/2 Degree
Package
Outline
T-13/4
Red
3707-L00xx
90.2
-
-
24
F
3750
90.2
125.0
-
24
A
3750-L00xx
90.2
125.0
-
24
A
Yellow
3807-K00xx
96.2
-
-
24
F
3850
96.2
140.0
-
24
A
3850-K00xx
96.2
140.0
-
24
A
3850-KL0xx
96.2
150.0
294.0
24
A
Green
3907-K00xx
111.7
-
-
24
F
3914-K00xx
111.7
-
-
24
D
3950
111.7
265.0
-
24
A
3950-K00xx
111.7
265.0
-
24
A
3950-LM0xx
170.0
300.0
490.0
24
A
3960-K0xxx
111.7
265.0
-
24
E
Emerald Green
D640-E00xx
6.7
21.0
-
24
D
T-13/4 Low Profile
Red
3390
35.2
55.0
-
32
B
Yellow
3490
37.6
55.0
-
32
B
3490-I00xx
37.6
55.0
-
32
B
Green
3590
43.6
55.0
-
32
B
3590-I00xx
43.6
55.0
-
32
B
T-1
Red
1340
35.2
55.0
-
45
C
1340-H00xx
8.6
15.0
27.6
45
C
1340-J00xx
35.2
55.0
-
45
C
1340-JK0xx
35.2
55.0
112.8
45
C
Yellow
1440
23.5
45.0
-
45
C
1440-H00xx
23.5
45.0
-
45
C
1440-HI0xx
23.5
-
75.2
45
C
1440-HIB00
23.5
-
75.2
45
C
Green
1540
27.3
45.0
-
45
C
1540-H00xx
27.3
45.0
-
45
C
1540-IJ0xx
43.6
60.0
139.6
45
C
Emerald Green
K640
4.2
21.0
-
45
C
K640-D00xx
4.2
21.0
-
45
C
K640-FGNxx
10.6
20.0
34.0
45
C
Package Dimensions
9.19 (0.362)
8.43 (0.332)
25.40
(1.00) MIN.
0.89 (0.035)
0.64 (0.025)
0.102 (0.004)
MAX. TYP.
0.10 (0.004)
MAX.
0.46 (0.018)
SQUARE
NOMINAL
2.54 (0.100)
NOM.
PACKAGE OUTLINE "D"
HLMP-D640
1.52 (0.060)
1.02 (0.040)
9.07 (0.357)
8.56 (0.337)
0.89 (0.035)
0.64 (0.025) 1.02 (0.040) MAX.
EPOXY
MENISCUS
1.32 (0.052)
1.02 (0.040)
23.0
MIN.
(0.900)
0.74 (0.029)
0.58 (0.023)
SQUARE
∅
CATHODE
FLAT
13.11 (0.516)
12.34 (0.486)
1.02 (0.040)
MAX.
22.86
MIN.
(0.900)
6.10 (0.240)
5.59 (0.220)
9.07 (0.357)
8.56 (0.337)
12.47 (0.491)
11.71 (0.461)
0.89 (0.035)
0.64 (0.025)
CATHODE
LEAD
(NOTE 1)
1.27 (0.050)
NOM.
5.08 (0.200)
4.78 (0.188)
5.08 (0.200)
4.78 (0.188)
5.08 (0.200)
4.57 (0.180)
6.10 (0.240)
5.60 (0.220)
2.54 (0.100)
NOM.
PACKAGE OUTLINE "E"
HLMP-3960
1.52 (0.060)
1.02 (0.040)
CATHODE
FLAT
0.53 (0.021)
SQ.
0.43 (0.017)
6.10 (0.240)
5.60 (0.220)
2.79 (0.110)
2.29 (0.090)
PACKAGE OUTLINE "F"
HLMP-3707/-3807/-3907
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
Dx, Ex: Ammo Pack, Straight Leads
FH: 2 Iv Bin Select with Inventory Control
Vx: Ammo Pack, Crimped Leads
Color Bin Options
0: Full Color Bin Distribution
B: Color Bin 2 & 3 Only
N: Color Bin 6 & 7 Only
Maximum Iv Bin Options
0: Open (No. Max. Limit)
Others: Please Refer to the Iv Bin Table
Minimum Iv Bin Options
Please Refer to the Iv Bin Table
Color Options
3, 7: GaP HER
4, 8: GaP Yellow (except K4xx series)
5, 9: GaP Green
6: GaP Emerald Green
Package Option
1, K: T-1 (3 mm)
3, D: T-13/4 (5 mm)
Absolute Maximum Ratings at TA = 25°C
Parameter
Red
Yellow
Green/Emerald Green
Units
Peak Forward Current
90
60
90
mA
Average Forward Current[1]
25
20
25
mA
DC Current[2]
30
20
30
mA
Transient Forward Current[3]
500
500
500
mA
Reverse Voltage (IR = 100 µA)
5
5
5
V
LED Junction Temperature
110
110
110
°C
Operating Temperature Range
-40 to +100
-40 to +100
-20 to +100
°C
Storage Temperature Range
-40 to +100
-40 to +100
-40 to +100
°C
(10 µs Pulse)
Notes:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at TA = 25°C
Symbol
Description
T-13/4
T-13/4
Low Dome
T-1
Min.
Typ.
Max.
Units
Test
Conditions
λPEAK
Peak
Wavelength
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
635
583
565
558
nm
Measurement
at Peak
λd
Dominant
Wavelength
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
626
585
569
560
nm
Note 1
∆λ3/4
Spectral Line
Halfwidth
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
40
36
28
24
nm
τs
Speed of
Respond
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
90
90
500
3100
ns
C
Capacitance
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
11
15
18
35
pF
VF = 0,
f = 1 MHz
RθJ-PIN
Thermal
Resistance
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
210
210
210
510
290
290
290
290
°C/W
Junction to
Cathode Lead
VF
Forward
Voltage
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
1.5
1.5
1.5
1.9
2.1
2.2
2.2
2.6
2.6
3.0
3.0
V
IF = 20 mA
(Figure 3)
VR
Reverse
Breakdown
Voltage
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
5.0
V
IF = 100 µA
ηv
Luminous
Efficacy
37xx
38xx
39xx
D640
3390
3490
3590
1340
1440
1540
K640
145
500
595
655
lumens
watt
Note 2
Notes:
1. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/hV , where IV is the luminous intensity in candelas and hV is
the luminous efficacy in lumens/watt.
Red, Yellow, and Green
1.0
RELATIVE INTENSITY
EMERALD GREEN
TA = 25° C
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
Figure 2. Maximum tolerable peak current vs. pulse duration. (IDC MAX as
per MAX ratings).
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. forward current.
Figure 5. Relative efficiency (luminous intensity per unit current) vs. peak
current.
Figure 6. Relative luminous intensity vs. angular displacement.
T-13/4 lamp.
Figure 7. Relative luminous intensity vs. angular displacement.
T-13/4 low profile lamp.
Intensity Bin Limits
Figure 8. Relative luminous intensity vs. angular displacement.
T-1 lamp.
Color
Bin
Intensity Range (mcd)
Min.
Max.
Red
G
9.7
15.5
H
15.5
24.8
I
24.8
39.6
J
39.6
63.4
K
63.4
101.5
L
101.5
162.4
M
162.4
234.6
N
234.6
340.0
O
340.0
540.0
P
540.0
850.0
Q
850.0
1200.0
R
1200.0
1700.0
S
1700.0
2400.0
T
2400.0
3400.0
U
3400.0
4900.0
V
4900.0
7100.0
W
7100.0
10200.0
X
10200.0
14800.0
Y
14800.0
21400.0
Z
21400.0
30900.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limits (continued)
Color Categories
Color
Bin
Intensity Range (mcd)
Min.
Max.
Color
Cat #
Lambda (nm)
Min.
Max.
Yellow
H
26.5
42.3
Emerald Green
9
552.5
555.5
I
42.3
67.7
8
555.5
558.5
J
67.7
108.2
7
558.5
561.5
K
108.2
173.2
6
561.5
564.5
L
173.2
250.0
Green
6
561.5
564.5
M
250.0
360.0
5
564.5
567.5
N
360.0
510.0
4
567.5
570.5
O
510.0
800.0
3
570.5
573.5
P
800.0
1250.0
2
573.5
576.5
Q
1250.0
1800.0
Yellow
1
582.0
584.5
R
1800.0
2900.0
3
584.5
587.0
S
2900.0
4700.0
2
587.0
589.5
T
4700.0
7200.0
4
589.5
592.0
U
7200.0
11700.0
5
592.0
593.0
V
11700.0
18000.0
Orange
1
597.0
599.5
W
18000.0
27000.0
2
599.5
602.0
Green/
A
1.1
1.8
3
602.0
604.5
Emerald
B
1.8
2.9
4
604.5
607.5
Green
C
2.9
4.7
5
607.5
610.5
D
4.7
7.6
6
610.5
613.5
E
7.6
12.0
7
613.5
616.5
F
12.0
19.1
8
616.5
619.5
G
19.1
30.7
H
30.7
49.1
I
49.1
78.5
J
78.5
125.7
K
125.7
201.1
L
201.1
289.0
M
289.0
417.0
N
417.0
680.0
O
680.0
1100.0
P
1100.0
1800.0
Q
1800.0
2700.0
R
2700.0
4300.0
S
4300.0
6800.0
T
6800.0
10800.0
U
10800.0
16000.0
V
16000.0
25000.0
W
25000.0
40000.0
Maximum tolerance for each bin limit is ±18%.
Maximum tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical
Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
01
Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
02
Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
A1
T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2
T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag
B1
T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2
T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag
BJ
T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag
EG
Ammo Pack, straight leads in 5 K increment
FH
Devices that require inventory control and 2 Iv bin select
VR
Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information.
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
Wave Soldering
Dipping
Pre-heat Temperature 105 °C Max.
–
Pre-heat Time
30 sec Max.
–
Peak Temperature
250 °C Max.
260 °C Max.
Dwell Time
3 sec Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE – °C
Manual Solder
LED Component
Lead Size
Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on soldering LED components.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
150
FLUXING
100
50
30
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4254EN
AV02-1556EN - October 13, 2008
