HLMP-4015

HLMP-40xx, HLMP-08xx T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED Lamps Data Sheet Description Features The T-1 3/4 HLMP-40xx and 2 mm by 5 mm rectangular HLMP-08xx are three leaded bicolor light sources designed for a variety of applications where dual state illumination is required in the same package. There are two LED chips, mounted on a central common cathode lead for maximum on-axis viewability. Colors between the two chips can be generated by independently pulse width modulating the LED chips. • Two color operation • Three leads with one common cathode • Option of straight or spread leads configuration • Diffused, wide visibility range Selection Guide Package Part Number Color Min. Luminous Intensity Iv (mcd) Green Red Yellow IF (mA) T-1 3/4 HLMP-4000 4.2 2.1 10 HLMP-4000#xxx 4.2 2.1 10 HLMP-4015 Green/Yellow 20.0 Rectangular HLMP-0800 Green/HER 2.6 HLMP-0805 Green/Yellow 2.6 Green/HER 20 2.1 1.4 20 20 20 Part Numbering System HLMP - X X X X # X X X Mechanical Options 002: 010: Tape & Reel, Straight Leads Right Angle Housing, Even Leads Color Options 00: High Efficiency Red (HER)/High Efficiency Green 05/15: Yellow/High Efficiency Green Package Options 40: 08: T-1 3/4 (5 mm) Rectangular Package Dimensions 2.23 (0.088) 1.98 (0.078) 5.08 (0.200) 4.57 (0.180) 8.00 (0.315) 7.37 (0.290) 9.19 (0.362) 8.43 (0.332) 25.40 (1.00) MIN. 1.27 (0.050) NOM. 0.89 (0.035) 0.64 (0.025) COMMON CATHODE 5.46 (0.215) 4.98 (0.196) 2.41 (0.095) 2.03 (0.085) 0.508 (0.020) SQ. TYP. 25.40 (1.00) MIN. SIDE VIEW 1.27 (0.050) NOM. 1.27 (0.050) NOM. 2.54 (0.100) NOM. RED OR YELLOW ANODE (SHORT LEAD) COMMON CATHODE COMMON CATHODE HLMP-40xx Pkg a Notes: 1. All dimensions are in millimeters (inches). 2. Epoxy meniscus may extend about 1 mm (0.040") down the leads.  0.508 (0.020) SQ. TYP. 1.27 (0.050) NOM. 6.10 (0.240) 5.59 (0.220) RED OR YELLOW ANODE (SHORT LEAD) HLMP-40xx Straight Leads COMMON CATHODE 2.54 (0.100) NOM. GREEN ANODE FLAT INDICATES ANODE 5.18 (0.204) 4.93 (0.194) HLMP-08xx Straight Leads GREEN ANODE Absolute Maximum Ratings at TA = 25°C Parameter HER/Green Yellow/Green Units Peak Forward Current 90 60 mA Average Forward Current[1,2] (Total) 25 20 mA DC Current[2] (Total) 30 20 mA Power Dissipation[3] (Total) 135 135 mW Operating Temperature Range –20 to +100 –20 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 °C Reverse Voltage (IR = 100 µA) 5 5 V Transient Forward Current[4] (10 µsec Pulse) 500 500 mA Notes: 1.  See Figure 5 to establish pulsed operating conditions. 2.  The combined simultaneous current must not exceed the maximum. 3.  The combined simultaneous current must not exceed the maximum. 4.  The transient peak current is the maximum non-recurring current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. Electrical/Optical Characteristics at TA = 25˚C Symbol Parameter High Efficiency Red Min. Typ. Max. Green Min. Typ. Max. Yellow Min. Typ. Max. Units Test Condition lPEAK Peak 635 568 583 nm 20 mA Wavelength ld Dominant Wavelength[1] 626 570 585 nm ts Speed of Response 90 260 90 ns C Capacitance 11 18 15 pF VF = 0, f = 1 MHz VF Forward Voltage 1.9 2.2 2.6 V 20 mA VR Reverse 5 5 5 V IR = 100 µA Voltage RqJ-PIN Thermal 210 210 210 °C/W Resistance 2q1/2 Included Angle between half luminous intensity points[2] HLMP-40xx 65 65 65 degree HLMP-08xx 100 100 100 hV Luminous 145 595 500 lm/W Efficacy[3] Notes: 2.6 3.0 2.1 20 mA Junction-to- Cathode Lead 1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the single wavelength which defines the color of the device. 2. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Radiant intensity, le, in watts steradian, may be found from the equation le = Iv/hV, where Iv is the luminous intensity in candelas and h V is the luminous efficacy in lumens/watt.  RELATIVE INTENSITY 1.0 TA = 25° C ORANGE EMERALD GREEN HIGH PERFORMANCE GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 750 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. HIGH EFFICIENCY RED, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN HIGH PERFORMANCE GREEN, EMERALD GREEN 80 HIGH EFFICIENCY RED/ORANGE 60 YELLOW 40 20 0 0 1.0 2.0 3.0 4.0 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 5.0 0 0 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage characteristics. 5 10 15 20 25 30 IDC – DC CURRENT PER LED – mA Figure 3. Relative luminous intensity vs. DC forward current. HLMP-C115 fig 3b YELLOW 1.2 EMERALD GREEN 1.1 HIGH EFFICIENCY RED/ORANGE 1.0 0.9 HIGH PERFORMANCE GREEN 0.8 0.7 0.6 0.5 0.4 0 10 20 30 40 50 60 70 80 90 IPEAK – PEAK SEGMENT CURRENT – mA Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current. HLMP-C115 Figure 4c  IPEAK MAX. IDC MAX. ηPEAK – RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) HER, ORANGE, YELLOW, HIGH PERFORMANCE GREEN, EMERALD GREEN 1.3 RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT HLMP-C115 Figure 2b 6 5 4 10 KHz 300 Hz 30 KHz 1 KHz 100 KHz 3 KHz 100 Hz 3 2 1 1.0 10 100 1000 10,000 tP – PULSE DURATION – µs Figure 5. Maximum tolerable peak current vs. pulse duration. (IDC Max. as per maximum ratings.)HLMP-40xx fig 5 20° 10° 0° 1.0 30° 0.8 40° 50° 0.6 60° 0.4 70° 0.2 80° 90° 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° Figure 6. Relative luminous intensity vs. angular displacement for HLMP-40xx. HLMP-40xx fig 6 20° 30° 40° 50° 10° 0° 1.0 0.8 0.6 60° 70° 80° 90° 0.4 0.2 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° Figure 7. Relative luminous intensity vs. angular displacement for HLMP-08xx. HLMP-40xx fig 7 Mechanical Option Matrix Mechanical Option Code Definition 002 Tape & Reel, straight leads, minimum increment 1300 pcs/bag 010 Right Angle Housing, even leads, minimum increment 500 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information.  Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. TEMPERATURE – C • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size Diagonal Plated Through Hole Diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 90 100 TIME – SECONDS Figure 8. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4264E AV02-1552EN - September 23, 2008