HLMP-4101

HLMP-4100/4101 T-13/4 (5 mm) Double Heterojunction AlGaAs Very High Intensity Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency over a wide range of drive currents. The lamp package has a tapered lens designed to concentrate the luminous flux into a narrow radiation pattern to achieve a very high intensity. The LED color is deep red at the dominant wavelength of 637 nanometers. These lamps may be DC or pulse driven to achieve desired light output. • 1000 mcd at 20 mA • Very high intensity at low drive currents • Narrow viewing angle • Outstanding material efficiency • Low forward voltage • CMOS/MOS compatible • TTL compatible • Deep red color Applications • Bright ambient lighting conditions • Emitter/detector and signaling applications Package Dimensions • General use 0.89 (0.035) 0.64 (0.025) 6.10 (0.240) 5.59 (0.220) 0.46 (0.018) SQUARE NOMINAL 1.32 (0.052) 1.02 (0.040) 5.08 (0.200) 4.57 (0.180) CATHODE 2.54 (0.100) NOMINAL 9.19 (0.362) 8.43 (0.332) 1.27 (0.050) NOM. 13.25 (0.522) 12.45 (0.490) 23.0 (0.90) MIN. Selection Guide Luminous Intensity Iv (mcd) at 20 mA Device HLMP- Min. Typ. Max. 2θ1/2 [1] Degree 4100 500.0 750.0 – 8 4101 700.0 1000.0 – 8 4101-ST0xx 1400.0 2700.0 4000.0 8 Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Part Numbering System HLMX - 4 1 XX - X X X XX Mechanical Option 00: Bulk Color Bin Options 0: Full color bin distribution Maximum Iv Bin Options 0: Open (No. max. limit) Others: Please refer to the Iv bin Table Minimum Iv Bin Options Please refer to the Iv bin Table Brightness Level 00: Lower brightness 01: Higher brightness Notes: 1. ‘0’ indicates no maximum intensity limit. 2. ‘0’ indicates full color distribution. 2 Absolute Maximum Ratings at TA = 25°C Parameter Maximum Rating Units Peak Forward Current[1, 2] 300 mA Average Forward Current[2] 20 mA DC Current[3] 30 mA Power Dissipation 87 mW Reverse Voltage (IR = 100 μA) 5 V Transient Forward Current (10 μs Pulse)[4] 500 mA Operating Temperature Range -20 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Refer to Figure 6 to establish pulsed operating conditions. 3. Derate linerally as shown in Figure 5. 4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. Electrical/Optical Characteristics at TA = 25°C Symbol Description VF Forward Voltage VR Reverse Breakdown Voltage λPEAK Min. Typ. Max. Units Test Conditions 1.8 2.42 V 20 mA 15.0 V IR = 100 μA Peak Wavelength 650 nm Measurement at Peak λd Dominant Wavelength 642 nm Note 1 Δλ1/2 Spectral Line Halfwidth 20 nm τs Speed of Response 30 ns Exponential Time Constant, e-t/2 C Capacitance 30 pF VF = 0; f = 1 MHz θJc Thermal Resistance 220 °C/W Junction to Cathode Lead ηV Luminous Efficacy 80 l m/W Note 2 5.0 Notes: 1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device. 2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is luminous efficacy in lumens/watt. 3. The approximate total luminous flux output within a cone angle of 2θ about the optical axis, φv(2θ), may be obtained from the following formula: φv(2θ) = [φv(θ)/Iv(0)]Iv; Where: φv(θ)/Iv(0) is obtained from Figure 7. 3 IF – FORWARD CURRENT – mA RELATIVE INTENSITY 1.0 0.5 0 0 600 650 700 300 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 0.5 WAVELENGTH – nm 1.0 1.5 2.0 2.5 3.5 3.0 VF – FORWARD VOLTAGE – V Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. ηV – RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) 1.2 1.4 NORMALIZED LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 1.0 0.8 0.6 0.4 0.2 0 5 10 IDC – DC FORWARD CURRENT – mA Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Relative efficiency vs. peak forward current. 10 100 z 4 1 300 H Figure 5. Maximum forward dc current vs. ambient temperature derating based on TJ MAX. = 110°C. 1 1 KHz TA – AMBIENT TEMPERATURE – C z 0 10 20 30 40 50 60 70 80 90 100 110 RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED MAXIMUM DC CURRENT 2 3 KHz 0 3 10 KH 5 IPEAK MAX. IDC MAX. IF – FORWARD CURRENT – mA RθJ-A = 689C/W 10 4 Hz 100 RθJ-A = 574C/W 5 ATE – 15 RθJ-A = 559C/W SH R 20 10 9 8 7 6 EFRE 25 200 300 100 f–R 30 50 IPEAK – PEAK FORWARD CURRENT – mA 40 35 20 1000 10000 tp – PULSE DURATION – s Figure 6. Maximum tolerable peak current vs. peak duration (IPEAK MAX. determined from temperature derated IDC MAX.). 10 20 0 40 0.14 0.135 0.12 50 60 0.10 0.08 70 0.06 0.04 80 0.02 90 0 NORMALIZED INTENSITY 10 20 30 40 50 60 70 80 0 90 100 ϕN (θ) LUMINOUS FLUX TO INTENSITY RATIO WITHIN A GIVEN CONE ANGLE IV (0) 30 θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE) Figure 7. Relative luminous intensity vs. angular displacement. Intensity Bin Limits Color Red Bin Intensity Range (mcd) Min. Max. P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Maximum tolerance for each bin limit is ±18%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 5 Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size Diagonal Plated Through Hole Diameter Lead size (Typical) 0.45 x 0.45 mm (0.018 x 0.018 in) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shearoff area (max) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (Typical) 0.50 x 0.50 mm (0.020 x 0.020 in) 0.707 mm (0.028 in) Dambar shearoff area (max) 0.70 mm (0.028 in) 0.99 mm (0.039 in) Note: For more information on soldering LED components, refer to application note AN1027. Note:s 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 50 PREHEAT 0 10 20 30 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 40 50 60 TIME (SECONDS) 70 80 1.05 to 1.15 mm (0.041 to 0.045 in) 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Figure 8. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. AV02-1560EN - May 27, 2015