HLMP-4740-A0002

Data Sheet HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Description These Broadcom® tinted diffused LED lamps are designed and optimized specifically for low DC current operation. Luminous intensity and forward voltage are tested at 2 mA to assure consistent brightness at TTL output current levels. Features         Low power High efficiency CMOS-MOS compatible TTL compatible Wide viewing angle Choice of package styles Choice of colors AlInGaP LED technology Applications     Broadcom Low power DC circuits Telecommunications indicators Portable equipment Keyboard indicators AV02-1557EN August 9, 2021 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Figure 1: Package Dimensions A – HLMP-4700, 4719, 4740 0.89 (0.035) 0.64 (0.025) 6.10 (0.240) 5.59 (0.220) SQUARE TYP. 0.55 (0.022) 0.40 (0.016) 0.65 (0.026) MAX. 5.08 (0.200) 4.57 (0.180) 9.19 (0.362) 8.43 (0.332) CATHODE 1.27(0.050) NOM. 25.40 (1.00) MIN. 2.54 (0.100) NOM. B – HLMP-1700, 1719, 1790 1.14 (.045) 0.51 (.020) 3.43 (.135) 2.92 (.115) ‡ 24.1 (.95) MIN. CATHODE 0.65 (0.026) MAX. 1.52 (.060) 1.02 (.040) 2.79 (.110) 2.29 (.090) 3.17 (.125) 2.67 (.105) 4.70 (.185) 4.19 (.165) (0.022) 0.55 SQUARE TYP. (0.016) 0.40 6.35 (.250) 5.58 (.220) NOTE: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads. 3. For PCB hole recommendations, see Precautions. Broadcom AV02-1557EN 2 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Device Selection Guide (TJ = 25°C, IF = 2 mA) Package Description T-1¾ Tinted Diffused Luminous Intensity, IV (mcd) a, b Color Red Yellow Green T-1 Tinted Diffused Red Yellow Green Part Number HLMP-4700 Min. Typ. Max. Viewing Angle 2½c 1.3 2.3 — 50 A 50 B HLMP-4700-C0002 1.3 2.3 — HLMP-4700-C00B2 1.3 2.3 — HLMP-4719 0.9 2.1 — HLMP-4719-A0002 0.9 2.1 — HLMP-4719-A00B2 0.9 2.1 — HLMP-4740 1.0 2.3 — HLMP-4740-A0002 1.0 2.3 — HLMP-4740-A00B1 1.0 2.3 — HLMP-4740-A00B2 1.0 2.3 — HLMP-1700 0.8 2.1 — HLMP-1700-B0002 0.8 2.1 — HLMP-1700-B00A1 0.8 2.1 — HLMP-1700-B00A2 0.8 2.1 — HLMP-1719 0.9 2.1 — HLMP-1719-A0002 0.9 2.1 — HLMP-1719-A00A1 0.9 2.1 — HLMP-1719-A00A2 0.9 2.1 — HLML-1790 1.0 2.3 — HLMP-1790-A0002 1.0 2.3 — HLMP-1790-A00A1 1.0 2.3 — HLMP-1790-A00A2 1.0 2.3 — Package Drawing a. The luminous intensity, IV, is measured at the mechanical axis of the package and it is tested with a single current pulse condition. b. The optical axis is closely aligned with the mechanical axis of the package. c. ½ is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity. Absolute Maximum Ratings Parameter Power Dissipation (Derate linearly from 92°C at 1.0 mA/°C) Red Maximum Rating Units 14 mW Yellow 17.5 Green 15.4 DC and Peak Forward Current 7 mA Reverse Voltage (IR = 50 µA) 5.0 V –40 to 100 °C Operating Temperature Range Red/Yellow Green Storage Temperature Range Broadcom –20 to 100 –40 to +100 °C AV02-1557EN 3 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Electrical/Optical Characteristics at TA = 25°C Symbol Description T-1¾ T-1 Min. Typ. Max. VF Forward Voltage 4700 1700 — 1.9 2.0 4719 1719 — 1.9 2.5 4740 1790 — 1.9 2.2 4700 1700 5.0 — — 4719 1719 5.0 — — 4740 1790 5.0 — — 4700 1700 — 626 — 4719 1719 — 589 — 4740 1790 — 569 — 4700 1700 — 14 — 4719 1719 — 12 — 4740 1790 — 13 — 4700 1700 — 90 — 4719 1719 — 90 — 4740 1790 — 500 — 4700 1700 — 11 — 4719 1719 — 15 — 4740 1790 — 18 4700 1700 — 260 b — 4719 1719 — 290c — 4740 1790 — 4700 1700 — 632 — 4719 1719 — 590 — 4740 1790 — 570 — 4700 1700 — 180 — 4719 1719 — 500 — 4740 1790 — 640 — VR Reverse Breakdown Voltage d Dominant Wavelength ½ Spectral Line Halfwidth S Speed of Response C Capacitance RJ-PIN Thermal Resistance PEAK Peak Wavelength Luminous Efficacy hV Units Test Conditions V 2 mA V IR = 50 µA nm Note a nm ns pF VF = 0, f = 1 MHz — °C/W Junction to Cathode Lead — nm Measurement at Peak lumens/ Note d watt a. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. b. T-1¾. c. T-1. d. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV / V, where IV is the luminous intensity in candelas and V is luminous efficacy in lumens/watt. Broadcom AV02-1557EN 4 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Part Numbering System H L M P - Code Description x1 Package Type x2 x3 x1 7 Color x2 x3 - x4 x5 x6 x7 x8 Option 1 T-1 (3 mm) 4 T - 1¾ (5 mm) 00 Red 19 Yellow 40 Green 90 Green x4 Minimum Intensity Bin See Intensity Bin Limits x5 Maximum Intensity Bin 0 Open bins (no maximum IV bin limit) Others See Intensity Bin Limits 0 Full distribution 00 Bulk (loose forms packaging) 01 Tape and Reel, Crimped Leads x6 Color Bin Option x7 x8 Packing Option NOTE: Broadcom 02 Tape and Reel, Straight Leads A1, B1 Right-Angle Housing, Uneven Leads A2, B2 Right-Angle Housing, Even Leads FH 2 IV Bins Selection with Inventory Control For part number HLMP-xxxx (for example, HLMP-1790), the packing option is in loose form (bulk). AV02-1557EN 5 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Bin Information Intensity Bin Limits Intensity Bin Limits Intensity Range (mcd) Color Red Intensity Range (mcd) Bin Min. Max. Color Yellow Bin Min. Max. B 0.9 1.5 A 1.0 1.6 C 1.5 2.4 B 1.6 2.5 D 2.4 3.8 C 2.5 4.0 E 3.8 6.1 D 4.0 6.5 F 6.1 9.7 E 6.5 10.3 G 9.7 15.5 F 10.3 16.6 H 15.5 24.8 G 16.6 26.5 I 24.8 39.6 H 26.5 42.3 J 39.6 63.4 I 42.3 67.7 K 63.4 101.5 J 67.7 108.2 L 101.5 162.4 K 108.2 173.2 M 162.4 234.6 L 173.2 250.0 N 234.6 340.0 M 250.0 360.0 O 340.0 540.0 N 360.0 510.0 P 540.0 850.0 O 510.0 800.0 Q 850.0 1200.0 P 800.0 1250.0 R 1200.0 1700.0 Q 1250.0 1800.0 S 1700.0 2400.0 R 1800.0 2900.0 T 2400.0 3400.0 S 2900.0 4700.0 U 3400.0 4900.0 T 4700.0 7200.0 V 4900.0 7100.0 U 7200.0 11700.0 W 7100.0 10200.0 V 11700.0 18000.0 X 10200.0 14800.0 W 18000.0 27000.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Maximum tolerance for each bin limit is ±18%. Maximum tolerance for each bin limit is ±18%. Broadcom AV02-1557EN 6 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet Intensity Bin Limits T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Color Categories Intensity Range (mcd) Color Green Bin Min. Max. Color Category Number Green Lambda (nm) Min. Max. A 1.1 1.8 6 561.5 564.5 B 1.8 2.9 5 564.5 567.5 C 2.9 4.7 4 567.5 570.5 D 4.7 7.6 3 570.5 573.5 E 7.6 12.0 2 573.5 576.5 F 12.0 19.1 1 582.0 584.5 G 19.1 30.7 Yellow 3 584.5 587.0 H 30.7 49.1 2 587.0 589.5 I 49.1 78.5 4 589.5 592.0 J 78.5 125.7 5 592.0 593.0 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Tolerance for each bin limit is ±0.5 nm. Maximum tolerance for each bin limit is ±18%. Packaging Option Matrix Option Code 00 NOTE: Broadcom Definition Bulk Packaging, minimum increment 500 pieces/bag 01 Tape and Reel, crimped leads, minimum increment 1300 pieces/reel for T-1¾, 1800 pieces/reel for T-1 02 Tape and Reel, straight leads, minimum increment 1300 pieces/reel for T-1¾, 1800 pieces/reel for T-1 A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pieces/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 pieces/bag B1 T-1¾, Right Angle Housing, uneven leads, minimum increment 500 pieces/bag B2 T-1¾, Right Angle Housing, even leads, minimum increment 500 pieces/bag FH Devices that require inventory control and 2 Iv bin select All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom representative for further clarification/information. AV02-1557EN 7 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Figure 2: Relative Intensity vs. Wavelength 1 RELATIVE INTENSITY 0.9 GREEN 0.8 YELLOW 0.7 RED 0.6 0.5 0.4 0.3 0.2 0.1 0 450 500 550 600 650 700 750 WAVELENGTH - nm Figure 3: Forward Current vs. Forward Voltage Figure 4: Relative Luminous Intensity vs. Forward Current 6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 mA) RED, YELLOW 6 4 GREEN 2 0 GREEN 5 8 0 0.5 1 1.5 2 3 RED 2 1 0 2.5 YELLOW 4 0 2 FORWARD VOLTAGE - V Figure 5: Relative Luminous Intensity vs. Angular Displacement for T-1¾ Lamp 20° 10° 0° 1.0 20° 80° 90° Broadcom 40° 0.8 0.6 0.4 0.2 0.0 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° RELATIVE INTENSITY 70° 8 10 10° 0° 1.0 30° 50° 60° 6 Figure 6: Relative Luminous Intensity vs. Angular Displacement for T-1 Lamp 30° 40° 4 DC FORWARD CURRENT - mA 0.8 50° 60° 70° 80° 90° 0.6 0.4 RELATIVE INTENSITY FORWARD CURRENT - mA 10 0.2 0.0 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° AV02-1557EN 8 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Packaging Label (i) Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code Broadcom AV02-1557EN 9 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet Precautions T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps  Lead Forming    Preform or cut the leads of an LED lamp to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Do this action for hand solder operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, do this under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED.   NOTE: 1. PCBs with different sizes and design s(component density) have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. Recalibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Over- stressing the LED during soldering process might cause premature failure to the LED due to delamination.    1.59 mm Apply ESD precaution on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. Use a soldering iron with a grounded tip to ensure that electrostatic charge is properly grounded. Use the following soldering conditions. Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform a daily check on the soldering profile to ensure that it conforms to the recommended soldering conditions.  Loosely fit any alignment fixture that is being applied during wave soldering, and do not apply weight or force on the LED. Use non-metal material because it will absorb less heat during the wave soldering process. At elevated temperatures, LED is more susceptible to mechanical stress. Therefore, allows the PCB to cool down to room temperature prior to handling, which includes removal of the alignment fixture or pallet. If PCB board contains both through hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If surface mount must be on the bottom side, solder these components using reflow soldering prior to insertion of the TH LED. Use the following PC board plated through holes (PTH) size for LED component leads. LED Component Plated ThroughDiagonal Hole Diameter Lead Size Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm (0.018 × 0.018 in.) (0.025 in.) (0.039 to 0.043 Dambar shear- 0.65 mm 0.919 mm in.) Wave Solderinga, b Manual Solder Dipping Pre-heat Temperature 105°C max. — Pre-heat Time 60s Max. — Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm (0.020 × 0.020 in.) (0.028 in) (0.041 to 0.045 Dambar shear- 0.70 mm (0.028 0.99 mm in.) Peak Temperature 250°C max. 260°C max. off area (max.) in.) Dwell Time 3s max. 5s max. a. The preceding conditions refer to measurements with the thermocouple mounted at the bottom of the PCB. off area (max.) (0.026 in) NOTE: (0.036 in) (0.039 in.) Refer to application note AN1027 for more information on soldering LED components. b. Use only bottom preheaters to reduce thermal stress experienced by the LED. Broadcom AV02-1557EN 10 HLMP-4700, HLMP-4719, HLMP-4740 HLMP-1700, HLMP-1719, HLMP-1790 Data Sheet  T-1¾ (5 mm), T-1 (3 mm), Low Current LED Lamps Over-sizing the PTH can lead to a twisted LED after clinching. Under-sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. Figure 7: Example of Wave Soldering Temperature Profile for TH LED LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 50 PREHEAT Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. AV02-1557EN 11 Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2014–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.