HLMP-AB86

HLMP-AD85, HLMP-AD87, HLMP-AM86, HLMP-AM87, HLMP-AB86, HLMP-AB87 Precision Optical Performance �e��� �reen an� �l�e 5mm Mini Oval ���s Data Sheet Description These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminium Indium Gallium Phosphide (AlInGaP) for red and Indium Gallium ��itride (InGa��) for blue and green. Each lamp is made with an advance optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-A and UV-� inhibitors to reduce the effects of long term exposure to direct sunlight. Features • • • • • Well defined spatial radiation pattern High brightness material Available in red, green and blue color - Red AlInGaP 630nm - Green InGa�� ���nm Green InGa�� ���nm - �lue InGa�� ��0nm �lue InGa�� ��0nm Superior resistance to moisture Tinted and diffused Benefits • Viewing angle designed for wide field of view applications • Superior performance for outdoor environments. Applications • Full color signs • Commercial outdoor advertising Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions A 8.70±0.20 .342±.008 CATHODE LEAD NOTE 1 5.20±0.2 .205±.008 2.54±0.3 0.100±0.012 0.4±0.1 0.016±0.00 24.00MIN. 0.945 1.0MIN. 0.038 Measured at base of lens 3.80±0.20 .150±.008 0.8MAX. Epoxy Meniscus .016. 0.50±0.10 0.020±0.004 B 11.50±0.20 0.453±.008 8.70±0.20 0.342±.008 24.00 0.945 1.0MIN. 0.038 Measured at base of lens 1.25±0.20 0.049±0.008 3.8±0.2 .150±.008 CATHODE LEAD 2.54±0.3 0.100±0.012 0.50±0.10 0.020±0.004 0.40±0.10 0.016±0.00 5.20±0.20 0.205±.008 0.8MAX. Epoxy 0.032 ��OTES: Dimensions in Millimeters (Inches) For �lue and Green if heat-sinking application is required, the terminal for heat sink is anode. � Device Selection Guide Typ. Dominant Wavelength ld (nm) 630 630 ��� ��� ��0 ��0 Luminous Intensity Iv (cd) at 20mA Min. 1.�0 1.�0 �.�0 �.�0 0.�� 0.�� Max. �.�0 �.�0 �.�0 �.�0 1.�0 1.�0 Lens Type Tinted, diffused Tinted, diffused Tinted, diffused Tinted, diffused Tinted, diffused Tinted, diffused Standoffs ��o Yes ��o Yes ��o Yes Part Number HLMP-AD8�-RU0xx HLMP-AD8�-RU0xx HLMP-AM86-TW0xx HLMP-AM8�-TW0xx HLMP-A�86-MQ0xx HLMP-A�8�-MQ0xx Color Red Red Green Green �lue �lue Package Drawing A � A � A � ��otes: 1. Tolerance for luminous intensity measurement is ±1�% �. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. �. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp. �. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. Part Numbering System H L M P - x x 8x - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack ZZ: Flexi-Bin, Ammo pack Color Bin Options 0: Full color bin distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B: Blue 470nm M: Green 525nm D: Red 630nm Package A: 5mm Mini Oval 3 Absolute Maximum Rating at TA = 25oC Parameters DC forward current [1] Peak pulsed forward current Power dissipation LED junction temperature Operating temperature range Storage temperature range ��otes: 1. Derate linearly as shown in figure 3 and figure �. �. Duty factor 10%, frequency 1KHz. 3. Duty factor 30%, frequency 1KHz. Blue and Green 30 100 [�] 116 130 -�0 to +8� -�0 to +100 Red �0 100 [3] 1�0 130 -�0 to +100 -�0 to +1�0 Unit mA mA mW oC oC oC Electrical/Optical Characteristics TA = 25oC Parameters Forward voltage Red Green �lue Reverse Voltage Red Green �lue Thermal resistance [1] Dominant wavelength [�, 3] Red Green �lue Peak wavelength Red Green �lue Spectral half width Red Green �lue Luminous Efficacy [�] Red Green �lue Luminous Flux Red Green �lue Luminous Efficiency [�] Red Green �lue Symbol VF Value Min. �.0 �.8 �.8 �.0 �.0 �.0 Typ. �.�0 3.3 3.� Max. �.�0 3.8� 3.8� Units V Test Condition IF = �0 mA VR RqJ-PI�� ld V ��0 6�� ��0 �60 630 ��� ��0 639 �16 �6� 1� 3� �3 1�� ��0 �� 1300 3000 600 30 �0 10 63� ��0 �80 oC/W IR = 100 mA IR = 10 mA IR = 10 mA LED Junction-to-pin IF = �0 mA nm lPEAK nm Peak of wavelength of spectral distribution at IF = �0 mA Wavelength width at spectral distribution 1/� power point at IF = �0 mA Emitted luminous power/Emitted radiant power Dl1/� nm hv lm/W jV mlm IF = �0 mA he lm/W Luminous Flux/Electrical Power IF = �0 mA ��otes: 1. For AlInGaP Red, the thermal resistance applied to LED junction to cathode lead. For InGa�� �lue and Green, the thermal resistance applied to LED junction to anode lead. �. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp. 3. Tolerance for each color bin limit is ±0.� nm �. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. �. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. � AlInGaP Red 1.0 50 40 30 20 10 0 0.5 0 IF - FORWARD CURRENT - mA RELATIVE INTENSITY 550 600 650 700 0 WAVELENGTH – nm 0.5 1.0 1.5 2.0 2.5 V F - FORWARD VOLTAGE - V 3.0 Figure 1. Relative intensity vs. wavelength MAXIMUM FORWARD CURRENT - mA 60 50 40 30 20 10 0 Figure 2. Forward current vs. forward voltage 2.5 2.0 RELATIVE INTENSITY (NORMALIZED AT 20 mA) 1.5 1.0 0.5 0 MAX. - 0 IF 20 40 60 80 100 TA- AMBIENT TEMPERATURE - o C 0 10 30 20 40 FORWARD CURRENT - mA 50 Figure 3. Forward current vs. ambient temperature Figure 4. Relative luminous intensity vs. forward current InGaN Blue and Green 1.00 0.80 RELATIVE INTENSITY BLUE 0.60 0.40 0.20 0 350 FORWARD CURRENT - mA GREEN 35 I F – MAXIMUM FORWARD CURRENT – mA 35 30 25 20 15 10 5 0 0 20 40 60 80 100 30 25 20 15 10 5 0 0 1 2 3 4 FORWARD VOLTAGE - V 400 450 500 550 600 650 WAVELENGTH - nm TA – AMBIENT TEMPERATURE – °C Figure 5. Relative Intensity vs. Wavelength Figure 6. Forward current vs. forward voltage. Figure 7. Forward Current vs. Ambient Temperature. � 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 RELATIVE DOMINANT WAVELENGTH 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA 1.020 1.015 1.010 GREEN 1.005 BLUE 1.000 0.995 0 10 20 30 FORWARD CURRENT, mA Figure 8. Relative intensity vs. forward current Figure 9.Relative dominant wavelength vs. DC forward current 1 NORMALIZED INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 10. Spatial radiation pattern for RGB – major axis 1 NORMALIZED INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 11. Spatial radiation pattern for RGB – minor axis 6 Intensity Bin Limit Table �in M �� P Q R S T U V W Intensity (mcd) at �0 mA Min ��0 680 880 11�0 1�00 1900 ��00 3�00 ��00 ��00 Max 680 880 11�0 1�00 1900 ��00 3�00 ��00 ��00 ��00 Blue Color Bin Table Bin 1 Min Dom �60.0 Max Dom �6�.0 Xmin 0.1��0 0.1818 � �6�.0 �68.0 0.13�� 0.1�66 3 �68.0 ���.0 0.1�91 0.1699 � ���.0 ��6.0 0.118� 0.1616 � ��6.0 �80.0 0.1063 0.1�1� Tolerance for each bin limit is ±0.� nm Ymin 0.0�9� 0.090� 0.03�� 0.0966 0.0�9� 0.106� 0.06�1 0.1�09 0.09�� 0.1��3 Xmax 0.1�66 0.13�� 0.1699 0.1�91 0.1616 0.118� 0.1�1� 0.1063 0.139� 0.0913 Ymax 0.0966 0.03�� 0.106� 0.0�9� 0.1�09 0.06�1 0.1��3 0.09�� 0.1��8 0.13�� Tolerance for each bin limit is ± 1�% Green Color Bin Table Bin 1 Min Dom ��0.0 Max Dom ���.0 Xmin 0.0��3 0.16�0 � ���.0 ��8.0 0.1060 0.18�6 3 ��8.0 �3�.0 0.138� 0.�068 � �3�.0 �36.0 0.1�0� 0.���3 � �36.0 ��0.0 0.�003 0.��69 Tolerance for each bin limit is ±0.� nm Ymin 0.8338 0.6�86 0.8�9� 0.6��6 0.81�8 0.6�63 0.�96� 0.63�� 0.��6� 0.6�13 Xmax 0.18�6 0.1060 0.�068 0.138� 0.���3 0.1�0� 0.��69 0.�003 0.�6�9 0.��96 Ymax 0.6��6 0.8�9� 0.6�63 0.81�8 0.63�� 0.�96� 0.6�13 0.��6� 0.60�0 0.���3 Red Color Bin Table Bin Min Dom 6�� Max Dom 63� Xmin 0.690� 0.6��6 Tolerance for each bin limit is ± 0.� nm Ymin 0.309� 0.3106 Xmax 0.69�� 0.�13� Ymax 0.�888 0.�86� � Avago Color Bin on CIE 1931 Chromaticity Diagram. 1.000 0.800 Green 1 2 3 4 5 0.600 Y 0.400 Red 0.200 5 4 3 0.000 0.000 0.100 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800 2 1 Blue 10 RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25°C) GREEN 1 RED BLUE 0.1 -40 -20 0 20 40 60 80 100 120 T J - JUNCTION TEMPERATURE - °C 8 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. ��ote: 1. PC� with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PC�. �. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed ��0°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PC� assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PC�. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.�9mm. Soldering the LED using soldering iron tip closer than 1.�9mm might damage the LED. 1.�9mm CATHODE ANODE AlInGaP Device InGaN Device • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note A�� 11�� for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Pre-heat temperat�re Preheat time Peak temperat�re �well time 105 °C Max. 60 sec Max 250 °C Max. 3 sec Max. Manual Solder Dipping 260 °C Max. 5 sec Max • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. ��on metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PC� must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PC� board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PC�. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size 0.45 x 0.45 mm (0.018x 0.018 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) Diagonal 0.636 mm (0.025 inch) 0.707 mm (0.028 inch) Plated through hole diameter 0.98 to 1.08 mm (0.039 to 0.043 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ��ote: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. ��ote: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PC�. �) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. 9 Refer to application note A���33� for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 150 100 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.5 ± 1.00 (0.8071 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES). A VIEW A–A A ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff. 10 Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + AN OD E TEC ANODE LEAD LEAVES THE BOX FIRST. O AG ES AV LOGI O HN CA TH OD E – C T MO HE RL AB EL Note: For InGa�� device, the ammo pack packaging box contains ESD logo. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information REV: DeptID: Made In: Country of Origin 11 (ii) Avago �aby Label (Only available on bulk packaging) RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: CAT: Intensity Bin BIN: Refer to below information DATECODE: Date Code QUANTITY: Packing Quantity Acronyms and Definition: �I��: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF �in (Applicable for part number that have both color bin and VF bin) Example: (i) Color bin only or VF bin only �I��: � (represent color bin � only) �I��: V� (represent VF bin “V�” only) (ii) Color bin incorporate with VF �in �I��: �V� V�: VF bin “V�” �: Color bin � only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For pro��ct information an� a complete list of �istrib�tors�� please go to o�r web site: www.avagotech.com Avago�� Avago Technologies�� an� the A logo are tra�emarks of Avago Technologies�� Pte. in the Unite� States an� other co�ntries. �ata s�bject to change. Copyright © 2006 Avago Technologies Pte. All rights reserve�. Obsoletes AV01-0304�N AV02-0388�N - J�ly 11�� 2007