HLMP-AD85, HLMP-AD87, HLMP-AM86,
HLMP-AM87, HLMP-AB86, HLMP-AB87
Precision Optical Performance Red,
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and Blue
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5mm Mini Oval LEDs
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Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and passenger
information signs. The oval shaped radiation pattern and
high luminous intensity ensure these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
These lamps have very smooth, matched radiation
patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle
of the sign. High efficiency LED material is used in these
lamps: Aluminium Indium Gallium Phosphide (AlInGaP) for
red and Indium Gallium Nitride (InGaN) for blue and green.
Each lamp is made with an advance optical grade epoxy
offering superior high temperature and high moisture
resistance in outdoor applications.
•
•
•
•
•
The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct
sunlight.
Applications
Well defined spatial radiation pattern
High brightness material
Available in red, green and blue color
- Red AlInGaP 630nm
- ������������
Green InGaN 525nm
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- �����������
Blue InGaN 470nm
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Superior resistance to moisture
Tinted and diffused
Benefits
• Viewing angle designed for wide field of view
applications
• Superior performance for outdoor environments.
• Full color signs
• Commercial outdoor advertising
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
A
24.00MIN.
0.945
1.0MIN.
0.038
8.70±0.20
.342±.008
Measured at base of lens
3.80±0.20
.150±.008
CATHODE LEAD
NOTE 1
2.54±0.3
0.100±0.012
5.20±0.2
.205±.008
B
24.00
0.945
11.50±0.20
0.453±.008
8.70±0.20
0.342±.008
1.25±0.20
0.049±0.008
0.016±0.00
1.0MIN.
0.038
Measured at base of lens
3.8±0.2
.150±.008
CATHODE LEAD
2.54±0.3
5.20±0.20
0.205±.008
0.100±0.012
0.8MAX. Epoxy
0.032
0.50±0.10
0.020±0.004
NOTES:
Dimensions in Millimeters (Inches)
For Blue and Green if heat-sinking application is required, the terminal for heat sink is anode.
0.4±0.1
0.50±0.10
0.020±0.004
0.8MAX. Epoxy Meniscus
.016.
0.40±0.10
0.016±0.00
Device Selection Guide
Part Number
Color
Typ. Dominant
Wavelength
ld (nm)
HLMP-AD85-RU0xx
Red
HLMP-AD87-RU0xx
Luminous
Intensity Iv
(cd) at 20mA
Min.
Max.
Lens Type
Standoffs
Package
Drawing
630
1.50
4.20
Tinted, diffused
No
A
Red
630
1.50
4.20
Tinted, diffused
Yes
B
HLMP-AM86-TW0xx
Green
525
2.50
7.20
Tinted, diffused
No
A
HLMP-AM87-TW0xx
Green
525
2.50
7.20
Tinted, diffused
Yes
B
HLMP-AB86-MQ0xx
Blue
470
0.52
1.50
Tinted, diffused
No
A
HLMP-AB87-MQ0xx
Blue
470
0.52
1.50
Tinted, diffused
Yes
B
Notes:
1. Tolerance for luminous intensity measurement is ±15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp.
5. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper
safety equipment.
Part Numbering System
H L M P - x x 8x - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
ZZ: Flexi-Bin, Ammo pack
Color Bin Options
0: Full color bin distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: Blue 470nm
M: Green 525nm
D: Red 630nm
Package
A: 5mm Mini Oval
Absolute Maximum Rating at TA = 25oC
Parameters
Blue and Green
Red
Unit
DC forward current [1]
30
50
mA
Peak pulsed forward current
Power dissipation
100 [2]
100 [3]
116
120
mA
mW
LED junction temperature
Operating temperature range
Storage temperature range
130
-40 to +85
-40 to +100
130
-40 to +100
-40 to +120
oC
oC
oC
Notes:
1. Derate linearly as shown in figure 3 and figure 7.
2. Duty factor 10%, frequency 1KHz.
3. Duty factor 30%, frequency 1KHz.
Electrical/Optical Characteristics TA = 25oC
Parameters
Forward voltage
Red
Green
Blue
Reverse Voltage
Red
Green
Blue
Thermal resistance [1]
Dominant wavelength [2, 3]
Red
Green
Blue
Peak wavelength
Red
Green
Blue
Spectral half width
Red
Green
Blue
Luminous Efficacy [4]
Red
Green
Blue
Luminous Flux
Red
Green
Blue
Luminous Efficiency [5]
Red
Green
Blue
Value
Min.
Typ.
Max.
Units
Test Condition
VF
2.0
2.8
2.8
2.20
3.3
3.2
2.40
3.85
3.85
V
IF = 20 mA
VR
5.0
5.0
5.0
Symbol
RqJ-PIN
ld
240
622
520
460
oC/W
IR = 100 mA
IR = 10 mA
IR = 10 mA
LED Junction-to-pin
nm
IF = 20 mA
nm
Peak of wavelength of spectral
distribution at IF = 20 mA
nm
Wavelength width at spectral
distribution 1/2 power point at IF
= 20 mA
V
630
525
470
634
540
480
lPEAK
639
516
464
Dl1/2
17
32
23
hv
155
520
75
lm/W
Emitted luminous power/Emitted
radiant power
jV
1300
3000
600
mlm
IF = 20 mA
he
30
50
10
lm/W
Luminous Flux/Electrical Power
IF = 20 mA
Notes:
1. For AlInGaP Red, the thermal resistance applied to LED junction to cathode lead. For InGaN Blue and Green, the thermal resistance applied to LED
junction to anode lead.
2. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp.
3. Tolerance for each color bin limit is ±0.5 nm
4. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the
luminous efficacy in lumens/watt.
5. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
AlInGaP Red
50
IF - FORWARD CURRENT - mA
RELATIVE INTENSITY
1.0
0.5
0
550
600
650
40
30
20
10
0
700
0.5
1.0
1.5
2.0
2.5
V F - FORWARD VOLTAGE - V
0
WAVELENGTH – nm
Figure 2. Forward current vs. forward voltage
2.5
50
2.0
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
60
40
30
20
10
0
0
IF
MAX. -
MAXIMUM FORWARD CURRENT - mA
Figure 1. Relative intensity vs. wavelength
3.0
1.5
1.0
0.5
0
20
40
60
80
100
TA- AMBIENT TEMPERATURE - o C
Figure 3. Forward current vs. ambient temperature
0
10
30
20
40
FORWARD CURRENT - mA
50
Figure 4. Relative luminous intensity vs. forward
current
InGaN Blue and Green
1.00
BLUE
FORWARD CURRENT - mA
RELATIVE INTENSITY
GREEN
0.60
0.40
0.20
400
450
500
550
600
WAVELENGTH - nm
Figure 5. Relative Intensity vs. Wavelength
I F – MAXIMUM FORWARD CURRENT – mA
30
0.80
0
350
35
35
650
25
20
15
10
5
0
0
1
2
3
4
FORWARD VOLTAGE - V
Figure 6. Forward current vs. forward voltage.
30
25
20
15
10
5
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 7. Forward Current vs. Ambient Temperature.
1.020
1.4
1.2
RELATIVE DOMINANT
WAVELENGTH
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.6
1.0
0.8
0.6
0.4
1.015
1.010
GREEN
1.005
BLUE
1.000
0.2
0
0.995
0
5
10
15
20
25
30
Figure 8. Relative intensity vs. forward current
NORMALIZED INTENSITY
0.5
0
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Spatial radiation pattern for RGB – major axis
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
Figure 11. Spatial radiation pattern for RGB – minor axis
10
20
30
Figure 9.Relative dominant wavelength vs. DC forward current
1
-90
0
FORWARD CURRENT, mA
DC FORWARD CURRENT - mA
60
90
Intensity Bin Limit Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
Min
Max
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
M
520
680
0.1818
0.0904
0.1374
0.0374
N
680
880
0.1374
0.0374
0.1699
0.1062
P
880
1150
0.1766
0.0966
0.1291
0.0495
Q
1150
1500
0.1291
0.0495
0.1616
0.1209
R
1500
1900
0.1699
0.1062
0.1187
0.0671
S
1900
2500
0.1187
0.0671
0.1517
0.1423
T
2500
3200
0.1616
0.1209
0.1063
0.0945
U
3200
4200
0.1063
0.0945
0.1397
0.1728
V
4200
5500
0.1517
0.1423
0.0913
0.1327
W
5500
7200
Bin
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
Tolerance for each bin limit is ±0.5 nm
Tolerance for each bin limit is ± 15%
Green Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
520.0
524.0
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
Tolerance for each bin limit is ±0.5 nm
Red Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
622
634
0.6904
0.3094
0.6945
0.2888
0.6726
0.3106
0.7135
0.2865
Tolerance for each bin limit is ± 0.5 nm
Avago Color Bin on CIE 1931 Chromaticity Diagram.
1.000
0.800
Green 1 2 3
4
5
Y
0.600
0.400
Red
0.200
5
4
3
Blue
2
1
0.000
0.000
0.100
0.200
0.300
0.400
0.500
0.600
X
RELATIVE LIGHT OUTPUT
(NORMALIZED at TJ = 25°C)
10
GREEN
1
0.1
RED
-40
-20
0
20
40
BLUE
60
80
T J - JUNCTION TEMPERATURE - °C
100
120
0.700
0.800
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper tool
to precisely form and cut the leads to applicable length
rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is
used. So, it is recommended to re-calibrate the soldering profile again
before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered to
PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual
soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the
LED using soldering iron tip closer than 1.59mm might
damage the LED.
1.�9mm
• ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the
LED component that is ESD sensitive. Do refer to Avago
application note AN 1142 for details. The soldering iron
used should have grounded tip to ensure electrostatic
charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple mounted
at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
CATHODE
AlInGaP Device
ANODE
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during wave
soldering should be loosely fitted and should not apply
weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the top
side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using
reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause
difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
200
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
100
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
O
AG ES
AV LOGI
O
HN
E
OD
AN
TEC
E
OD
TH
CA
–
ANODE LEAD LEAVES
THE BOX FIRST.
C
EL
AB
RL
HE
T
MO
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(Q) QTY: Quantity
LPN
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
REV:
(V) Vendor ID
DeptID:
(1P) Item: Part Number
Made In: Country of Origin
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS
PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes AV01-0304EN
AV02-0388EN - July 11, 2007
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