HLMP-AL71-130DD

HLMP-AG70/71, HLMP-AL70/71 5 mm Mini Oval Red and Amber LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains UV inhibitors to reduce the effects of long term exposure to direct sunlight. • Well defined spatial radiation pattern Applications • High brightness material • Available in Red and Amber – Red AlInGaP 626 nm – Amber AlInGaP 590 nm • Superior resistance to moisture • Standoff and non-standoff Package • Tinted and diffused • Gas Price Signs • Typical viewing angle 30° x 70° • Mono Color Signs – Marquee Package Dimensions A: No Standoff 0.8 max. 0.8 0.032 max. 0.032 0.70 max. 0.70 0.028 max. 0.028 8.70 ±0.20 8.70 ±0.20 0.342 ±0.008 0.342 ±0.008 3.80 ±0.200 3.80 ±0.200 0.150 ±0.008 0.150 ±0.008 0.50 ±0.10 sq. typ. 0.50 ±0.10 0.020 ±0.004 sq. typ. 0.020 ±0.004 5.20 ±0.200 5.20 ±0.200 0.205 ±0.008 0.205 ±0.008 24.00 min. 24.00 0.945 min. 0.945 cathode lead cathode lead 2.54 ±0.3 ±0.3 1.00 min. 0.1002.54 ±0.012 1.00 min. 0.100 ±0.012 0.038 0.038 B: Standoff d 1.50 ±0.15 1.50 ±0.15 0.0591 ±0.006 0.0591 ±0.006 0.70 max. 0.70 0.028 max. 0.028 d 5.20 ±0.20 5.20 ±0.20 0.205 ±0.008 0.205 ±0.008 8.70 ±0.20 8.70 ±0.20 0.342 ±0.008 0.342 ±0.008 0.8 max. 0.8 0.032 max. 0.032 Part Number Dimension ‘d’ HLMP-AG71-xxxxx 12.30 ± 0.25 mm HLMP-AL71-xxxxx 12.64 ± 0.25 mm cathode lead cathode lead 24.00 min. 24.00 min. 0.945 0.945 0.50 ±0.10 sq. typ. 0.50 ±0.10 0.020 ±0.004 sq. typ. 0.020 ±0.004 1.00 min. 1.00 0.038 min. 0.038 Notes: All dimensions in millimeters (inches). Tolerance is ± 0.20 mm unless other specified 3.80 ±0.200 3.80 ±0.200 0.150 ±0.008 0.150 ±0.008 2.54 ±0.3 2.54 ±0.3 0.100 ±0.012 0.100 ±0.012 Device Selection Guide Luminous Intensity Iv (mcd) at 20 mA [1,2,5] Part Number Color and Dominant Wavelength λd (nm) Typ [3] Min Max Standoff Package Drawing HLMP-AG70-Z20DD Red 626 2400 4200 No A HLMP-AG71-Z20DD Red 626 2400 4200 Yes B HLMP-AL70-130DD Amber 590 2900 5040 No A HLMP-AL70-13KDD Amber 590 2900 5040 No A HLMP-AL70-13LDD Amber 590 2900 5040 No A HLMP-AL71-130DD Amber 590 2900 5040 Yes B HLMP-AL71-13KDD Amber 590 2900 5040 Yes B HLMP-AL71-13LDD Amber 590 2900 5040 Yes B Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System HLMP – A x xx – x x x xx Packaging Option DD: Ammopack Color Bin Selection 0: Full Distribution K: Color bin 2 and 4 L: Color bin 4 and 6 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Standoff / Non Standoff 70: Without Standoff 71: With Standoff Color G: Red L: Amber Package A: 5 mm Mini Oval 30° x 70° 2 Absolute Maximum Ratings (TJ = 25° C) Parameter Red/ Amber Unit DC Forward Current [1] 50 mA Peak Forward Current 100 [2] mA Power Dissipation 120 mW LED Junction Temperature 130 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, frequency 1 kHz. Electrical / Optical Characteristics (TJ = 25° C) Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Red & Amber VF 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage [3] Red & Amber VR 5 V IR = 100 μA Dominant Wavelength [1] Red Amber ld nm IF = 20 mA Peak Wavelength Red Amber lPEAK nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Thermal resistance RqJ-PIN °C/W LED Junction-to pin Luminous Efficacy [2] Red Amber ηv lm/W Emitted Luminous Power/ Emitted Radiant Power nm/°C IF = 20 mA; +25° C ≤ TJ ≤ +100° C Thermal coefficient of ld Red Amber 618.0 584.5 626.0 590.0 634 594 240 190 490 0.05 0.09 630.0 594.5 Notes: 1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is the luminous efficacy in lumens/ watt. 3. Indicates product final testing condition, long term reverse bias is not recommended. 3 1.0 RELATIVE INTENSITY 0.8 Amber FORWARD CURRENT - mA 100 Red 0.6 0.4 0.2 0.0 500 550 600 WAVELENGTH - nm 650 0 20 40 60 DC FORWARD CURRENT - mA 80 100 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation pattern for RED - Major Axis 4 20 0 1 2 FORWARD VOLTAGE - V 3 60 50 40 30 20 10 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100 Figure 4. Maximum Forward Current vs Ambient Temperature NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 3. Relative Intensity vs Forward Current 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 40 Figure 2. Forward Current vs Forward Voltage IFMAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 60 0 700 Figure 1. Relative Intensity vs Wavelength 80 90 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 6. Radiation pattern for RED - Minor Axis 90 NORMALIZED INTENSITY NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 7. Radiation pattern for AMBER - Major Axis -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 1 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE 120 Amber Red 0.5 FORWARD VOLTAGE SHIFT - V RELATIVE LIGHT OUTPUT NORMALIZED AT TJ = 25° C -60 0.6 Amber Red Figure 9. Relative Light Output vs Junction Temperature 5 -90 Figure 8. Radiation pattern for AMBER - Minor Axis 10 0.1 -40 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 140 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE Figure 10. Forward Voltage Shift vs Junction Temperature 120 140 Intensity Bin Limit Table (1.2 : 1 Iv Bin Ratio) Red Color Range Intensity (mcd) at 20 mA Bin Min Max Min Dom Y 1990 2400 618.0 Max Dom 630.0 Chromaticity Coordinate x 0.6872 0.3126 0.6890 0.2943 y 0.6690 0.3149 0.7080 0.2920 Z 2400 2900 1 2900 3500 Tolerance for each bin limit is ± 0.5 nm 2 3500 4200 3 4200 5040 Amber Color Range Tolerance for each bin limit is ± 15% VF Bin Table (V at 20 mA) Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 Tolerance for each bin limit is ±0.05 V. Min Bin Dom Max Dom Chromaticity Coordinate 1 584.5 587.0 x 0.5420 0.4580 0.5530 0.4400 y 0.5370 0.4550 0.5570 0.4420 2 587.0 589.5 x 0.5570 0.4420 0.5670 0.4250 y 0.5530 0.4400 0.5720 0.4270 x 0.5720 0.4270 0.5820 0.4110 y 0.5670 0.4250 0.5870 0.4130 x 0.5870 0.4130 0.5950 0.3980 y 0.5820 0.4110 0.6000 0.3990 4 589.5 592.0 6 592.0 594.5 Tolerance for each bin limit is ± 0.5 nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 0.480 0.460 0.440 0.420 1 Amber 2 4 6 Y 0.400 0.380 0.360 0.340 0.320 Red 0.300 0.280 0.500 6 0.550 0.600 0.650 X 0.700 0.750 0.800 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260°C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. Anode Note: Electrical InGaN connection Device between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. 1.59 mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering Manual Solder [1, 2] Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 sec Max. 5 sec Max Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) 7 • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260 °C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105 °C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35 ± 1.30 0.250 ± 0.051 12.70 ± 1.00 0.500 ± 0.039 CATHODE 20.5 ± 1.00 0.8070 ± 0.0394 18.00 ± 0.50 0.7085 ± 0.0195 9.125 ± 0.625 0.3595 ± 0.0245 12.70 ± 0.30 0.500 ± 0.012 4.00 ± 0.20 TYP. 0.1575 ± 0.0075 0.70 ± 0.20 0.276 ± 0.0075 VIEW A - A Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 8 Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 9 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) Example: (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. AV02-3176EN - January 23, 2013