HLMP-C008-U0000

HLMP-Cx08 Series, HLMP-Cx25 Series HLMP-Cx27 Series, HLMP-C610 T-13/4 (5 mm) AlInGaP Lamps Data Sheet Description Features The HLMP-Cx08, HLMP-Cx25, HLMP-Cx27, and HLMP-C610 series are 5 mm lamps specially designed for applications requir-ing very high on-axis intensity that is not achievable with a standard lamp. These devices are capable of producing light output over a wide range of drive currents. •  High intensity Built using AlInGaP technology, they are well suited for typical 5 mm TS-AlGaAs lamp applications, and have significantly SUPERIOR RELIABILITY than most TS-AlGaAs lamps in wet/hot environments. These lamps come with clear non-diffused lens and are optically designed to yield superior light output. •  8° or 25° viewing angles •  General purpose leads •  Popular 5 mm diameter •  Available in bulk, tape and reel, or ammopack •  Choice of colors: Amber or Red Applications •  Indoor/outdoor applications •  Small store-front signs •  Message panels •  Road construction barrier lights •  Center high mount stop lights •  Spoiler, car decorative lighting •  Motorcycle/bicycle warning lights Device Selection Part Number Standoff Typical Viewing Angle[1](degrees), 2q1/2 HLMP-C008-U00xx No Luminous Intensity, Iv (mcd) @ 20 mA Min. Typ. Color Dominant Wavelength[2] 8 2900 6000 Red 626 HLMP-C208-S00xx 8 2600 3000 Amber 590 HLMP-C608-R00xx 8 1000 2000 Red 635 HLMP-C610-R00xx Yes 8 1000 2000 Red 635 HLMP-C025-P00xx No 25 500 1000 Red 626 HLMP-C225-O00xx 25 450 800 Amber 590 HLMP-C625-P00xx 25 500 700 Red 635 25 500 1000 Red 626 25 500 700 Red 635 25 500 Orange 605 HLMP-C027-P00xx Yes HLMP-C627-P00xx HLMP-C325-P00xx No Notes: 1.  q1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. 2.  The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. Package Dimensions HLMP-Cx27 6.10 (0.240) 5.46 (0.215) 1.07 (0.042) 0.56 (0.022) 1.00 (0.040) MAX. EPOXY MENISCUS 1.32 (0.052) 1.02 (0.040) 0.45 SQ. NOM. (0.018) 5.21 (0.205) 4.70 (0.185) 2.54 NOM. (0.100) CATHODE LEAD 9.14 (0.360) 8.38 (0.330) 13.50 (0.53) 13.30 (0.52) 1.27 NOM. (0.050) 25.40 MIN. (1.000) HLMP-Cx25 6.10 (0.240) 5.46 (0.215) 1.07 (0.042) 0.56 (0.022) 1.00 (0.040) MAX. EPOXY MENISCUS 0.45 SQ. NOM. (0.018) 0.65 (0.026) MAX. 5.21 (0.205) 4.70 (0.185) 2.54 NOM. (0.100) CATHODE LEAD 9.14 (0.360) 8.38 (0.330) 1.27 NOM. (0.050) 25.40 MIN. (1.000) HLMP-C610 6.10 (0.240) 5.46 (0.215) 0.89 (0.035) 0.64 (0.025) 1.00 (0.040) MAX. EPOXY MENISCUS 1.32 (0.052) 1.02 (0.040) 0.45 SQ. NOM. (0.018) 5.08 (0.200) 4.57 (0.180) 2.54 NOM. (0.100) 13.55 (0.533) 13.35 (0.525) HLMP-Cx08 6.10 (0.240) 5.46 (0.215) CATHODE LEAD 9.19 (0.362) 8.43 (0.332) 1.27 NOM. (0.050) 25.40 MIN. (1.00) 0.89 (0.035) 0.64 (0.025) 1.00 (0.040) MAX. EPOXY MENISCUS 0.45 SQ. NOM. (0.018) 0.65 (0.026) MAX. 5.08 (0.200) 4.57 (0.180) 2.54 NOM. (0.100) CATHODE LEAD 9.19 (0.362) 8.43 (0.332) 25.40 MIN. (1.00) Notes: 1. All dimension are in mm (inches). 2. For PCB hole recommendations, see the Precautions section. 2 1.27 NOM. (0.050) Part Numbering System HLMP - C x xx - x x x xx Mechanical Option 00:Bulk 02: Tape & Reel, Straight Leads DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle & Standoff Option 08: 8 degrees, without standoff 10: 8 degrees, with standoff 25: 25 degrees, without standoff 27: 25 degrees, with standoff Color Options 0: AlInGaP Red 626 nm 2: AlInGaP Amber 590 nm 3: AlInGaP Orange 605 nm 6: AlInGaP Red 635 nm Absolute Maximum Ratings at TA = 25 °C Parameter Absolute Maximum Units Peak Forward Current 70 mA Average Forward Current[1] 30 mA DC Current[2] 50 mA Reverse Voltage (IR = 100 μA) 5 V LED Junction Temperature 110 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. See Figure 2 to establish pulsed operating conditions. 2. Derate linearly from 50 °C at 0.5 mA/°C. 3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended to operate this device at peak currents above the Absolute Maximum Peak Forward Current. 3 Optical/Electrical Characteristics at TA=25°C Test Symbol Parameter Device Min. Typ.[3] Max. Units Conditions 2q1/2 Included Angle Between Half Luminous Intensity Points[1] HLMP-C008 8 Deg. IF = 20 mA HLMP-C208 8 See Note 1 HLMP-C608 8 HLMP-C025 25 HLMP-C225 25 HLMP-C325 25 HLMP-C625 25 HLMP-C610 8 HLMP-C027 25 HLMP-C627 25 l d Dominant Wavelength[2] HLMP-C008 HLMP-C208 HLMP-C608 HLMP-C025 HLMP-C225 HLMP-C325 HLMP-C625 HLMP-C610 HLMP-C027 HLMP-C627 l PEAK HLMP-C008 635 nm Measurement at Peak HLMP-C208 594 HLMP-C608 650 HLMP-C025 635 HLMP-C225 594 HLMP-C325 611 HLMP-C625 650 HLMP-C610 650 HLMP-C027 635 HLMP-C627 650 Peak Wavelength 626 590 635 626 590 605 635 635 626 635 nm See Note 2 Dl1/2 Spectral Line Halfwidth 17 nm t s Speed of Response 20 ns C Capacitance 40 pF VF = 0; f = 1 MHz RqJ-PIN Thermal Resistance 260 °C/W Junction to Cathode Lead 1.9 1.9 1.9 1.9 1.9 1.9 1.9 1.9 1.9 V IF = 20 mA V IR = 100 µA VF Forward Voltage VR HLMP-C008 HLMP-C208 HLMP-C608 HLMP-C025 HLMP-C225 HLMP-C625 HLMP-C610 HLMP-C027 HLMP-C627 Reverse Breakdown Voltage 2.4 2.6 2.2 2.4 2.6 2.2 2.2 2.4 2.2 5.0 Notes: 1.  q1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. 2.  The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3.  Typical specification for reference only. Do not exceed absolute maximum ratings. 4 1.0 C008 C025 C027 RELATIVE INTENSITY C208 C225 C325 C608 C625 C627 C610 0.5 0 550 600 650 700 WAVELENGTH – nm 60 5 50 CURRENT – mA 4 3 100 300 Hz z Hz z 1 KH 3 KH Hz Hz 10 K KHz 2 30 K IPEAK – MAX. IDC – MAX. 6 100 RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT Figure 1. Relative intensity vs. wavelength. 40 RED 20 10 1 1.0 10 100 1000 0 1.0 10,000 3.0 HLMP-CX08 fig 3 3.0 60 2.5 FORWARD CURRENT (mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2.5 Figure 3. Forward current vs. forward voltage. HLMP-CX08 fig 2 2.0 1.5 1.0 0.5 0 2.0 1.5 VF – FORWARD VOLTAGE – V tp – PULSE DURATION – µs Figure 2. Maximum tolerable peak current vs. pulse duration. 0 20 40 60 IF – DC FORWARD CURRENT – mA Figure 4. Relative luminous intensity vs. forward current. HLMP-CX08 fig 4 5 AMBER 30 40 RθJ-A = 780°C/W 20 0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Figure 5. Maximum forward DC current vs. ambient temperature. HLMP-CX08 fig 5 Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. For information on soldering LEDs, please refer to Application Note 1027. 1.0 RELATIVE INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -25 -20 -15 -10 -5 0 5 10 15 20 25 ANGULAR DISPLACEMENT – DEGREES Figure 6. Relative luminous intensity vs. angular displacement for HLMP-Cx08 and HLMP-Cx10. HLMP-CX08 fig 5 1.0 RELATIVE INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES Figure 7. Relative luminous intensity vs. angular displacement for HLMP-Cx25 and HLMP-Cx27. HLMP-CX08 fig 6 6 Intensity Bin Limits Color Categories Color Bin Intensity Range (mcd) Min. Max. Res/Orange P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 Yellow Lambda (nm) Color Category# Min. Max. Orange 2 599 602.5 3 601.5 605 4 603.8 608.2 5 606.8 611.2 Tolerance for each bin limit is ±0.5 nm. Maximum tolerance for each bin limit is ±18%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag DD Ammo Pack, straight leads with minimum increment 2K/pack Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 7 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm • ESD precaution must be properly applied on the soldering station and by personnel to prevent ESD damage to the LED component that is ESD sensitive. For details, refer to Avago application note AN 1142. The soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering conditions: Wave Manual Solder Soldering[1],[2] Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Notes: 1. These conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. 2. To reduce thermal stress experienced by the LED, it is recommended that you use only bottom preheaters. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads: LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- 0.65 mm off area (max.) (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shear- 0.70 mm off area (max.) (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) • Over-sizing the PTH can lead to a twisted LED after it is clinched. On the other hand, undersizing the PTH can make inserting the TH LED difficult. For more information about soldering and handling of TH LED lamps, refer to application note AN5334. 8 Example of Wave Soldering Temperature Profile for TH LED 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE Flux: Rosin flux Solder bath temperature: 245 °C± 5 °C (maximum peak temperature = 250 °C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 Ammo Packs Drawing Note: Dimension in mm(inches). 9 30 40 50 60 TIME (SECONDS) 70 80 90 100 Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 10 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-0965EN - July 26, 2014