HLMP-CB3B-UV0DD

HLMP-Cx1A/1B/2A/2B/3A/3B New 5mm Blue and Green LED Lamps Data Sheet Description Features These high intensity blue and green T-1¾ package LEDs are untinted and non-diffused. Based on the most efficient and cost effective InGaN material technology and incorporating second generation optics they produce well defined spatial radiation patterns at specific viewing cone angles. x Well defined spatial radiation pattern Advanced optical grade epoxy construction offers superior high temperature and moisture resistance performance in outdoor signal and sign applications. x High luminous output x Untinted, Non-diffused x Available in Color: – Blue 470nm – Green 525nm x Viewing Angle: 15°, 23° and 30° x Standoff or non-standoff x Superior resistance to moisture Applications x Commercial outdoor advertising x Traffic Sign x Variable Message Sign CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN – 1142 for additional details. Package Dimensions Drawing A (Non-standoff) 1.00 ± 0.20 0.039 ± 0.008 8.70 ± 0.20 0.343 ± 0.008 0.70 max 0.028 5.80 ± 0.20 0.228 ± 0.008 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 5.00 ± 0.20 0.197 ± 0.008 2.54 ± 0.38 0.100 ± 0.015 Cathode 31.60 min 1.244 1.00 min 0.039 cathode flat Drawing B (Standoff) 8.70 ± 0.20 0.343 ± 0.008 1.00 ± 0.20 0.039 ± 0.008 1.30 ± 0.15 0.051 ± 0.006 0.70 max 0.028 5.80 ± 0.20 0.228 ± 0.008 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 5.00 ± 0.20 0.197 ± 0.008 2.54 ± 0.38 0.100 ± 0.015 Cathode d 31.60 min 1.244 Viewing Angle d HLMP-Cx1B 12.96±0.25 (0.510±0.010) HLMP-Cx2B 12.32 ±0.25 (0.485±0.010) HLMP-Cx3B 2 12.00±0.25 (0.472±0.010) 1.00 min 0.039 Notes: 1. All dimensions are in millimeters (inches) 2. Leads are mild steel with tin plating. 3. The epoxy meniscus is 1.50mm max cathode flat Device Selection Guide Part Number Color Typical Viewing angle, 2T½ (°) [4] Luminous Intensity Iv (mcd) at 20 mA [1,2,5] Standoff / Min Max Non Standoff HLMP-CB1A-XY0DD Blue 15° 7200 12000 Package drawing Non Standoff A Standoff B Non Standoff A Standoff B Non Standoff A Standoff B Non Standoff A Standoff B Non Standoff A Standoff B Non Standoff A Standoff B HLMP-CB1A-XYBDD HLMP-CB1A-XYCDD HLMP-CB1B-XY0DD HLMP-CB1B-XYBDD HLMP-CB1B-XYCDD HLMP-CB2A-VW0DD 23° 4200 7200 HLMP-CB2A-VWBDD HLMP-CB2A-VWCDD HLMP-CB2B-VW0DD HLMP-CB2B-VWBDD HLMP-CB2B-VWCDD HLMP-CB3A-UV0DD 30° 3200 5500 HLMP-CB3A-UVBDD HLMP-CB3A-UVCDD HLMP-CB3B-UV0DD HLMP-CB3B-UVBDD HLMP-CB3B-UVCDD HLMP-CM1A-450DD Green 15° 35000 59000 HLMP-CM1A-45BDD HLMP-CM1A-45CDD HLMP-CM1B-450DD HLMP-CM1B-45BDD HLMP-CM1B-45CDD HLMP-CM2A-120DD 23° 16000 27000 HLMP-CM2A-12BDD HLMP-CM2A-12CDD HLMP-CM2B-120DD HLMP-CM2B-12BDD HLMP-CM2B-12CDD HLMP-CM3A-Z10DD 30° 12000 21000 HLMP-CM3A-Z1BDD HLMP-CM3A-Z1CDD HLMP-CM3B-Z10DD HLMP-CM3B-Z1BDD HLMP-CM3B-Z1CDD Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. T½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% 3 Part Numbering System HLMP  C x xx  x x x xx Packaging Option DD: Ammo Pack Color Bin Selection 0: Full Distribution B: Color Bin 2 & 3 C: Color Bin 3 & 4 Maximum Intensity Bin 0: No maximum intensity limit (refer to selection guide) Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Lead Standoffs 1A: 15° without lead standoff 1B: 15° with lead standoff 2A: 23° without lead standoff 2B: 23° with lead standoff 3A: 30° without lead standoff 3B: 30° with lead standoff Color B: Blue 470 M: Green 525 Note: please refer to AB 5337 for complete information on part numbering system Absolute Maximum Ratings TJ = 25°C Parameter Blue / Green DC Forward Current [1] 30 mA Peak Forward Current 100 [2] mA Power Dissipation 116 mW Reverse Voltage 5 V LED Junction Temperature 110 °C Operating Temperature Range -40 to + 85 °C Storage Temperature Range -40 to + 100 °C Notes: 1. Derate linearly as shown in figure 4. 2. Duty Factor 10%, frequency 1KHz. 4 Unit Electrical / Optical Characteristics TJ = 25°C Parameter Symbol Forward Voltage Green / Blue VF Reverse Voltage VR Dominant Wavelength[1] Od Green Blue Min. Typ. Max. 2.8 3.2 3.8 5 519.0 460.0 Peak Wavelength Green Blue OPEAK Spectral Half Width Green Blue 'O1/2 Thermal Resistance RTJ-PIN Luminous Efficacy [2] KV 525.0 470.0 Units Test Conditions V IF = 20 mA V IR = 10 PA nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA nm IF = 20mA °C/W LED Junction-to-Pin lm/W Emitted Luminous Flux / Emitted Radiant Flux nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C 539.0 480.0 516 464 30 23 240 Green Blue 518 78 Thermal coefficient of Od Green Blue 0.028 0.024 Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is the luminous efficacy in lumens/watt. 5 100 BLUE FORWARD CURRENT-mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 GREEN 80 60 40 20 0 430 480 530 WAVELENGTH - nm 580 0 630 Figure 1. Relative Intensity vs Wavelength 3.0 IFmax - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 4 5 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 35 BLUE 2.5 GREEN 2.0 1.5 1.0 0.5 30 25 20 15 10 5 0 0.0 0 20 40 60 80 DC FORWARD CURRENT-mA 100 0 120 Figure 3. Relative Intensity vs Forward Current 20 Figure 4. Maximum Forward Current vs Ambient Temperature 10 1.0 5 NORMALIZED INTENSITY RELATIVE DOMINANT WAVELENGTH SHIFT -nm 2 3 FORWARD VOLTAGE-V Figure 2. Forward Current vs Forward Voltage 3.5 GREEN BLUE 0 -5 -10 0 20 40 60 FORWARD CURRENT-mA 80 Figure 5. Relative Dominant Wavelength Shift vs Forward Current 6 1 100 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 ANGULAR DISPALCEMENT -DEGREE Figure 6. Radiation Pattern for 15° 90 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 0.2 -60 -30 0 30 60 ANGULAR DISPALCEMENT - DEGREE 90 Figure 7. Radiation Pattern for 23° 0.4 0.2 0.0 -90 0.0 -90 0.6 -30 0 30 60 ANGULAR DISPALCEMENT - DEGREE 90 Figure 8. Radiation Pattern for 30° 10 0.3 FORWARD VOLTAGE SHIFT-V Blue Green NORMALZIED INTENSITY (PHOTO) -60 1 0.1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE 100 0.1 0 -0.1 -0.2 -0.3 120 Blue Green 0.2 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 9. Relative Light Output vs Junction Temperature Figure 10. Relative Forward Voltage vs Junction Temperature Intensity Bin Limit Table (1.3:1 Iv bin ratio) Green Color Bin Table Bin Min Dom Max Dom Bin Intensity (mcd) at 20mA Min Max 1 519.0 523.0 U 3200 4200 2 523.0 527.0 V 4200 5500 3 527.0 531.0 W 5500 7200 4 531.0 535.0 X 7200 9300 5 535.0 539.0 Y 9300 12000 Z 12000 16000 1 16000 21000 2 21000 27000 Bin Min Dom Max Dom 3 27000 35000 1 460.0 464.0 4 35000 45000 2 464.0 468.0 5 45000 59000 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Tolerance for each bin limit is ± 15% 100 120 Tolerance for each bin limit is ± 0.5nm. Blue Color Bin Table Tolerance for each bin limit is ± 0.5nm. Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. 7 Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. Avago Technologies LED Configuration Soldering and Handling: x Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. x ESD precaution must be properly applied on the 1.59mm soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. x Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105°C Max. - Preheat time 60 sec Max - Peak temperature 260°C Max. 260°C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. x Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 8 CATHODE InGaN Device x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. x If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. x Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) x Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35 ± 1.30 0.250 ± 0.051 12.70 ± 1.00 0.500 ± 0.039 CATHODE 20.5 ± 1.00 0.8070 ± 0.0394 9.125 ± 0.625 0.3595 ± 0.0245 18.00 ± 0.50 0.7085 ± 0.0195 12.70 ± 0.30 0.500 ± 0.012 0.70 ± 0.20 0.0275 ± 0.0075 A A VIEW AA Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 9 4.00 ± 0.20 Ø 0.1575 ± 0.0075 TYP. Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 10 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-2228EN - December 15, 2009