HLMP-CE34-Y1QDD

HLMP-CExx T-1 ¾ (5mm) Extra Bright Cyan LEDs Data Sheet Description Features The high intensity Cyan LEDs are based on the most efficient and cost effective InGaN material technology. The 505nm typical dominant wavelength is most suitable for traffic signal application. These LED lamps are untinted, non-diffused, T-1¾ packages incorporating second generation optics which produce well-defined spatial radiation patterns at specific viewing cone angles. x Viewing Angle: 15°, 23° and 30° These lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor sign and signals applications. x Well defined spatial radiation pattern x High brightness material x Superior resistance to moisture x Package options: – Stand-off and Non Stand-off Leads x Untinted and non diffused Applications x Traffic signals Package Dimensions A: Non stand-off 1.0 ±0.20 0.039 ±0.008 Ø Dimension A 5.00 ±0.20 0.197 ±0.008 5.80 ±0.20 0.228 ±0.008 0.50 ±0.20 sq. typ. .020 ±.008 2.540 ±0.2 0.100 ±0.008 Note 1 Cathode 1.00 min .039 25.40 min 0.901 cathode flat B: Stand-off 1.0 ±0.20 0.039 ±0.008 1.30 ±0.15 0.051 ±0.006 Dimension A 5.00 ±0.20 0.197 ±0.008 Ø 5.80 ±0.20 0.228 ±0.008 0.50 ±0.20 sq. typ. .020 ±.008 2.540 ±0.2 0.100 ±0.008 Note 1 Cathode Dimension d Package Dimension A Dimension d 15° 8.70 ± 0.20 mm 13.00 ± 0.20 mm 23° 8.65 ± 0.20 mm 12.25 ± 0.20 mm 30° 8.65 ± 0.20 mm 12.05 ± 0.20 mm 25.40 min 0.901 1.00 min .039 cathode flat Notes: 1. Measured above flange. 2. All dimensions in millimeters (inches). CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Part Number Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Stand-Off HLMP-CE13-35CDD 27000 59000 No HLMP-CE13-35QDD 27000 59000 No HLMP-CE22-Z2CDD 12000 27000 No HLMP-CE22-Z2QDD 12000 27000 No HLMP-CE34-Y1CDD 9300 21000 No HLMP-CE34-Y1QDD 9300 21000 No HLMP-CE14-35CDD 27000 59000 Yes HLMP-CE14-35QDD 27000 59000 Yes HLMP-CE25-Z2CDD 12000 27000 Yes HLMP-CE25-Z2QDD 12000 27000 Yes HLMP-CE35-Y1CDD 9300 21000 Yes HLMP-CE35-Y1QDD 9300 21000 Yes Tolerance for each intensity limit is ± 15%. Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. Tolerance for each intensity limit is ± 15%. 3. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs. Part Numbering System HLMP-C E xx – x x x xx Packaging Option DD: Ammopack Color Bin Selection C: Color bin 3 & 4 Q: Color bin 7 & 8 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Lead Stands-offs 13: 15° without stand-off 14: 15° with stand-off 22: 23° without stand-off 25: 23° with stand-off 34: 30° without stand-off 35: 30° with stand-off Note: Please refer to AB 5337 for complete information about part numbering system. 2 Absolute Maximum Ratings TJ = 25°C Parameter Value Unit DC Forward Current [1] 30 mA Peak Forward Current 100 [2] mA Power Dissipation 107 mW Reverse Voltage Not recommended for reverse bias Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Notes: 1. Derate linearly as shown in Figure 5. 2. Duty Factor 10%, frequency 1KHz. Electrical / Optical Characteristics TA = 25°C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage VF 2.8 3.2 3.5 V IF = 20 mA Dominant Wavelength[1] Od 505 nm IF = 20 mA Peak Wavelength OPEAK 501 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth 'O1/2 30 Thermal Resistance RTJ-PIN 240 °C/W LED Junction-to-Cathode Lead Luminous Efficacy [2] KV 326 lm/W Emitted Luminous Power/Emitted Radiant Power Luminous Flux MV 2.1 lm IF = 20 mA Luminous Efficiency [3] Ke 34 lm/W Emitted Luminous Flux/Electrical Power Wavelength width at spectral distribution ½ power point at IF = 20 mA Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant wavelength is ± 0.5nm. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and KV is the luminous efficacy in lumens/watt. 3. Ke =MV/ IF x VF where MV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 3 25 FORWARD CURRENT - mA RELATIVE INTENSITY 30 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 550 600 WAVELENGTH - nm 650 0 700 DOMINANT WAVELENGTH SHIFT - nm RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 1 0.8 0.6 0.4 0.2 0 5 10 15 20 DC FORWARD CURRENT - mA 1 2 FORWARD VOLTAGE - V 3 4 Figure 2. Forward Current vs Forward Voltage 0 25 16 14 12 10 8 6 4 2 0 -2 -4 30 Figure 3. Relative Intensity vs Forward Current 0 5 10 15 20 FORWARD CURRENT - mA 25 30 60 90 Figure 4. Relative Dominant Wavelength vs Forward Current 1 35 30 NORMALIZED INTENSITY IDC MAX -MAX. ALLOWABLE DC CURRENT - mA 10 0 450 1.4 25 20 15 10 5 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C Figure 5. Maximum Forward Current vs Ambient Temperature 4 15 5 Figure 1. Relative Intensity vs Wavelength 0 20 100 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEG Figure 6. Representative Spatial Radiation Pattern – 15° Lamps 1 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1 0.6 0.4 0.2 0.6 0.4 0.2 0 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEG 60 90 -90 Figure 7. Representative Spatial Radiation Pattern – 23° Lamps -60 -30 0 30 ANGULAR DISPLACEMENT - DEG Figure 8. Representative Spatial Radiation Pattern – 30° Lamps Relative Light Output vs Junction Temperature RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 10 1 0.1 -40 -20 0 20 40 TJ - JUNCTION TEMPERATURE - °C Intensity Bin Limit Table (1.3: 1 Iv Bin Ratio) 60 80 100 Cyan Color Bin Limits Intensity (mcd) at 20 mA Bin Min Max Bin Min Max 3 500 505 Y 9300 12000 4 505 510 Z 12000 16000 7 498 503 1 16000 21000 8 503 508 2 21000 27000 3 27000 35000 4 35000 45000 5 45000 59000 Tolerance for each bin limit is ± 15% 5 60 Tolerance for each bin limit is ± 0.5nm. 90 Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260°C and the solder contact time does not exceeding 5sec. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration Soldering and Handling: x Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm x ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. x Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105°C Max. - Preheat time 60 sec Max - Peak temperature 260°C Max. 260°C Max. Dwell time 5 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. x Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 6 x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. x If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. x Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) x Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3 sec - 5 sec (maximum = 5 sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 12.70±1.00 0.50±0.0394 6.35±1.30 0.25±0.0512 CATHODE 20.50±1.00 0.807±0.039 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Note: All dimensions are in milimeters (inches). 7 A 0.70±0.20 0.0276±0.0079 A VIEW A-A ø 4.00±0.20TYP. 0.1575±0.008 Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 8 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-1823EN - January 20, 2010