Agilent HLMP-Cxxx
T-13/4 (5 mm) Super Bright Precision
Optical Performance InGaN LED Lamps
Data Sheet
HLMP-CB18, HLMP-CB19, HLMP-CM18, HLMP-CM19, HLMP-CE18,
HLMP-CE19, HLMP-CB28, HLMP-CB29, HLMP-CM28, HLMP-CM29,
HLMP-CE28, HLMP-CE29, HLMP-CB38, HLMP-CB39, HLMP-CM38,
HLMP-CM39, HLMP-CE38, HLMP-CE39
Description
These Super Bright Precision
Optical Performance LED
lamps are based on flip chip
InGaN material, which is the
brightest and most efficient
technology for LEDs in the
blue, green, and cyan region of
the spectrum. The 470 nm
typical dominant wavelength
for blue and 530 nm typical
wavelength for green is well
suited to color mixing in full
color signs. The 500 nm
typical dominant wavelength
for cyan is suitable for traffic
signal application.
These LED lamps are untinted,
non-diffused, T-1¾ packages
incorporating second
generation optics which
produce well-defined spatial
radiation patterns at specific
viewing cone angles.
These lamps are made with
advanced optical grade epoxy,
offering superior temperature
and moisture resistance in
outdoor signal and sign
applications. The high
maximum LED junction
temperature limit of +130°C
enables high temperature
operation in bright sunlight
conditions. The package epoxy
contains both UV-a and UV-b
inhibitors to reduce the effects
of long-term exposure to
direct sunlight.
Features
• Well defined spatial radiation
pattern
• High luminous output
• Available in blue, green and cyan
color
• Viewing angle: 15°, 23° and 30°
• Standoff or non-standoff leads
• Superior resistance to moisture
• New InGaN flip chip die
technology with protective diode
• ESD class 3
Applications
• Traffic signals
• Commercial outdoor advertising
• Front panel backlighting
• Front panel indicators
Package Dimensions
PACKAGE DIMENSION A
∅
2.35 MAX.
(0.093)
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
0.70 MAX.
(0.028)
5.00 ± 0.20
(0.197 ± 0.008) NOTE 1
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.71 ± 0.20
(0.343 ± 0.008)
1.00 MIN.
(0.039)
CATHODE
FLAT
31.60 MIN.
(1.244)
PACKAGE DIMENSION B
∅
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 MAX.
(0.028)
5.80 ± 0.20
(0.228 ± 0.008)
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
5.00 ± 0.20
NOTE 1
(0.197 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.71 ± 0.20
(0.343 ± 0.008)
1.00 MIN.
(0.039)
DIMENSION H
REFER TO TABLE 1
31.60 MIN.
(1.244)
NOTES:
1. MEASURED JUST ABOVE FLANGE.
2. DIMENSIONS IN MILLIMETERS (INCHES).
DIMENSION H:
23 & 30 DEGREE = 12.67 ± 0.25 mm (0.499 ± 0.01 INCH)
15 DEGREE
= 12.93 ± 0.25 mm (0.509 ± 0.01 INCH)
2
CATHODE
FLAT
Device Selection Guide
Intensity (cd) at 20 mA
Minimum Typ.ical Maximum Standoff
Part Number
Color
Typical Viewing
Angle (Degree)
Package
Dimension
HLMP-CB18-TW0xx
Blue
15
2.50
3.50
7.20
No
A
HLMP-CB19-TW0xx
Blue
15
2.50
3.50
7.20
Yes
B
HLMP-CM18-X10xx
Green
15
7.20
12.0
21.0
No
A
HLMP-CM19-X10xx
Green
15
7.20
12.0
21.0
Yes
B
HLMP-CE18-WZ0xx
Cyan
15
5.50
11.8
16.0
No
A
HLMP-CE19-WZ0xx
Cyan
15
5.50
11.8
16.0
Yes
B
HLMP-CB28-RU0xx
Blue
23
1.50
2.40
4.20
No
A
HLMP-CB29-RU0xx
Blue
23
1.50
2.40
4.20
Yes
B
HLMP-CM28-WZ0xx
Green
23
5.50
9.30
16.0
No
A
HLMP-CM29-WZ0xx
Green
23
5.50
9.30
16.0
Yes
B
HLMP-CE28-VY0xx
Cyan
23
4.20
7.40
12.0
No
A
HLMP-CE29-VY0xx
Cyan
23
4.20
7.40
12.0
Yes
B
HLMP-CB38-QT0xx
Blue
30
1.15
1.50
3.20
No
A
HLMP-CB39-QT0xx
Blue
30
1.15
1.50
3.20
Yes
B
HLMP-CM38-UX0xx
Green
30
3.20
5.00
9.30
No
A
HLMP-CM39-UX0xx
Green
30
3.20
5.00
9.30
Yes
B
HLMP-CE38-TW0xx
Cyan
30
2.50
3.90
7.20
No
A
HLMP-CE39-TW0xx
Cyan
30
2.50
3.90
7.20
Yes
B
HLMP-CB18-UVAxx
Blue
15
3.20
-
5.50
No
A
HLMP-CB28-STDxx
Blue
23
1.90
-
3.20
No
A
HLMP-CB38-QRAxx
Blue
30
1.15
-
1.90
No
A
HLMP-CB39-RSDxx
Blue
30
1.50
-
2.50
Yes
B
HLMP-CM18-YZCxx
Green
15
9.30
-
16.0
No
A
HLMP-CM28-WXCxx
Green
23
5.50
-
9.30
No
A
HLMP-CM38-UVCxx
Green
30
3.20
-
5.50
No
A
HLMP-CM39-UVCxx
Green
30
3.20
-
5.50
Yes
B
HLMP-CM39-WXDxx
Green
30
5.50
-
9.30
Yes
B
N
. otes:
1. Tolerance for luminous intensity measurement is ±15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety
equipment.
3
Ordering Information
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
DD: Ammo pack
Color Bin Option
0: Full color bin distribution
A: Color bin 1 & 2 only
C: Color bin 3 & 4 only
D: Color bin 4 & 5 only
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Option
18: 15° without standoff
19: 15° with standoff
28: 23° without standoff
29: 23° with standoff
38: 30° without standoff
39: 30° with standoff
Color
B: Blue 470 nm
M: Green 530 nm
E: Cyan 500 nm
Package
C: T-1¾ (5 mm) Round Lamp
Absolute Maximum Ratings at TA = 25oC
Parameter
Value
Unit
30
mA
100
mA
Average Forward Current
30
mA
Power Dissipation
120
mW
LED Junction Temperature
130
oC
Operating Temperature Range
–40 to +85
oC
Storage Temperature Range
–40 to +100
oC
DC Forward Current [1]
Peak Pulsed Forward
Current[2]
Notes:
1. Derate linearly as shown in Figure 3.
2. Duty factor 30%, 1KHz.
4
Electrical Characteristics at TA = 25oC
Blue
Green
Cyan
Min. Typ. Max.
Min. Typ. Max.
Min. Typ. Max. Units Test Condition
Parameters
Symbol
Forward Voltage
VF
3.4
Capacitance
C
Reverse Voltage[2]
3.2 4.0
3.3
53
53
VR
0.6
Thermal
Resistance
RθJ-PIN
240
Dominant
Wavelength[3]
λd
Peak Wavelength
λPEAK
466
523
495
Spectral Half
Width
∆λ1/2
21
30
26
Luminous
Efficacy[4]
ηv
62
588
220
460
4.0
470
480
520
V
IF = 20 mA
53
pF
VF = 0, f = 1 MHz
0.6
0.6
V
IR = 10 µA
240
240
oC/W
LED Junction to
cathode lead
nm
IF = 20 mA
nm
Peak of wavelength
of spectral distribution at IF = 20 mA
530 540
490
500
4.0
510
Wavelength width at
spectral distribution
power point at
IF = 20 mA
lm/W Emitted luminous
power/Emitted
radiant power
Notes:
1. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity.
2. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA.
3. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.
4. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and
ηv is the luminous efficacy in lumens/watt.
1.00
1.5
40
RELATIVE INTENSITY
0.80
GREEN
BLUE
0.60
0.40
0.20
0
350
400
450
500
550
600
650
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
5
1.2
FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
CYAN
0.9
0.6
0.3
0
0
5
10
15
20
25
DC FORWARD CURRENT – mA
Figure 2. Relative luminous intensity vs.
forward current.
30
RθJ-A = 585 ˚C/W
30
RθJ-A = 780 ˚C/W
20
10
0
0
20
40
60
80
AMBIENT TEMPERATURE – C
Figure 3. Forward current vs. ambient
temperature.
100
30
1.020
RELATIVE DOMINANT WAVELENGTH
(NORMALIZED AT 20 mA)
FORWARD CURRENT – mA
CYAN
GREEN
20
10
BLUE
0
0
1.0
2.0
3.0
GREEN
1.015
1.010
CYAN
1.005
1.000
BLUE
0.995
4.0
0
FORWARD VOLTAGE – V
10
20
Figure 4. Forward current vs. forward voltage.
Figure 5. Relative dominant wavelength vs DC forward current.
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
60
90
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Spatial radiation pattern – 15 degree lamps.
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Spatial radiation pattern – 23 degree lamps.
RELATIVE LUMINOUS INTENSITY
1.0
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 8. Spatial radiation pattern – 30 degree lamps.
6
30
DC FORWARD CURRENT – mA
60
90
Intensity Bin Limit Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Bin
Min. Dom
Max. Dom
Xmin.
Ymin.
Xmax.
Ymax.
Bin
Min
Max
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
N
680
880
0.1818
0.0904
0.1374
0.0374
P
880
1150
0.1374
0.0374
0.1699
0.1062
Q
1150
1500
0.1766
0.0966
0.1291
0.0495
R
1500
1900
0.1291
0.0495
0.1616
0.1209
S
1900
2500
0.1699
0.1062
0.1187
0.0671
T
2500
3200
0.1187
0.0671
0.1517
0.1423
U
3200
4200
0.1616
0.1209
0.1063
0.0945
V
4200
5500
0.1063
0.0945
0.1397
0.1728
W
5500
7200
0.1517
0.1423
0.0913
0.1327
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
Tolerance for each bin limit is ± 0.5 nm.
Green Color Bin Table
Bin
Min. Dom
Max. Dom
Xmin.
Ymin.
Xmax.
Ymax.
1
520.0
524.0
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
Tolerance for each bin limit is ± 15%.
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
Tolerance for each bin limit is ± 0.5 nm.
Cyan Color Bin Table
Bin
Min Dom
Max Dom
Xmin.
Ymin.
Xmax.
Ymax.
1
490.0
495.0
0.0454
0.1318
0.2945
0.3060
0.1164
0.0235
0.3889
0.4127
2
495.0
500.0
0.0345
0.1164
0.4127
0.3899
0.1057
0.0082
0.4769
0.5384
3
500.0
505.0
0.0082
0.1057
0.5384
0.4769
0.1207
0.0039
0.5584
0.6548
4
505.0
510.0
0.0039
0.1027
0.6548
0.5584
0.1097
0.0139
0.6251
0.7502
7
498.0
503.0
0.0132
0.1092
0.4882
0.4417
0.1028
0.0040
0.5273
0.6104
8
503.0
508.0
0.0040
0.1028
0.6104
0.5273
0.1056
0.0080
0.6007
0.7153
Tolerance for each bin limit is ± 0.5 nm.
7
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering condition:
• Wave soldering parameter must be set and
maintain according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering
profile to ensure the soldering profile used is
always conforming to recommended soldering
condition.
• If necessary, use fixture to hold the LED
component in proper orientation with respect to
the PCB during soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when
heated. Therefore, the soldered PCB must be
allowed to cool to room temperature, 25°C before
handling.
• Special attention must be given to board
fabrication, solder masking, surface plating and
lead holes size and component orientation to
assure solderability.
• Recommended PC board plated through holes size
for LED component leads.
Manual Solder
Wave Soldering Dipping
Pre-heat temperature 105 °C Max.
−
Preheat time
30 sec Max
−
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
LED component
ead size
Diagonal
Plated through
hole diameter
0.457 x 0.457mm
(0.018 x 0.018inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
0.718 mm
(0.028 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Recommended Wave Soldering Profile
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
200
TEMPERATURE - ˚C
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
150
FLUXING
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
100
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
TIME - SECONDS
8
60
70
80
90
100
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
Obsoletes 5989-0169EN
October 31, 2005
5989-4153EN
9
