HLMP-CM2G-130DD

HLMP-CBxx, HLMP-CMxx T-1¾ (5 mm) InGaN Blue and Green LEDs Data Sheet Description Features This high intensity blue and green LEDs are based on the most efficient and cost effective InGaN material technology. • Viewing angle: 15°, 23° and 30° These LED lamps are untinted and non-diffused T-1¾ packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign application. The epoxy contains uv inhibitor to reduce the effects of long term exposure to direct sunlight. • Well defined spatial radiation pattern • High luminous output • Available in Blue and Green – Blue 470 nm – Green 525 nm • Superior resistance to moisture • Standoff and non-standoff Package Applications • Traffic signs • Variable Message Sign • Commercial outdoor advertising CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN–1142 for additional details. Package Dimensions Drawing A (Non-standoff) 1.00 ± 0.20 0.039 ± 0.008 8.70 ± 0.20 0.343 ± 0.008 0.70 max 0.028 5.00 ± 0.20 0.197 ± 0.008 5.80 ± 0.20 0.228 ± 0.008 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 2.54 ± 0.38 0.100 ± 0.015 31.60 min 1.244 Cathode 1.00 min 0.039 cathode flat Drawing B (Standoff) 8.70 ± 0.20 0.343 ± 0.008 1.00 ± 0.20 0.039 ± 0.008 1.30 ± 0.15 0.051 ± 0.006 0.70 max 0.028 5.00 ± 0.20 0.197 ± 0.008 0.50 ± 0.10 sq. typ. 0.020 ± 0.004 5.80 ± 0.20 0.228 ± 0.008 2.54 ± 0.38 0.100 ± 0.015 Cathode d Part Number Dimension ‘d’ HLMP-Cx1H 12.39 ± 0.25 mm HLMP-Cx2H 12.35 ± 0.25 mm HLMP-Cx3H 11.93 ± 0.25 mm Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.20 mm unless other specified. 3. Leads are mild steel with tin plating. 4. The epoxy meniscus is 1.5 mm max. 2 31.60 min 1.244 1.00 min 0.039 cathode flat Device Selection Guide Luminous Intensity Iv (mcd) at 20 mA [1,2,5] Part Number Color and Dominant Wavelength λd (nm) Typ [3] Min Max Standoff Typical Viewing angle (°) [4] HLMP-CB1G-WY0DD Blue 470 5500 12000 No 15 HLMP-CB1H-WY0DD Blue 470 5500 12000 Yes HLMP-CM1G-350DD Green 525 27000 59000 No HLMP-CM1H-350DD Green 525 27000 59000 Yes HLMP-CB2G-UW0DD Blue 470 3200 7200 No HLMP-CB2H-UW0DD Blue 470 3200 7200 Yes HLMP-CM2G-130DD Green 525 16000 35000 No HLMP-CM2H-130DD Green 525 16000 35000 Yes HLMP-CB3G-TV0DD Blue 470 2500 5500 No HLMP-CB3H-TV0DD Blue 470 2500 5500 Yes HLMP-CM3G-Y10DD Green 525 9300 21000 No HLMP-CM3H-Y10DD Green 525 9300 21000 Yes Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System HLMP – C x xx – x x x xx Packaging Option DD: Ammopack Color Bin Selection 0 : Full Distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Lead Standoff 1G : 15 without standoff 1H : 15 with standoff 2G : 23 without standoff 2H : 23 with standoff 3G : 30 without standoff 3H : 30 with standoff Color B : Blue M : Green Package C: 5 mm Standard Round InGaN 3 23 30 Absolute Maximum Ratings TJ = 25° C Parameter Blue/Green Unit DC Forward Current [1] 30 mA Peak Forward Current 100 [2] mA Power Dissipation 110 mW LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 10%, frequency 1 kHz. Electrical / Optical Characteristics TJ = 25° C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Blue & Green VF 2.8 3.1 3.6 V IF = 20 mA Reverse Voltage [3] Blue & Green VR 5 V IR = 10 μA Dominant Wavelength [1] Blue Green ld nm IF = 20 mA Peak Wavelength Blue Green lPEAK nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Thermal resistance RqJ-PIN °C/W LED junction to pin Luminous Efficacy [2] ηv lm/W Emitted Luminous Power/ Emitted Radiant Power nm/°C IF = 20 mA; +25° C ≤ TJ ≤ +100° C Blue Green Thermal coefficient of ld Blue Green 460 520 470 525 461 517 240 68 475 0.02 0.03 480 540 Notes: 1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/ watt. 3. Indicates product final testing condition, long term reverse bias is not recommended. 4 25 Blue Green FORWARD CURRENT - mA RELATIVE INTENSITY 30 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 WAVELENGTH - nm Figure 1. Relative Intensity vs Wavelength 580 630 1.2 1 0.8 0.6 0.4 0.2 0 10 15 20 DC FORWARD CURRENT - mA Figure 3. Relative Intensity vs Forward Current 5 25 30 10 8 6 Green 4 2 Blue 0 -2 -4 0 5 30 5 0 1 3 4 35 30 25 20 15 10 5 0 40 60 80 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum Forward Current vs Ambient Temperature 12 10 15 20 25 FORWARD CURRENT - mA Figure 5. Relative Dominant Wavelength Shift vs Forward Current 5 35 10 2 FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage NORMALIZED INTENSITY RELATIVE DOMINANT WAVELENGTH - nm 0 15 0 IFMAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 20 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 -90 20 -60 100 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 6. Representative Radiation pattern for 15° Viewing Angle Lamp NORMALIZED INTENSITY NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 7. Representative Radiation pattern for 23° Viewing Angle Lamp FORWARD VOLTAGE SHIFT - V RELATIVE LIGHT OUTPUT (NORMALZIED @ TJ = 25° C) -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 0.3 BLUE GREEN 1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 9. Relative Light Output vs Junction Temperature 6 -90 Figure 8. Representative Radiation pattern for 30° Viewing Angle Lamp 10 0.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 120 BLUE GREEN 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 10. Forward Voltage Shift vs Junction Temperature 100 120 Intensity Bin Limit Table (1.3 : 1 Iv Bin Ratio) Blue Color Bin Table Intensity (mcd) at 20 mA Bin Min Max Min Bin Dom T 2500 3200 1 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 2 21000 27000 3 27000 35000 4 35000 45000 5 45000 59000 460.0 Max Dom Xmin Ymin Xmax Ymax 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 2 464.0 468.0 3 468.0 472.0 4 472.0 5 476.0 476.0 480.0 Tolerance for each bin limit is ± 0.5 nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Tolerance for each bin limit is ± 15% Green Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 2 3 4 5 524.0 528.0 532.0 536.0 528.0 532.0 536.0 540.0 Tolerance for each bin limit is ± 0.5 nm. Avago Color Bin on CIE 1931 Chromaticity Diagram 0.9 0.8 Green 1 0.7 2 4 5 0.6 0.5 0.4 0.3 0.2 Blue 5 0.1 4 2 0 0 7 3 0.05 0.1 3 1 0.15 0.2 0.25 0.3 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. Avago Technologies LED Configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. • ESD precaution must be properly applied on the 1.59 mm soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105° C Max. – Preheat time 60 sec Max – Peak temperature 260° C Max. 260° C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 8 Cathode InGaN device • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018 x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020 x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35 ± 1.30 0.250 ± 0.051 12.70 ± 1.00 0.500 ± 0.039 CATHODE 20.5 ± 1.00 0.8070 ± 0.0394 9.125 ± 0.625 0.3595 ± 0.0245 18.00 ± 0.50 0.7085 ± 0.0195 12.70 ± 0.30 0.500 ± 0.012 0.70 ± 0.20 0.0275 ± 0.0075 A A VIEW AA Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 9 4.00 ± 0.20 Ø 0.1575 ± 0.0075 TYP. Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 10 Lamps Baby Label RoHS Compliant e3 max temp 260C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Tech nologies, and the A logo are trademarks of Avago Tech nologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Tech nologies. All rights reserved. AV02-3140EN - August 22, 2014