HLMP-CW16-R00XX

HLMP-CWxx T-13/4 Precision Optical Performance White LED Lamps Data Sheet HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24, HLMP-CW30, HLMP-CW31, HLMP-CW70, HLMP-CW72 Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram. These T-13⁄4 lamps are untinted, nondiffused, and incorporate precise optics producing well defined spatial radiation patterns at specific viewing cone angle. Features • Highly luminous white emission • 15°, 23°, 30°, and 70° viewing angle Applications • • • • Electronic signs and signals Small area illumination Legend backlighting General purpose indicators Benefit • Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources CAUTION: These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Device Selection Guide Viewing Angle Typ. 15° 15° 15° 15° 15° 15° 15° 15° 15° 15° 15° 23° 23° 23° 23° 23° 30° 30° 30° 30° 30° 30° 30° 70º 70º 70º Min. Luminous Intensity Iv (mcd) @ 20 mA Min. Max. 2500 7200 2500 7200 3200 5500 4200 7200 4200 12000 4200 12000 4200 12000 4200 12000 1500 2500 7200 4200 12000 1900 1900 2500 1900 2500 880 1500 1900 1900 520 880 1900 400 400 400 5500 5500 7200 5500 7200 2500 4200 3200 5500 2500 5500 680 1150 1150 Part Number HLMP-CW15-TW0xx HLMP-CW15-TW0xx HLMP-CW15-UV0xx HLMP-CW15-VWBxx HLMP-CW15-VY0xx HLMP-CW15-VYBxx HLMP-CW15-VYGxx HLMP-CW15-VYKxx HLMP-CW16-R00xx HLMP-CW16-TW0xx HLMP-CW16-VY0xx HLMP-CW23-SV0xx HLMP-CW23-SVKxx HLMP-CW23-TW0xx HLMP-CW24-SV0xx HLMP-CW24-TW0xx HLMP-CW30-PS0xx HLMP-CW30-RU0xx HLMP-CW30-STBxx HLMP-CW30-SV0xx HLMP-CW31-M00xx HLMP-CW31-PS0xx HLMP-CW31-SV0xx HLMP-CW70-LMBxx HLMP-CW70-LP0xx HLMP-CW72-LP0xx Standoff Leads No No No No No No No No Yes Yes Yes No No No Yes Yes No No No No Yes Yes Yes No No Yes Package Dimension A A A A A A A A B B B A A A B B A A A A B B B A A B Tolerance for each intensity limit is ±15%. 2 Package Dimensions 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) d 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 1.00 MIN. (0.039) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) PACKAGE DIMENSION A PACKAGE DIMENSION B NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. HLMP-CW24 HLMP-CW72 HLMP-CW16 HLMP-CW31 d = 12.6 ± 0.25 d = 12.52 ± 0.25 d = 11.96 ± 0.25 d = 12.52 ± 0.25 (0.496 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) (0.493 ± 0.010) 3 Part Numbering System HLMP – CWxx - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack Color Bin Option 0: Full color bin distribution B: Color bins 2 & 3 G: Color bins 2, 3 & 4 K: Color bins 2 & 4 Maximum Intensity Bin Limit 0: No maximum intensity bin limit Others: Refer to Device Selection Guide Minimum Intensity Bin Limit Refer to Device Selection Guide Viewing Angle and Standoff Option 15: 15°without standoffs 16: 15°with standoffs 23: 23°without standoffs 24: 23°with standoffs 30: 30°without standoffs 31: 30°with standoffs 70: 50° without standoffs 72: 50° with standoffs 4 Absolute Maximum Ratings TA = 2 5 ˚ C Parameter DC Forward Current[1] Peak Forward Current[2] Power Dissipation Reverse Voltage (IR = 10 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10%, 1 kHz. Value 30 100 111 5 110 –40 to +80 –40 to +100 Units mA mA mW V oC oC oC Electrical Characteristics TA = 25°C Forward Voltage, VF (V) @ IF = 20 mA Typ. Max. 3.2 3.7 Reverse Breakdown, VR (V) @ IR = 10 µA Min. 5 Capacitance, C (pF), VF = 0, f = 1 MHz Typ. 70 Thermal Resistance RθJ-PIN (°C/W) Typ. 240 Optical Characteristics TA = 25°C Typical Chromaticity Coordinates[1] X Y 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 Viewing Angle 2θ1/2 Degrees[2] Typ. 30 23 15 50 Part Number HLMP-CW3x-xxxxx HLMP-CW2x-xxxxx HLMP-CW1x-xxxxx HLMP-CW7x-xxxxx Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1⁄2 the peak intensity. 5 1.0 35 1.5 RELATIVE LUMINOUS INTENSITY 0.8 FORWARD CURRENT – mA 30 25 20 15 10 5 0 0 1 2 3 4 RELATIVE LUMINOUS INTENSITY 1.2 0.6 0.9 0.4 0.6 0.2 0.3 0 380 480 580 680 780 0 0 10 20 30 WAVELENGTH – nm FORWARD VOLTAGE – V FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength Figure 2. Forward current vs. forward voltage Figure 3. Relative lv vs. forward current IF MAX. – MAXIMUM FORWARD CURRENT – mA 0.025 0.020 Y-COORDINATES 1 mA 5 mA 10 mA 15 mA 20 mA 25 mA 35 30 25 20 15 10 5 0 0 20 40 60 80 100 0.015 0.010 0.005 0 -0.005 30 mA -0.010 -0.004 -0.002 0 0.002 0.004 X-COORDINATES (X,Y) VALUES @ 20 mA REFERENCE TO (0,0) TA – AMBIENT TEMPERATURE – °C Figure 4. Chromaticity shift vs. current Figure 5. Maximum forward current vs. temperature 1 RELATIVE INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6a. CW1x spatial radiation pattern 6 1 RELATIVE LUMINOUS INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6b. CW2x spatial radiation pattern 1 RELATIVE LUMINOUS INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6c. CW3x spatial radiation pattern 1 RELATIVE LUMINOUS INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6c. CW7x spatial radiation pattern 7 Intensity Bin Limits (mcd at 20 mA) Bin L M N P Q R S T U V W X Y Z Min. 400 520 680 880 1150 1500 1900 2500 3200 4200 5500 7200 9300 12000 Max. 520 680 880 1150 1500 1900 2500 3200 4200 5500 7200 9300 12000 16000 Color Bin Limit Table Rank 1 2 3 4 Limits (Chromaticity Coordinates) x y x y x y x y 0.330 0.360 0.287 0.295 0.264 0.267 0.283 0.305 0.330 0.318 0.296 0.276 0.280 0.248 0.287 0.295 0.356 0.351 0.330 0.318 0.296 0.276 0.330 0.339 0.361 0.385 0.330 0.339 0.283 0.305 0.330 0.360 Tolerance for each bin limit is ± 0.01. Note: Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for information on currently available bins. Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 Tolerance for each bin limit is ± 15%. Y-COORDINATE 0.35 4 2 1 BLACK BODY CURVE 0.30 3 0.25 0.20 0.26 0.30 0.34 0.38 X-COORDINATE Relative Light Output vs. Junction Temperature 1.4 RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 1.2 1.0 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 100 120 TJ – JUNCTION TEMPERATURE – °C 8 Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced into the LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration CATHODE Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED closer than 1.59 mm might damage the LED. 1.59 mm InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. Manual Solder Dipping – – 260 °C Max. 5 sec Max. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) • Recommended soldering conditions: Wave Soldering Pre-heat Temperature 105 °C Max. Pre-heat Time 30 sec Max. Peak Temperature 250 °C Max. Dwell Time 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. Notes: 1. PCB with different size and design (component density) will have different head mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: Refer to Application Note AN1027 for more information on soldering LED components. 9 Recommended Wave Soldering Profile TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE 200 TEMPERATURE – °C TOP SIDE OF PC BOARD BOTTOM SIDE OF PC BOARD 150 FLUXING 100 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 LEAD SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 40 50 TIME – SECONDS 60 70 80 90 100 50 30 PREHEAT 0 10 20 30 Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES). A VIEW A–A A ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) 10 Packaging Box Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + AN OD E TE ANODE LEAD LEAVES THE BOX FIRST. O AG ES AV LOGI DE NO HO – CH AT C C L BE LA ER TH MO Note: For InGaN device, the ammo pack packaging box contains ESD logo. DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4125EN AV02-0214EN April 2, 2007