HLMP-CW16-VY000

Agilent HLMP-CWxx T-13/4 Precision Optical Performance White LED Lamps Data Sheet Features • Highly luminous white emission • 15°, 23°, and 30° viewing angle HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24, HLMP-CW30, HLMP-CW31 Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram. These T-13⁄4 lamps are untinted, nondiffused, and incorporate precise optics producing well defined spatial radiation patterns at specific viewing cone angle. Applications • Electronic signs and signals • Small area illumination • Legend backlighting • General purpose indicators Benefit • Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources CAUTION: These devices are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. Device Selection Guide Part Number HLMP-CW15-TW0xx HLMP-CW15-VY0xx HLMP-CW16-TW0xx HLMP-CW16-VY0xx HLMP-CW23-SV0xx HLMP-CW23-TW0xx HLMP-CW24-SV0xx HLMP-CW24-TW0xx HLMP-CW30-PS0xx HLMP-CW30-SV0xx HLMP-CW31-PS0xx Viewing Angle Typ. 15° 15° 15° 15° 23° 23° 23° 23° 30° 30° 30° Min. Luminous Intensity Iv (mcd) @ 20 mA Min. Max. 2500 7200 4200 12000 2500 7200 4200 12000 1900 5500 2500 7200 1900 5500 2500 7200 880 2500 1900 5500 880 2500 Standoff Leads No No Yes Yes No No Yes Yes No No Yes Package Dimension A A B B A A B B A A B HLMP-CW31-SV0xx 30° 1900 Yes B Tolerance for each intensity limit is ± 15%. 2 5500 Package Dimensions 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) d 8.71 ± 0.20 (0.343 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 1.00 MIN. (0.039) 1.00 MIN. (0.039) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 2.54 ± 0.38 (0.100 ± 0.015) PACKAGE DIMENSION B PACKAGE DIMENSION A NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. HLMP-CW24 HLMP-CW16 HLMP-CW31 d = 12.6 ± 0.25 d = 12.52 ± 0.25 d = 11.96 ± 0.25 (0.496 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) Part Numbering System HLMP – CWxx - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack Color Bin Option 0: Full color bin distribution Maximum Intensity Bin Limit 0: No maximum intensity bin limit Minimum Intensity Bin Limit Refer to Device Selection Guide Viewing Angle and Standoff Option 15: 15° without standoffs 16: 15° with standoffs 23: 23° without standoffs 24: 23° with standoffs 30: 30° without standoffs 31: 30° with standoffs 3 1.50 ± 0.15 (0.059 ± 0.006) Absolute Maximum Ratings TA = 25˚C Parameter Value Units DC Forward Current[1] 30 mA Peak Forward Current[2] 100 mA Power Dissipation 120 mW Reverse Voltage (IR = 10 µA) 5 V LED Junction Temperature 110 oC Operating Temperature Range –40 to +80 oC Storage Temperature Range –40 to +100 oC Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10%, 1 kHz. Electrical Characteristics TA = 25°C Forward Voltage, VF (V) @ IF = 20 mA Typ. Max. 3.6 4.0 Reverse Breakdown, VR (V) @ IR = 10 µA Min. 5 Capacitance, C (pF), VF = 0, f = 1 MHz Typ. 70 Thermal Resistance RqJ-PIN (°C/W) Typ. 240 Optical Characteristics TA = 25°C Part Number HLMP-CW3x-xxxxx HLMP-CW2x-xxxxx HLMP-CW1x-xxxxx Typical Chromaticity Coordinates[1] X Y 0.32 0.32 0.32 0.32 0.32 0.32 Viewing Angle 2θ1/2 Degrees[2] Typ. 30 23 15 Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1⁄2 the peak intensity. 4 1.5 0.8 0.6 0.4 0.2 0 380 480 580 780 680 RELATIVE LUMINOUS INTENSITY 30 IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY 1.0 25 20 15 10 5 0 2.4 2 3.6 0.9 0.6 0.3 0 4.0 VF – FORWARD VOLTAGE – V WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. 10 0 Figure 3. Relative lv vs. forward current. MAX. FORWARD CURRENT – mA 30 0.020 1 mA 0.015 5 mA 0.010 10 mA 15 mA 0.005 20 mA 0 25 mA -0.005 30 mA -0.010 -0.004 -0.002 0 0.002 RΘJ-A = 585 °C/W 25 20 RΘJ-A = 780 °C/W 15 10 5 0 0.004 0 X-COORDINATES 20 40 60 80 100 AMBIENT TEMPERATURE – °C (X,Y) VALUES @ 20 mA REFERENCE TO (0,0) Figure 4. Chromaticity shift vs. current. Figure 5. Maximum forward current vs. temperature. RELATIVE INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 6a. CW1x spatial radiation pattern. 5 60 90 20 FORWARD CURRENT – mA Figure 2. Forward current vs. forward voltage. 0.025 Y-COORDINATES 3.2 2.8 1.2 30 RELATIVE LUMINOUS INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Intensity Bin Limits (mcd at 20 mA) Figure 6b. CW2x spatial radiation pattern. RELATIVE LUMINOUS INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6c. CW3x spatial radiation pattern. Bin Min. Max. M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 Tolerance for each bin limit is ± 15%. Color Bin Limit Table Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram Limits (Chromaticity Coordinates) 1 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 0.40 2 x y 0.287 0.295 0.296 0.276 0.330 0.318 0.330 0.339 0.35 3 x y 0.264 0.267 0.280 0.248 0.296 0.276 0.283 0.305 4 x y 0.283 0.305 0.287 0.295 0.330 0.339 0.330 0.360 Tolerance for each bin limit is ± 0.01. Y-COORDINATE Rank 4 1 BLACK BODY CURVE 2 0.30 3 0.25 0.20 0.26 0.30 0.34 X-COORDINATE Note: Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available bins. 6 0.38 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 7. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 7 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5989-2806EN October 20, 2005 5989-4125EN