HLMP-CW29-TW0DD

Agilent HLMP-CW18, HLMP-CW19, HLMP-CW28, HLMP-CW29, HLMP-CW38, HLMP-CW39 T-1 3/4 Precision Optical Performance White LED Data Sheet Description These Super Bright Precision Optical Performance LED lamps are based on flip chip InGaN material, which is the brightest and most efficient technology for LEDs. A blue LED die is coated by a phosphor to produce white. Package Dimension A These T- 1 3/4 lamps incorporate precise optics producing well- defined spatial radiation patterns at specific viewing cone angle. Features • Highly Luminous White Emission • 15 o, 23 o, and 30o viewing angle • New InGaN flip chip die technology with protective diode. Benefit • ESD class 3 • Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light Sources Applications • Electronic Signs and Signals • Small Area Illumination • Legend Backlighting • General Purpose Indicators 2.35 max .093 1.14±0.20 .045±.008 ø5.80±0.20 .228±.008 0.50±0.10 sq. typ. .020±.004 0.70 max .028 5.00±0.20 note#1 .197±.008 2.54±0.38 .100±.015 cathode lead 8.71±0.20 .343±.008 1.00 min .039 cathode flat 31.60 min 1.244 Package Dimension B 1.14±0.20 .045±.008 8.71±0.20 .343±.008 NOTES: 1. MEASURED JUST ABOVE FLANGE. 1.50±0.15 .059±.006 0.70 max .028 ø5.80±0.20 .228±.008 0.50±0.10 sq. typ. .020±.004 2.54±0.38 .100±.015 5.00±0.20 note#1 .197±.008 cathode lead Dimension H Refer to Table1 1.00 min .039 31.60 min 1.244 Dimension H: Notes : 23 & 30 Degree = 12.67 +/- 0.25 mm (0.499 +/- 0.01 inch) 1. All dimensions are in milimetres /inches. 15 Degree 2. Epoxy meniscus may extend about 1mm (0.040”) down the leads. = 12.93 +/- 0.25 mm (0.509 +/- 0.01 inch) cathode flat Device Selection Guide Iv (cd) @ 20mA Part Number Typ. Viewing Angle Min. Typ. Standoff Leads Package Dimension HLMP-CW18-VY0xx 15° 4.20 6.40 No A HLMP-CW19-VY0xx 15° 4.20 6.40 Yes B HLMP-CW28-TW0xx 23° 2.50 3.80 No A HLMP-CW29-TW0xx 23° 2.50 3.80 Yes B HLMP-CW38-SV0xx 30° 1.90 3.00 No A HLMP-CW39-SV0xx 30° 1.90 3.00 Yes B Notes: 1. Tolerance for luminous intensity measurement is +/- 15% 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED with unprotected eyes. Part Numbering System L M P - C W XX - X X X XX Mechanical Option 00: Bulk DD: Ammo Pack Color Bin Options 0: Full color bin distribution Maximum Intensity Bin Limit 0: No maximum intensity bin limit Minimum Intensity Bin Limit Refer to Device Selection Guide Viewing Angle 18: 15 without standoffs 19: 15˚ with standoffs 28: 23˚ without standoffs 29: 23˚ with standoffs 38: 30 ˚ without standoffs 39: 30 ˚ with standoffs Color Options W: White Package Options C: T-1 3/4 2 Absolute Maximum Ratings (TA = 25°C) Parameter Value Units DC Forward Current [1] 30 mA Peak Forward Current [2] 100 mA Average Forward Current 30 mA Power Dissipation 120 mW LED Junction Temperature 130 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, 1 KHz Electrical/Optical Characteristics (TA = 25oC) Parameters Symbol Maximum Units Test Condition Forward voltage VF 3.4 4.0 V IF = 20 mA Capacitance C 53 pF VF=0, f=1 MHz Reverse Voltage [1] VR 0.6 V IR = 10 mA Thermal resistance RqJ-PIN 240 o LED Junction to cathode lead Viewing Angle [2] CW18/CW19 CW28/CW29 CW38/CW39 2q1/2 Chromaticity Coordinate [3] X Y Minimum Typical C/W Degree IF = 20 mA 15 23 30 0.31 0.32 IF = 20 mA Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 m 2. 2q1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity 3. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 4. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 3 1.0 30 Forward Current (mA) Relative Intensity 0 .8 0 .6 0 .4 0 .2 0 .0 380 20 10 0 480 58 0 680 0 78 0 1 Wavelength (nm ) 35 30 1.2 Maximum Forward Current (mA) Relative Luminous Intensity 4 Figure 2. Forward Current vs Forward Voltage 1.5 0.9 0.6 0.3 0.0 0 10 20 RΘJ-A = 780˚ C/W 15 10 5 0 20 40 60 Figure 4. Maximum Fwd Current vs Temperature 0.34 1 mA 5 mA 10 mA 20 mA 30 mA 0.30 0.305 20 Am bient Tem perature (C) Figure 3. Relative Iv vs. Forward Current 0.32 RΘJ-A = 585˚ C/W 25 0 30 DC Forw ard Current (m A) Y Coordinate 3 Forw ard Voltage (V) Figure 1. Relative Intensity vs Wavelength 0.310 0.315 X Coordinate Figure 5. Chromaticity Coordinates Changes over Forward Current 4 2 0.320 80 10 0 Relative Luminous Intensity Relative Intensity 1.0 0.5 -90 -70 -50 -30 0.0 -10 10 30 50 70 1.0 0.8 0.6 0.4 0.2 0.0 -90 90 -60 -30 0 30 60 90 Angular Displacem ent Angular Displacem ent (Degree) Figure 6a. CW1x Spatial Radiation Pattern Figure 6b. CW2x Spatial Radiation Pattern Relative Luminous Intensity 1.0 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 90 Angular Displacem ent Figure 6c. CW3x Spatial Radiation Pattern 5 Intensity Bin Limit Table Color Bin Limit Tables Intensity (mcd) at 20 mA Bin Min Max S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Tolerance for each bin limit is ± 15% Limits (Chromaticity Coordinates) Rank 1 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 2 x y 0.287 0. 295 0.296 0.276 0.330 0.318 0.330 0.339 3 x y 0.264 0.267 0.280 0.248 0.296 0.276 0.283 0.305 4 x y 0.283 0.305 0.287 0.295 0.330 0.339 0.330 0.360 Tolerance for each bin limit is ±0.01 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 0.35 1 Y-coordinate 4 2 0.30 Black Body Curve 3 0.25 0.20 0.26 0.3 0.34 X-coordinate 6 0.38 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended PC board plated through holes • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. − Preheat time 30 sec Max − Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - ˚C BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 60 70 80 90 100 TIME - SECONDS 7 www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. Data subject to change. Copyright 2005 Agilent Technologies, Inc. October 27, 2005 Obsoletes 5989-0461EN 5989-4155EN