HLMP-CW36-UX000

Agilent HLMP-CWxx T-1 ¾ (5mm) Extra Bright Precision Optical Performance White LED Lamps Data Sheet Features • Well defined spatial radiation pattern HLMP-CW11, HLMP-CW12, HLMP-CW26, HLMP-CW27, HLMP-CW36, HLMP-CW37 • Viewing angle: 15°°, 23°° and 30°° • Standoff or non-standoff leads • Superior resistance to moisture Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x = 0.31, y = 0.31 using the 1931 CIE Chromaticity Diagram. • High luminous white emission These T-1 ¾ lamps are untinted, non-diffused, and incorporate precise optics which produce well-defined spatial radiation patterns at specific viewing cone angle. Applications • Electronic signs and signals • Small area illumination • Legend backlighting • General purpose indicators Benefit • Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources. Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Package Dimension A Package Dimension B 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) DIMENSION H 8.71 ± 0.20 (0.343 ± 0.008) 2.35 (0.093) MAX. 1.14 ± 0.20 (0.045 ± 0.008) 0.70 (0.028) MAX. 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) DIMENSION H: 15°: 12.24 ± 0.25mm (0.482 ± 0.01 inches) 23°: 12.50 ± 0.25mm (0.492 ± 0.01 inches) 30°: 12.00 ± 0.25mm (0.472 ± 0.01 inches) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) Part Numbering System H L M P - CW XX - X X X XX Mechanical Option 00: Bulk DD: Ammo Pack Straight Leads Color Bin Options 0: Full color bin distribution B: Color bin 2 & 3 only Maximum Intensity Bin 0: No maximum intensity bin limit Others: Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Standoff Option 11: 15˚ without standoff 12: 15˚ with standoff 26: 23˚ without standoff 27: 23˚ with standoff 36: 30˚ without standoff 37: 30˚ with standoff 2 Notes: 1. All dimensions are in millimeters /inches. 2. Epoxy meniscus may extend about 1mm (0.040") down the leads. 3. If heat-sinking application is required, the terminal for heat sink is anode. Device Selection Guide Part Number Typical Viewing Angle, 2θ ½ (Degree) Min. Max. Standoff Package Dimension HLMP-CW11-WZ0xx 15 5500 16000 No A HLMP-CW11-X10xx 15 7200 21000 No A HLMP-CW11-XY0xx 15 7200 12000 No A HLMP-CW11-YZ0xx 15 9300 16000 No A HLMP-CW12-WZ0xx 15 5500 16000 Yes B HLMP-CW12-X10xx 15 7200 21000 Yes B HLMP-CW12-XY0xx 15 7200 12000 Yes B HLMP-CW12-XYBxx 15 7200 12000 Yes B HLMP-CW12-YZ0xx 15 9300 16000 Yes B HLMP-CW12-YZBxx 15 9300 16000 Yes B HLMP-CW26-UX0xx 23 3200 9300 No A HLMP-CW26-VW0xx 23 4200 7200 No A HLMP-CW26-VY0xx 23 4200 12000 No A HLMP-CW26-WX0xx 23 5500 9300 No A HLMP-CW27-UX0xx 23 3200 9300 Yes B HLMP-CW27-UX2xx 23 3200 9300 Yes B HLMP-CW27-VW0xx 23 4200 7200 Yes B HLMP-CW27-VY0xx 23 4200 12000 Yes B HLMP-CW27-WX0xx 23 5500 9300 Yes B HLMP-CW36-TW0xx 30 2500 7200 No A HLMP-CW36-UV0xx 30 3200 5500 No A HLMP-CW36-UVBxx 30 3200 5500 No A HLMP-CW36-VW0xx 30 4200 7200 No A HLMP-CW36-VWBxx 30 4200 7200 No A HLMP-CW37-TW0xx 30 2500 7200 Yes B HLMP-CW37-UV0xx 30 3200 5500 Yes B HLMP-CW37-UVBxx 30 3200 5500 Yes B HLMP-CW37-VW0xx 30 4200 7200 Yes B HLMP-CW37-VWBxx 30 4200 7200 Yes B Intensity (mcd) at 20 mA Notes: 1. Tolerance for luminous intensity measurement is +/- 15% 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. 5. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity. 6. Part numbers in BOLD are recommended for new designs. 3 Absolute Maximum Rating at TA = 25oC Parameters Value Unit 30 mA 100 mA Power dissipation 105 mW LED junction temperature 110 o C -40 to +85 o C -40 to +100 o C DC forward current [1] Peak pulsed forward current [2] Operating temperature range Storage temperature range Notes: 1. Derate linearly as shown in figure 2. 2. Duty factor 10%, frequency 1KHz Electrical/Optical Characteristics TA = 25oC Parameters Symbol Forward voltage Reverse Voltage Min VF [1] VR Thermal resistance Chromaticity Coordinates [2] Capacitance Typ Max Units Test Condition 3.2 4.0 V IF = 20 mA V IR = 10 µA o LED Junction to anode lead 5.0 RθJ-PIN 240 X Y 0.31 0.31 IF = 20 mA C 70 VF=0, f=1MHz C/W Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA 2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 35 0.8 0.6 0.4 0.2 0.0 380 480 580 680 WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength 780 1.5 30 RθJ-A = 585˚C/W 25 RθJ-A = 780˚C/W 20 15 10 5 0 0 100 20 40 60 80 AMBIENT TEMPERATURE - ˚C Figure 2. Forward Current vs. Ambient Temperature RELATIVE LUMINOUS INTENSITY IF - FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY 1.0 1.2 0.9 0.6 0.3 0 0 10 20 FORWARD CURRENT - mA Figure 3. Relative Intensity versus DC Forward Current 30 RELATIVE LUMINOUS INTENSITY 0.025 1mA 0.020 Y-COORDINATES 0.015 5mA 0.010 10mA 0.005 0.000 20mA -0.005 -0.010 -0.005 30mA 0.000 0.005 0.010 0.5 0 -90 0.015 X-COORDINATES Figure 4. Chromaticity shift vs. Current 1 -60 -30 0 30 ANGULAR DISPLACEMENT (˚) 60 90 Figure 6. Spatial Radiation Pattern for CW1x *Note: (x,y) values @ 20mA reference to (0,0) 1 25 20 15 10 5 0 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 RELATIVE LUMINOUS INTENSITY IF - FORWARD CURRENT - mA 30 0.5 0 -90 -60 VF - FORWARD VOLTAGE - VOLTS 60 90 Figure 7. Spatial Radiation Pattern for CW2x 1 RELATIVE LUMINOUS INTENSITY Figure 5. Forward Current vs. Forward Voltage -30 0 30 ANGULAR DISPLACEMENT (˚) 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT (˚) Figure 8. Spatial Radiation Pattern for CW3x 60 90 Intensity Bin Limit Table Color Bin Limit Table Intensity (mcd) at 20 mA Rank Limits (Chromaticity Coordinates) Min Max 1 X 0.330 0.330 0.356 0.361 Q 1150 1500 Y 0.360 0.318 0.351 0.385 R 1500 1900 X 0.287 0.296 0.330 0.330 S 1900 2500 Y 0.295 0.276 0.318 0.339 T 2500 3200 X 0.264 0.280 0.296 0.283 U 3200 4200 Y 0.267 0.248 0.276 0.305 V 4200 5500 X 0.283 0.287 0.330 0.330 W 5500 7200 Y 0.305 0.295 0.339 0.360 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 Bin Tolerance for each bin limit is ± 15% 2 3 4 Tolerance for each bin limit is ± 0.01 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available bins. Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 Y-COORDINATE 0.35 4 1 2 0.30 BLACK BODY CURVE 3 0.25 0.20 0.26 6 0.30 0.34 X-COORDINATE 0.38 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering condition: • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. Manual Solder Wave Soldering Dipping − Pre-heat temperature 105 °C Max. Preheat time 30 sec Max − Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - ˚C BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 TIME - SECONDS 7 60 70 80 90 100 www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004-2005 Agilent Technologies, Inc. Obsoletes 5989-3733EN October 20, 2005 5989-4117EN